High-temperature-resistant room temperature curing phosphate adhesive and preparation method thereof

Abstract

The invention discloses a high-temperature-resistant room temperature curing phosphate adhesive and a preparation method thereof, and relates to an adhesive and a preparation method thereof. The adhesive and the preparation method aim at solving the problems that the high-temperature-resistant adhesive prepared by the existing method cannot be cured easily at a room temperature, or the mechanical property and the heat resistance at a high temperature are poor after room temperature curing, and the preparation method is complicated. The high-temperature-resistant room temperature curing phosphate adhesive is prepared by modified aluminium dihydrogen phosphate and a curing agent. The preparation method comprises the steps that 1, aluminium hydroxide powder is added to a phosphoric acid solution; reaction is performed at 90-100 DEG C; chromic oxide is added; the reaction is continued at 90-100 DEG C; a modified aluminium dihydrogen phosphate solution is obtained; 2, aluminium nitride, yttrium oxide, calcium fluoride, boron nitride and zinc oxide are added to aluminium oxide, and mixed uniformly; the curing agent is obtained; and 3, the prepared modified aluminium dihydrogen phosphate solution and the curing agent are mixed uniformly, and stand at the room temperature; and the high-temperature-resistant room temperature curing phosphate adhesive is obtained. The adhesive is used for the fields of high-temperature-resistant ceramic material bonding and wood fire prevention coating.

Description

technical field [0001] The invention relates to an adhesive and a preparation method thereof. Background technique [0002] Adhesives are natural or synthetic, organic or inorganic substances that can connect two or more parts or materials together through interface adhesion and cohesion. At present, the adhesives with high temperature resistance above 1000℃ mainly include phosphoric acid-copper oxide adhesive system, silicate adhesive system and phosphate adhesive system. The phosphoric acid-copper oxide adhesive system is difficult to cure at room temperature, and usually needs to be heated to cure; although the silicate adhesive can be cured at room temperature, it has low mechanical properties and low shear strength at high temperatures above 1000 ° C. And water resistance is poor, and the viscosity is large, it is not easy to stir and operate, and it cannot meet the requirements of the mechanical properties of the bonding parts. And the process of existing preparation...

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Problems solved by technology

[0003] The purpose of the present invention is to solve the problem that the high temperature resistant adhesive prepared by the existing method is difficult to cure at room temperature, or has poor mechanical properties and heat resistance at a high temperature above 1000°C after curing at room temperature, and cannot meet the mechanical performance requirements of bonding parts. The method is complicated, and a kind of high temperature resistant room temperature curing phosphate adhesive and its preparation method are provided

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