Etching processing method and device for high-quality alumina ceramics

Abstract

The invention discloses a method and a device for etching and processing aluminum oxide ceramics. The method includes positioning the integral clean aluminum oxide ceramics in water; scanning, etching and processing the aluminum oxide ceramics by the aid of ultraviolet pulse laser. The distances from the surface of the water to the surfaces of aluminum oxide ceramic materials range from 2mm to 12mm. The surfaces of the etched and processed aluminum oxide ceramics are free of blackened deterioration layers and re-coagulation layers. The device comprises an ultraviolet laser device, a scanning galvanometer, a two-dimensional processing platform and a container. The container is used for accommodating the water and the to-be-processed aluminum oxide ceramics. The method and the device have the advantages that a 'water' factor is ingeniously introduced into the method and the device, cooling and slagging effects can be realized when the aluminum oxide ceramics are etched by the aid of the laser under the condition of a certain thickness or in the water with a certain flow rate, accordingly, blackening deterioration due to direct etching in the air can be effectively prevented, the etching depth can be increased, the etching quality and the laser etching and processing efficiency can be improved, and various three-dimensional complicated patterns with high dimensional precision can be etched and manufactured on the surfaces of the aluminum oxide ceramics by the aid of the method and the device.

Description

technical field [0001] The invention relates to the field of laser processing, in particular to the field of laser etching and processing of alumina ceramics, in particular to a method and device for etching and processing of high-quality alumina ceramics. Background technique [0002] Alumina ceramic material is one of the most widely used ceramic materials at present, and has become an indispensable material in the fields of biology, microelectronics, and chemical industry. However, due to the disadvantages of poor thermal shock resistance and low fracture toughness of alumina ceramics, it encounters great difficulties in traditional machining. Traditional processing methods such as turning and milling cannot meet the processing requirements of modern technology for high-precision and complex parts. The cutting and drilling of alumina ceramics by mechanical methods are limited to the processing of straight lines, large sizes and simple graphics, which limits the applicati...

AI Technical Summary

Problems solved by technology

However, when the ultraviolet laser directly etches the alumina ceramic material in the air, the high power density laser directly irradiating the etched material will cause the temperature of the material surface to rise rapidly to the melting or gasification temperature.

When the alumina ceramic material is melted at 2050-2980K, it will inevitably cause the crystal phase change of the alumina ceramic to form α-Al 2 o 3 and γ-Al 2 o 3 The black metamorphic layer dominated by mixed phases, and the recondensed layer is more obvious, which seriously affects the micromachining quality and dimensional accuracy of laser-etched alumina ceramics

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