Electronic device adopting magnetron sputtering to plate film, and manufacturing method thereof

Abstract

The invention discloses an electronic device adopting magnetron sputtering to plate a film, and a manufacturing method thereof. The manufacturing method comprises: placing a clean substrate in a vacuum container, carrying out vacuum pumping to achieve 10<-4> Pa, introducing high-purity argon gas to achieve 0.5 Pa, carrying out high energy argon ion cleaning, sputtering metal cooper to achieve a desired thickness, sputtering metal silver to achieve a desired thickness, and sputtering a 4:1 CuMo alloy to achieve a thickness of 50 nm. With the method, the manufactured filters, the manufactured duplexers and other electronic devices have advantages of high bonding strength of the film layer and the substrate, good electrical conductivity, acid resistance, alkali resistance, high production rate, high yield, strong manufacturing environment protection, and the like.

Description

technical field [0001] The invention relates to an electronic device using magnetron sputtering coating and a manufacturing method thereof, in particular to a passive radio frequency and microwave filter using magnetron sputtering to deposit copper and silver conductive films on the surface for communication, radar and electronics device, duplexer. Background technique [0002] Passive RF and microwave filters and duplexers are widely used in communication, radar, and electronics fields, and are one of the most critical components in wireless communication systems. At present, these devices are all based on aluminum, and the surface is electroplated with copper and silver to a certain thickness to improve the surface conductivity to meet the use requirements. [0003] In the electroplating process, the metal to be plated cannot completely become the required coating, and a considerable part will become pollutants in the electroplating wastewater and sludge, and some will be...

AI Technical Summary

Problems solved by technology

Although this method solves the problem of acid and alkali resistance of the film layer, due to the poor conductivity of the surface passivation layer, it actually reduces the differential damage index of the device.

[0006] Therefore, the filters made by the existing electroplating process are excellent in the bonding strength between the film and the substrate, the density of the film, the surface finish of the film, the acid and alkali resistance of the film, and the yield and environmental protection in the production process. There are certain defects