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Modified epoxy stone back mesh adhesive and preparation method thereof

A technology of backing glue and modification, which is applied in the direction of epoxy resin glue, adhesive, adhesive type, etc., can solve the problems of unsatisfactory bond strength, unstable aging resistance, large curing shrinkage, etc., and achieve curing Small shrinkage, small internal stress, and moderate rheological state

Active Publication Date: 2014-04-30
HUNAN KOSEN NEW MATERIAL
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Adhesives for pasting mesh have been listed in several varieties in recent years. One is a compound of water-based adhesives, cement and fillers. This material has poor strength and unstable aging resistance; the other is solvent-based unsaturated polyester. Adhesives have low strength, poor adhesion, and high toxicity; there is also an ordinary epoxy adhesive, which has high strength and good aging resistance, but the curing shrinkage rate is large, and the bonding strength with cement mortar is not enough. Ideal, high cost, still needs to be improved

Method used

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  • Modified epoxy stone back mesh adhesive and preparation method thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0031] In the reaction kettle with agitator, temperature control and feeding device, add 37 parts of epoxy resin E-51, 8 parts of JY-256, reactive diluent, 5.8 parts of o-cresyl glycidyl ether, start stirring, add dispersant 3219 0.2 parts, 0.3 parts of wetting agent SP-978, and then stirred for 30 minutes, then added 25 parts of airflow quartz powder, 20 parts of silicon micropowder, stirred for 1 hour after adding the materials, and then added 1.2 parts of coupling agent KH-560, nano 1 part of sio2, 1.5 parts of nano-caco3, 100 parts by mass in total. Raise the temperature to 75°C, keep it warm for 1.5 hours, cool down to 35°C, stop stirring, and finally filter with a 120-mesh filter cloth, seal and pack to obtain component A of the present invention.

[0032] In another reaction kettle, add 29 parts of phenalkamine curing agent kingcure305, start stirring, and add in sequence, 6 parts of modified alicyclic amine curing agent kingcure285, 2 parts of benzyl alcohol, 1.5 parts...

Embodiment 2

[0035] When preparing component A, use 30.3 parts of E-51 for epoxy resin, 10 parts of TL-220A, and 25 parts of microsilica powder for powder. 25 parts of air-flow quartz powder, all the other are with example 1. When preparing component B, 20 parts of T-31 (A)-550 type phenalkamine curing agent was selected, 15 parts of King cure285 were selected as modified alicyclic amine curing agent, and the rest were used in Example 1.

Embodiment 3

[0037] When preparing component A, the epoxy resin is 36 parts of E-51 and 7.8 parts of JY-256; the powder material is 30 parts of air-flow quartz powder, 15.9 parts of silicon micropowder, 1.3 parts of nano-sio2, and the rest are the same as in Example 1.

[0038] When preparing the B component, the powder material selects 24 parts of silicon micropowder, 16 parts of air-flow quartz powder, 20 parts of superfine transparent powder, and the rest are used in Example 1.

[0039]Attached table, embodiment sample test method standard and test result

[0040]

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Abstract

The invention relates to a modified epoxy stone back mesh adhesive and a preparation method thereof. A component A is prepared from 30-50 parts of epoxy resin, 3-10 parts of reactive diluent, 0.1-0.5 part of dispersing agent, 0.1-0.5 part of wetting agent, 10-30 parts of airflow quartz powder, 5-25 parts of silica powder, 1-3 parts of coupling agent KH-560, 0.5-3 parts of nano SiO2 and 0.1-5 parts of nano CaCO3 based on 100 parts in total; a component B is prepared from 30-60 parts of phenolic aldehyde curing agent, 5-20 parts of modified alicyclic amine curing agent, 1-5 parts of benzyl alcohol, 1-5 parts of curing accelerator DMP-10, 0.1-0.5 part of dispersing agent, 0.1-0.5 part of wetting agent, 0-2 parts of coupling agent KH-550, 10-40 parts of airflow quartz powder, 5-25 parts of silica powder and 5-20 parts of superfine transparent powder based on 100 parts in total. The components A and B are mixed at a weight ratio of (4-2):1 and uniformly applied to the stone back mesh cloth. The back mesh adhesive has the advantages of low viscosity, good permeability and moderate rheological property; the curing shrinkage rate and linear expansion coefficient are obviously reduced; the back mesh stone is remarkably better than the existing products in mechanical strength and aging resistance.

Description

technical field [0001] The invention relates to a two-component room-temperature-curing modified epoxy adhesive and a preparation method thereof. The adhesive is especially suitable for reinforcing stone back nets. Background technique [0002] Natural facing stone has been widely used in the interior and exterior decoration of buildings. High-grade natural stone resources are limited and non-renewable, and the price is becoming more and more expensive. The decorative materials are gradually becoming thinner. Due to the uneven and fragile stone structure, the technical measures of sticking mesh reinforcement on the back of the thin board came into being. Adhesives for pasting mesh have been listed in several varieties in recent years. One is a compound of water-based adhesives, cement and fillers. This material has poor strength and unstable aging resistance; the other is solvent-based unsaturated polyester. Adhesives have low strength, poor adhesion, and high toxicity; the...

Claims

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Application Information

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IPC IPC(8): C09J163/00C09J163/02C09J11/04
Inventor 柳雄策沈定忠郑保昌钟雪琴何双林
Owner HUNAN KOSEN NEW MATERIAL