Integrated broadband antenna and manufacturing method thereof

Abstract

The invention provides an integrated broadband antenna and a manufacturing method thereof. A grounding surface is manufactured on a Si substrate, and an organic dielectric material with fluidity is manufactured on the grounding surface and is solidified to be a substrate of the antenna. An antenna pattern is manufactured on the substrate, and the Si substrate of a corresponding region of the antenna pattern is etched so that a medium cavity is formed. A defect that a silicon-based antenna medium substrate is relatively thin is conquered by the integrated broadband antenna. Compared with a conventional silicon-based integrated antenna, the bandwidth of the antenna is significantly enhanced and the performance of the antenna is enhanced. The manufacturing technology process of the integrated broadband antenna is compatible to an embedded type chip packaging so that the manufactured antenna can be packaged together with the chip. Compared with an external connecting method of the antenna, a transmission distance of a signal line is reduced so that the loss is reduced. Meanwhile, the antenna is integrated with the chip so that the reliability is enhanced, the size is reduced and the trend of modern integrated circuit packaging is met.

Description

technical field [0001] The invention relates to an antenna and a manufacturing method thereof, in particular to an integrated broadband antenna and a manufacturing method thereof. Background technique [0002] In the field of wireless communication, antenna is an indispensable and very important part. The microstrip antenna is a new type of antenna successfully developed in the early 1970s. Compared with commonly used microwave antennas, it has the following advantages: small size, light weight, low profile, conformal to the carrier, simple manufacture, and low cost; the characteristic of electrical appliances is that it can obtain a single-directional wide-lobe pattern, The maximum radiation direction is in the normal direction of the plane, easy to integrate with microstrip lines, and easy to realize linear polarization or circular polarization. Microstrip antennas with the same structure can form a microstrip antenna array to obtain higher gain and larger bandwidth. Th...

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Problems solved by technology

Although this method has many of the above advantages, the dielectric constant, thickness of the substrate material, and the size consistency of the antenna are poor, especially in relatively high frequency bands, and these errors will have a great impact on the antenna parameters. After it comes out, it needs further debugging before it can be used, which reduces the production efficiency and increases the cost

In addition, the traditional patch antenna and integrated circuit are separated, and when they are connected together, they will be limited by the connector, which will cause some problems: such as impedance matching, parasitic inductance, parasitic capacitance, etc.

However, this kind of antenna has a disadvantage, that is, the substrate is relatively thin, generally only tens of μm or even less than 1 μm, which greatly reduces the bandwidth.

It is difficult to increase the thickness of the substrate on silicon. The commonly used method in literature reports is to etch grooves on silicon, fill the grooves with solid dielectric materials to make the height consistent with the surroundings, and then use colloidal dielectric layers to make antenna patterns on top of them. In fact, this method makes the antenna substrate have at least two kinds of materials, the antenna loss increases, and the antenna pattern and the substrate material of the feeder are different, which is easy to cause impedance mismatch, and the simulation and process production are more troublesome; the other is in the slot Filling with the same dielectric material (usually liquid) as other areas, and then curing, this method can still be used when the depth of the groove is relatively shallow, but when the depth is large, it often leads to poor flatness of the antenna surface, adverse effect on the antenna

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