Polystyrene microsphere modified photosensitive resin for 3D printing and preparation method thereof

A technology of polystyrene microspheres and photosensitive resin is applied in the field of polystyrene microspheres modified photosensitive resin and new materials for 3D printing, which can solve the problems of low popularity of 3D printing, low mechanical strength of parts, and poor dimensional stability. , to achieve the effect of simple preparation process, good dimensional stability and fast forming speed

Active Publication Date: 2014-05-07
滁州格美特科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The popularity of 3D printing in China is low, and there are few reports about its special photosensitive resin materials. The common problems in the early research results include low mechanical strength of parts, low curing efficiency and poor dimensional stability. The present invention Improvements have been made in these areas

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0039] (1) Prepare raw materials according to the following proportions:

[0040] 15 parts of epoxy acrylate monoester,

[0041] 15 parts polyurethane acrylate,

[0042] 15 parts of novolac epoxy resin,

[0043] 15 parts of bisphenol S type epoxy resin,

[0044] 5 parts of polystyrene microspheres,

[0045] 0.1 part of light stabilizer 2,4-dicarboxybenzophenone,

[0046] Light stabilizer benzotriazole chloride 0.1 part,

[0047] Thinner trimethylolpropane triacrylate 10 parts,

[0048] Thinner ethoxylated trimethylolpropane triacrylate 10 parts,

[0049] 0.1 parts of antifoaming agent dimethyl polysiloxane,

[0050] Defoamer ethylene oxide propylene oxide copolyether 0.1 part,

[0051] Leveling agent silicone-ethylene oxide copolymer 0.1 part,

[0052] Leveling agent silicone-propylene oxide copolymer 0.1 part,

[0053] 0.1 part of antioxidant tetrakis (3,5-di-tert-butyl-4-hydroxyl) pentaerythritol phenylpropionate,

[0054] 0.1 part of antioxidant tris(2,4-di-tert-...

Embodiment 2

[0063] (1) Prepare raw materials according to the following proportions:

[0064] 30 parts of epoxy acrylate monoester,

[0065] 70 parts of phenolic epoxy resin,

[0066] 10 parts of polystyrene microspheres,

[0067] 0.1 part of light stabilizer 2,4-dicarboxybenzophenone,

[0068] Thinner trimethylolpropane triacrylate 10 parts,

[0069] 0.1 parts of antifoaming agent dimethyl polysiloxane,

[0070] Leveling agent silicone-ethylene oxide copolymer 10 parts,

[0071] Antioxidant tetrakis(3,5-di-tert-butyl-4-hydroxy)pentaerythritol phenylpropionate 0.1 parts

[0072] 10 parts of cationic initiator iodonium salt,

[0073] 1 part of free radical photopolymerization initiator benzophenone.

[0074] (2) Add 30 parts of epoxy acrylate monoester, 70 parts of novolak epoxy resin, 10 parts of diluent trimethylolpropane triacrylate, and disinfectant Foaming agent dimethyl polysiloxane 0.1 part, leveling agent silicone-ethylene oxide copolymer 10 parts, cationic initiator iodonium...

Embodiment 3

[0079] (1) Prepare raw materials according to the following proportions:

[0080] 35 parts of epoxy acrylate monoester,

[0081] 65 parts of novolac epoxy resin,

[0082] 15 parts of polystyrene microspheres,

[0083] 0.5 parts of light stabilizer 2,4-dicarboxybenzophenone,

[0084] Thinner trimethylolpropane triacrylate 15 parts,

[0085] 1 part of antifoaming agent dimethyl polysiloxane,

[0086] Leveling agent silicone-ethylene oxide copolymer 9 parts,

[0087] Antioxidant tetrakis (3,5-di-tert-butyl-4-hydroxyl) pentaerythritol phenylpropionate 0.5 parts

[0088] 9 parts of cationic initiator iodonium salt,

[0089] 2 parts of free radical photopolymerization initiator benzophenone.

[0090] (2) Add 35 parts of epoxy acrylate monoester, 65 parts of novolac epoxy resin, 15 parts of diluent trimethylolpropane triacrylate, and disinfectant 1 part of foaming agent dimethyl polysiloxane, 9 parts of leveling agent silicone-ethylene oxide copolymer, 9 parts of cationic ini...

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Abstract

The invention provides polystyrene microsphere modified photosensitive resin for 3D printing, which consists of the following raw materials in parts by mass: 30-70 parts of acrylic ester, 30-70 parts of epoxy resin, 5-60 parts of polystyrene microsphere, 0.1-5 parts of light stabilizer, 10-30 parts of diluent, 0.1-10 parts of antifoaming agent, 0.1-10 parts of leveling agent, 0.1-5 parts of antioxidant, 1-10 parts of cationic initiator and 1-10 parts of free radical type photopolymerization initiator. The polystyrene microsphere modified photosensitive resin provided by the invention has the advantages of fast formation, high mechanical strength, good dimensional stability and the like; moreover, the preparation process is simple and can be directly applied and popularized to the preparation of complicated-structure components in the field of 3D printing.

Description

technical field [0001] The invention belongs to the field of 3D printing new materials, in particular to the field of polystyrene microsphere modified photosensitive resin. [0002] Background technique [0003] 3D printer technology is a new type of rapid prototyping manufacturing technology based on the material accumulation method. When working, the powder spreading roller moves left and right to spread the powder in the powder supply cylinder evenly on the forming cylinder, and then according to the designed part model. The cross-sectional shape is sprayed on the first layer of powder, and then the molding cylinder moves down, and then the second layer is printed according to this step, and the entire cross-section of the part is overlapped to form a product through interlayer superposition. [0004] The popularity of 3D printing in China is low, and there are few reports about its special photosensitive resin materials. The common problems in the early research results...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L51/08C08L25/06C08F283/10C08F283/00
Inventor 杨桂生李枭
Owner 滁州格美特科技有限公司
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