Modified epoxy stone back mesh adhesive and preparation method thereof
A technology of backing glue and modification, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of unsatisfactory bond strength, unstable aging resistance, large curing shrinkage, etc., and achieve curing Small shrinkage, small internal stress, and moderate rheological state
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Embodiment 1
[0031] In the reaction kettle with agitator, temperature control and feeding device, add 37 parts of epoxy resin E-51, 8 parts of JY-256, reactive diluent, 5.8 parts of o-cresyl glycidyl ether, start stirring, add dispersant 3219 0.2 parts, 0.3 parts of wetting agent SP-978, and then stirred for 30 minutes, then added 25 parts of airflow quartz powder, 20 parts of silicon micropowder, stirred for 1 hour after adding the materials, and then added 1.2 parts of coupling agent KH-560, nano 1 part of sio2, 1.5 parts of nano-caco3, 100 parts by mass in total. Raise the temperature to 75°C, keep it warm for 1.5 hours, cool down to 35°C, stop stirring, and finally filter with a 120-mesh filter cloth, seal and pack to obtain component A of the present invention.
[0032] In another reaction kettle, add 29 parts of phenalkamine curing agent kingcure305, start stirring, and add in sequence, 6 parts of modified alicyclic amine curing agent kingcure285, 2 parts of benzyl alcohol, 1.5 parts...
Embodiment 2
[0035] When preparing component A, use 30.3 parts of E-51 for epoxy resin, 10 parts of TL-220A, and 25 parts of microsilica powder for powder. 25 parts of air-flow quartz powder, all the other are with example 1. When preparing component B, 20 parts of T-31 (A)-550 type phenalkamine curing agent was selected, 15 parts of King cure285 were selected as modified alicyclic amine curing agent, and the rest were used in Example 1.
Embodiment 3
[0037] When preparing component A, the epoxy resin is 36 parts of E-51 and 7.8 parts of JY-256; the powder material is 30 parts of air-flow quartz powder, 15.9 parts of silicon micropowder, 1.3 parts of nano-sio2, and the rest are the same as in Example 1.
[0038] When preparing the B component, the powder material selects 24 parts of silicon micropowder, 16 parts of air-flow quartz powder, 20 parts of superfine transparent powder, and the rest are used in Example 1.
[0039]Attached table, embodiment sample test method standard and test result
[0040]
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