Novel cathode high-temperature brazing material and preparation method thereof
A technology of brazing material and cathode, which is applied in welding equipment, welding/cutting medium/material, welding medium, etc., can solve the problem of high melting point, and achieve the effect of uniform composition, fine particles, and uniform particle size
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Embodiment 1
[0035] Solder composition (mass fraction): 92.0%Ru-6.5%B-1.5%C
[0036] The preparation method of solder powder is as follows: weigh according to the above-mentioned solder composition ratio, Ru powder, B powder, and C powder are preferably high-purity (purity ≥ 99.9% by weight), ultrafine (particle size ≤ 50 μm) powder (the following examples The same), the three powders are burned with hydrogen to remove impurities at 800°C, the hydrogen dew point is -60°C, and the hydrogen flow rate is 70ml / min; the treated powders are mixed and granulated. Under the pressure of 280MPa, the solder preform was made by cold isostatic pressing; under the conditions of hydrogen flow rate of 80ml / min, dew point -60°C, and temperature of 420°C, the preform was kept for 1h for dewaxing treatment, and then the temperature was raised to 1100 ℃ for high-temperature sintering (the hydrogen flow rate remains unchanged); the sintered solder preform needs to be electron beam vacuum smelted to remove impu...
Embodiment 2
[0039] Solder composition (mass fraction): 94.0%Ru-3.5%Ru-2.5%C
[0040] The preparation method of the solder powder is as follows: weighing according to the above-mentioned solder composition ratio, burning hydrogen to remove impurities at 750°C for the three powders, the hydrogen dew point is -60°C, and the hydrogen flow rate is 75ml / min, and the processed powders are mixed. powder, granulation. Under the pressure of 300MPa, the solder preform is made by cold isostatic pressing; under the conditions of hydrogen flow rate of 70ml / min, dew point -60°C, and temperature of 450°C, the preform is kept for 1h for dewaxing treatment, and then the temperature is raised to High-temperature sintering at 1000°C (hydrogen flow rate increased to 100ml / min); the sintered solder preform needs to be cleaned of impurities (gas and high vapor pressure impurities, etc.) at 5×10 -3 Pa, the electron gun vacuum is better than 5×10 -4 Pa; The solder alloy ingot (Ф30mm alloy rod) obtained by elec...
Embodiment 3
[0043] Solder composition (mass fraction): 89.0%Ru-10.0%Ru-1.0%C
[0044] The preparation method of solder powder is as follows: weigh according to the above-mentioned solder composition ratio, burn hydrogen to remove impurities at 780°C for the three powders, the hydrogen dew point is -60°C, and the hydrogen flow rate is 100ml / min. Powder mixing and granulation. Under the pressure of 330MPa, the solder preform is made by cold isostatic pressing; under the conditions of hydrogen flow rate of 100ml / min, dew point -60°C, and temperature of 500°C, the preform is kept for 1h for dewaxing treatment, and then the temperature is raised to High temperature sintering at 1050°C (hydrogen flow rate remains unchanged); after sintering, the solder preform needs to be cleaned of impurities (gas and high vapor pressure impurities, etc.) 10 -3 Pa, the electron gun vacuum is better than 5×10 -4 Pa; The solder alloy ingot (Ф30mm alloy rod) obtained by electron beam smelting is powdered (coar...
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