Selective laser sintering forming method

A laser sintering molding, selective technology, applied in the direction of improving process efficiency, improving energy efficiency, etc., can solve the problem of weak strength of model products, shorten the production cycle and operating costs, good physical properties, and warp deformation. small effect

Inactive Publication Date: 2013-07-10
余振新
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Moreover, the strength of the model product is very weak, and it needs to be reinforced with wax or resin according to the requirements of use.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] A selective laser sintering molding method, comprising the following steps:

[0018] (1) Prepare powder materials for selective laser sintering molding method;

[0019] The powder material used in the selective laser sintering molding method includes a mixture of nylon polymer powder, PC polymer powder and siliceous salt powder, and the volume ratio of the nylon polymer, PC polymer and siliceous salt is 1: 1:1. Of course, in order to enhance the hardness of the model product, low-melting-point metal powders such as aluminum, tin, or modified products of low-melting-point metal powders, or Si\Fe\Cu-based modified products can be added as needed. The wire diameter of the powder material used in the selective laser sintering molding method is 100 μm.

[0020] (2) Use ProE drawing software to build a three-dimensional model of the dragon, and set the length, width, and height to 200mm, 60mm, and 100mm, respectively. The file is stored in .stl format, and the .stl file is...

example 1

[0022] The parameters of the molding machine include scanning speed, laser power, scanning density, scanning layer height, and scanning mode. The initialization parameters are scanning speed 2700mm / s, laser power 7.2w, scanning density 0.10mm, scanning layer height 0.2mm, scanning mode 90°, The size ratio is 1:1.

[0023] (4) The forming machine performs laser scanning, and the laser beam scans the powder material on the workbench along the laser scanning path of the level. When a layer of powder material is sintered, the workbench of the forming machine is lowered by one layer, and then a new layer is laid The powder material is sintered;

[0024] Using stable radio frequency pulse CO 2 Laser, using CO with a wavelength of 10.6nm 2 Pulse high-energy laser, through the optical path guidance system, the high-energy pulse laser beam is vertically incident from above and focused on the forming table. According to the information in the .plt file, the laser is controlled to sca...

Embodiment 2

[0028] (1) Prepare powder materials for selective laser sintering molding method;

[0029] The powder material used in the selective laser sintering molding method includes a mixture made by mixing nylon polymer powder, PC polymer powder and siliceous salt powder, and the mass ratio of the nylon polymer, PC polymer and siliceous salt is 1: 1:1. Of course, in order to enhance the hardness of the model product, low-melting-point metal powders such as aluminum, tin, or modified products of low-melting-point metal powders, or Si\Fe\Cu-based modified products can be added as needed. The wire diameter of the powder material used in the selective laser sintering molding method is 100 μm.

[0030] (2) Use ProE drawing software to build a three-dimensional model with complex internal structure, layer rotation and display the raised character "PHD" on the surface, and set the length, width and height to 90mm, 40mm and 105mm respectively. The file is stored in .stl format, and the .stl...

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Abstract

The invention relates to a selective laser sintering forming method and a powder material applied to the same. The selective laser sintering forming method comprises the following steps of: (1) preparing the powder material used for the selective laser sintering forming method; (2) drawing the three-dimensional outline of a model to be prepared by using three-dimensional cartographic software, inputting into a laser sintering forming machine, and carrying out layered calculation on the three-dimensional outline according to set layer thickness through the control software of the laser sintering forming machine to obtain multilayer sectional vectograph information and each sectional laser scanning path; (3) initializing the parameters of the laser sintering forming machine according to the model; (4) carrying out laser scanning through the laser sintering forming machine, and paving a new layer of powder materials after one layer of powder materials are completely sintered for sintering; and (5) repeating step (4) till a last layer of powder materials is completely sintered. The selective laser sintering forming method disclosed by the invention has the advantages of sintering at normal temperature, shortened production period and good physical characteristic and low buckling deformation degree of the formed model.

Description

technical field [0001] The invention relates to a rapid prototyping method, in particular to a selective laser sintering prototyping method. Background technique [0002] In recent years, important industrial countries in the world have vigorously developed rapid prototyping technology, and the important technologies that have emerged include: stereolithography (SLA), selective laser sintering (SLS), laminated solid manufacturing (LOM), fused deposition rapid prototyping Technology, three-dimensional spray bonding technology (3DP), photomask method, ballistic particle manufacturing, etc. Selective Laser Sintering (SLS) rapid prototyping technology, also known as selective laser sintering technology, uses low-melting point metal or non-metal powder materials to sinter under laser irradiation, and builds layers under computer control. The whole technical process includes: establishment of CAD model and data processing, multiple cycles of powder spreading and laser scanning si...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F3/105
CPCY02P10/25
Inventor 余振新
Owner 余振新
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