Carbon nanotube composite thin film field emission cathode preparation method

Abstract

The invention provides a carbon nanotube composite thin film field emission cathode preparation method. The carbon nanotube composite thin film field emission cathode preparation method includes the following steps that: S1, nanotube/TiC/Ti composite materials are prepared; S2, the nanotube/TiC/Ti composite materials and nano filling particles are mixed according to at the mass ratio of 5:1 to 1:5, and the mixture is added to an organic solvent, and ultrasound is adopted to perform dispersion, and a first slurry can be formed; S3, the first slurry is transplanted on a silver electrode, and a nanotube composite film can be formed; S4, the nanotube composite film is put into a sintering furnace so as to be subjected to vacuum sintering or reducing atmosphere sintering for more than 15 minutes under temperature from 200 DEG C to 600 DEG C; S5, Ti on the surface of the sintered carbon nanotube composite film is corroded and removed through using a corrodent, and a carbon nanotube/TiC emission tip is exposed, and a carbon nanotube composite thin film field emission cathode can be formed. With the carbon nanotube composite thin film field emission cathode prepared by the invention adopted, adhesion and electrical contact between the emitter and the base of a carbon nanotube can be improved, and field emission performance can be improved.

Description

technical field [0001] The invention relates to the field of carbon nanotube field emission cathode preparation field, in particular to a preparation method of carbon nanotube composite film field emission cathode. Background technique [0002] Carbon nanotubes have a quasi-one-dimensional structure with a high aspect ratio, excellent mechanical properties and chemical stability, and are ideal materials for field emission cathodes instead of silicon tips, tungsten tips, and molybdenum tips. However, due to the poor wettability and weak binding force between the surface of carbon nanotubes and substrates such as metals or resins, the adhesion of the carbon nanotube thin film cathode to the substrate is small and the contact resistance is large, thereby increasing the entire electron emission circuit. heat dissipation, and instability of electron emission. These shortcomings inhibit the superior field emission performance of carbon nanotubes, and affect the application prospe...

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Problems solved by technology

However, these methods limit the further improvement of field emission performance due to the poor wettability between the surface of carbon nanotubes and most metal surfaces, and the formation of Schottky barriers rather than ohmic contacts between carbon nanotubes and metals.

The high-temperature vacuum annealing method uses Ti as the electrode of carbon nanotubes to form a TiC interlayer at high temperature, thereby forming an ohmic contact between carbon nanotubes and metals. However, this method requires high temperatures above 800°C, and the substrate material Puts high demands, is not suitable for most low temperature applications, and the contact area formed by this method is small, which also limits the current emitted

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