A composite material with low expansion coefficient, high toughness and high thermal conductivity and its preparation method

Abstract

The invention relates to a high-toughness high-thermal conductivity functional composite material with a low expansion coefficient, and a preparation method thereof. Polycarbonate is taken as a base material; one or more heat conducting functional bodies, a compatilizer, and a processing agent are added. The weight of the heat conducting functional bodies is 30 to 40% of the weight of the polycarbonate, the weight of the compatilizer is 5 to 10% of the weight of the polycarbonate, and the weight of the processing agent is 0 to 5% of the weight of the polycarbonate. The high-toughness high-thermal conductivity functional composite material with the low expansion coefficient has performances that: the expansion coefficient is low, the toughness is high, the thermal conductivity is high and processing fluidity is excellent. The composite material can be used in shaping processing such as extrusion and injection processing, and can meet requirements for multiple functions of polymer materials, such as low expansion coefficient, high toughness and high thermal conductivity, in different fields. Application prospect of the composite material is promising, production technology is simple, operating control is convenient, quality is stable, producing efficiency is high and industrialization and market prospect is promising.

Description

technical field [0001] The invention relates to a functional composite material with low expansion coefficient, high toughness and high thermal conductivity and a preparation method thereof, belonging to the technical field of functional composite materials. Background technique [0002] With the rapid development of modern science and technology, composite materials formed of polymer materials and inorganic materials such as metals and ceramics have attracted more and more attention. However, compared with inorganic materials, polymer materials have relatively poor heat resistance and a much larger coefficient of thermal expansion (CTE). After the two are combined, as the temperature changes, thermal stress will be generated inside the composite material and the high Molecular materials produce cracking, warping, peeling and other undesirable phenomena. At the same time, with the development of miniaturization and high energy of electronic components, heat transfer has bec...

AI Technical Summary

Problems solved by technology

However, the obvious differences in physical and chemical properties between fillers and polymers will cause problems such as dispersion difficulties, poor processability and reduced mechanical properties when they are compounded with polymers, and often cannot coordinate high strength and high toughness and Paradox of High Mobility