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Heat conduction and insulating packaging material

A heat-conducting insulating filler and packaging material technology, applied in the field of insulating materials, can solve the problems of high processing cost, complex process, ultra-precision electronic parts packaging, etc., and achieve the effect of good dielectric performance, low thermal expansion coefficient and wide application

Inactive Publication Date: 2014-01-22
KUNSHAN FENFA INSULATING MATERIALS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] Thermally conductive and insulating epoxy resin materials mainly include bulk type and filled type. The bulk type has complex processes and high processing costs; the filled type is to add thermally conductive insulating fillers to epoxy resin and compound them in a certain way to obtain thermally conductive epoxy resin insulating materials. Due to the unique defects in the heat resistance and toughness of the common epoxy resin currently used, there are still certain defects in the packaging of ultra-precision and extremely demanding electronic components.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0017] Example 1: Dry the nano-silica, add it into the solvent with hexadecyltrimethylammonium bromide dispersant and silane coupling agent under stirring, raise the temperature to 100°C, and then treat it with ultrasonic waves 35min, then add it to the epoxy resin, add the catalyst at 150°C, then stir for about 2h to obtain the modified epoxy resin, and mix the obtained modified epoxy resin with 35% volume fraction of the silane coupling agent The treated modified silicon carbide powder was fully stirred and ultrasonically dispersed for 60 minutes, the curing agent phthalic anhydride was added, the stirring was continued, and the mixture was cured at 80°C to obtain a modified nano-epoxy resin / modified silicon carbide thermally conductive and insulating composite material.

Embodiment 2

[0018] Embodiment 2: Dry the nano-silica, add it into the solvent with hexadecyltrimethylammonium bromide dispersant and silane coupling agent under stirring, raise the temperature to 110°C, and then treat it with ultrasonic waves 50min, then add it to the epoxy resin, add the catalyst at 160°C, then stir for about 2h to obtain the modified epoxy resin, and mix the obtained modified epoxy resin with 30% volume fraction of the silane coupling agent The treated modified silicon carbide powder was fully stirred and ultrasonically dispersed for 60 minutes, the curing agent phthalic anhydride was added, the stirring was continued, and the mixture was cured at 80°C to obtain a modified nano-epoxy resin / modified silicon carbide thermally conductive and insulating composite material.

[0019] The invention discloses a thermally conductive and insulating packaging material, which is a composite insulating material filled with a nano-modified epoxy resin matrix as a modified silicon carb...

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PUM

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Abstract

The invention discloses a heat conduction and insulating packaging material which is obtained through uniform dispersion of an epoxy resin matrix and a heat conduction and insulating filler, wherein the epoxy resin matrix is modified epoxide resin treated by nanosilicon dioxide; the heat conduction and insulating filler is modified silicon carbide powder treated by a silane coupling agent; the modified epoxide resin is obtained in the manner as follows: nanosilicon dioxide is dried, added into a solvent with a dispersing agent and a silane coupling agent in a stirring state, heated to 90 DEG C to 110 DEG C, treated by ultrasonic waves for 30-50 minutes and then added into epoxy resin, a catalyst is added to the mixture at the temperature ranging from 150 DEG C to 160 DEG C and stirred for 2 hours, and the modified epoxide resin is obtained. With the adoption of the scheme, the heat conduction and insulating packaging material is a composite insulating material, has a good dielectric property, low thermal expansivity, high strength and large hardness, is non-toxic and harmless, and can be widely applicable to packaging of precision electronic parts.

Description

technical field [0001] The invention relates to the field of insulating materials, in particular to a heat-conducting and insulating packaging material. Background technique [0002] With the development of electronic equipment and components in the direction of thinness and miniaturization, heat dissipation has become an increasingly important issue in the electronic packaging and heat conduction industries. Packaging materials with thermal conductivity and insulation are effective for heat dissipation and heat dissipation of high-frequency microelectronic components. It plays an extremely important role in improving the working efficiency of the device and prolonging the service life. [0003] There are many types of electronic packaging materials. At present, epoxy resin packaging materials are mainly used. The power density of electronic and electrical components is increasing, and the thermal conductivity requirements for thermally conductive and insulating packaging ma...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L63/00C08K9/06C08K3/34C08K3/36
Inventor 周巧芬
Owner KUNSHAN FENFA INSULATING MATERIALS