Solar silicon wafer cleaning agent
A technology for solar silicon wafers and cleaning agents, applied in detergent compounding agents, detergent compositions, organic cleaning compositions, etc., can solve the problems of insufficient cleaning agent performance, irritating odor, and easy volatility, etc., and achieve biodegradable performance Low toxicity and low irritation, good biodegradability, and long-lasting cleaning ability
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Embodiment 1
[0039] 5wt% secondary isomeric alcohol polyoxyethylene ether, 2.5wt% fatty alcohol sulfate, 5wt% propylene glycol methyl ether, 10wt% sodium hydroxide, 0.5wt% edetate tetrasodium salt and The rest of the water is evenly mixed to obtain a solar silicon wafer cleaning agent. When cleaning solar silicon wafers, the cleaning agent and water are prepared into a solution at a mass ratio of 1:20, and placed in an ultrasonic cleaning tank at 55°C to clean the silicon wafers.
Embodiment 2
[0041]7.5wt% secondary isomeric alcohol polyoxyethylene ether, 2.5wt% fatty alcohol polyoxyethylene ether sulfate, 5wt% propylene glycol dimethyl ether, 10wt% triethanolamine, 1wt% ethylenediaminetetraacetic acid The tetrasodium salt and the remaining water are evenly mixed to obtain a cleaning agent for solar silicon wafers. When cleaning solar silicon wafers, the cleaning agent and water are prepared into a solution at a mass ratio of 1:40, and placed in a 50°C ultrasonic cleaning tank to clean the silicon wafers.
Embodiment 3
[0043] 10wt% secondary isomerism alcohol polyoxyethylene ether, 1wt% fatty alcohol polyoxyethylene ether carboxylate, 10wt% dipropylene glycol methyl ether, 10wt% sodium silicate, 10wt% sodium hydroxide, 3wt% % ethylenediaminetetraacetic acid tetrasodium salt and the rest of the water are uniformly mixed to obtain a solar silicon wafer cleaning agent. When cleaning solar silicon wafers, the cleaning agent and water are prepared into a solution at a mass ratio of 1:50, and placed in a 60°C ultrasonic cleaning tank to clean the silicon wafers.
[0044] The cleaning agent prepared by the present invention is alkaline, and the cleaning rate is more than 99%. The surface of the silicon chip after cleaning is clean, the color is consistent, and there is no mottle. Compared with the cleaning agent of the prior art, the cleaning agent of the present invention can clean the silicon chip increased by 30%.
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