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High glass transition temperature resin formulations

A technology for changing temperature and resin, which is applied in circuits, electrical solid state devices, semiconductor devices, etc., and can solve problems such as low heat-hydrolysis stability

Inactive Publication Date: 2014-07-09
DOW CORNING CORP
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

A drawback of cyanate ester chemistry is its low thermo-hydrolytic stability, which manifests itself primarily in the inversion of the triazine bond upon exposure to high temperature water

Method used

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  • High glass transition temperature resin formulations

Examples

Experimental program
Comparison scheme
Effect test

example 1

[0052] Example 1 - Properties of Silsesquioxane Resin Components

[0053] Several different silsesquioxane resin components (described as resins 2, 4, 5, 6, and 7 in run numbers 1-8 of Table 3) were combined with several traditional silsesquioxanes according to the teachings of the present invention. Resin components (described as Resins 1, 3, 8, and 9 in Comparative Nos. B-E of Table 3) were prepared together. The molecular weight, total alkoxy and silanol content, and equivalent weight of phenolic hydroxyl groups measured for each silsesquioxane resin component are summarized in Table 3.

[0054] Table 3: Measured Properties of Silsesquioxane Resin Components .

[0055]

[0056] Referring to Table 3, each of the silsesquioxane resins (Resins 2 and 4-7) prepared according to the teachings of the present invention exhibited an equivalent weight of aromatic hydroxyl groups greater than 500 and less than 1,100 g / eq OH. In addition, these silsesquioxane resin components ...

example 2

[0057] Example 2 - Composition of Resin Formulation

[0058] Each of the silsesquioxane resin components described in Example 1 above (Resins 1-9) were used in the weight ratios shown in Table 4 below to form components comprising cyanate esters, optional cure accelerators ( such as a catalyst), and optionally a resin formulation comprising a solvent. Each component of the resin formulation was mixed in glass vials on a rotary wheel for 1 to 2 hours to form the resin formulations in Run Nos. 1-8 and Comparative Nos. A-E. The cyanates used to prepare these resin formulations are dicyanate monomers ( L-10, Huntsman Corporation), the cure accelerator was cobalt acetylacetonate, and the solvent was xylene.

[0059] Table 4: Composition of Resin Formulations

[0060]

[0061] Referring now to Table 3, the resin formulation described as Comparative No. A was made without the use of the silsesquioxane resin component and is representative of a conventional cyanate ester fo...

example 4

[0078] Example 4 - Preparation of Silsesquioxane Resin Components

[0079] Resin 1 - A 3 liter 3 neck round bottom flask was charged with phenyltrimethoxysilane (785.18g) and methyltrimethoxysilane (539.44g). The flask is equipped with Stirring paddle, thermometer, and Dean Stark apparatus attached to a water-cooled condenser. A total of 0.662 g, 390 uL of trifluoromethanesulfonic acid (FC-24, 3M Company) was added; then deionized water (186.28 g, 10.34 moles) was added slowly at room temperature. The temperature was increased to 71°C to distill off methanol (572.9 g). The reaction mixture was then cooled to 50°C and 248.30 g of tetramethyldisiloxane was added followed by glacial acetic acid (111.1 g). The reaction mixture was heated at 50 °C for 3 hours. The volatiles (177.5 g) were then distilled off by increasing the pot temperature to 70°C. Then n-heptane (439.7 g) was added to the reaction mixture. Wash the reaction mixture with deionized water (1 x 150 mL wash...

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Abstract

A curable resin formulation based on the modification of cyanate esters with silsesquioxane resins is provided for use in forming a cured composite structure or layer. More specifically, a resin formulation that generally comprises a silsesquioxane resin component having an equivalent weight of aromatic hydroxyl groups that is greater than 500 and less than 2,000 grams per mole of aromatic hydroxyl groups; a cyanate ester component; and optionally a catalyst is described. In this resin formulation, the silsesquioxane resin component is present in an amount greater than 10 wt. % of the total solids content of the resin formulation. The resin composite layer formed therefrom exhibits a glass transition temperature that is greater than or equal to 185 DEG C, wherein this glass transition temperature decreases by less than or equal to 40% upon exposure to water at an elevated temperature for a predetermined amount of time.

Description

technical field [0001] The present invention generally relates to resin formulations exhibiting high glass transition temperatures, dielectric properties, water resistance, and thermo-hydrolytic stability. More specifically, the present invention relates to silicone-modified cyanate ester formulations and methods of manufacture, and their use as adhesive systems for printed circuit board (PCB) applications. Background technique [0002] The statements in this section merely provide background information related to the present disclosure and may not constitute prior art. [0003] The triazine network structure formed when curing cyanate ester materials exhibits a balance of flexibility, low dielectric loss, low moisture absorption, and thermal stability in the absence of water, which makes these materials suitable for use in high-end microelectronics Used in packaging, multilayer circuit board and aerospace composite applications. Currently, cyanate ester materials are use...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L83/06
CPCC08G77/388C08G77/458C08L83/06H01L23/296H01L2924/0002H01L2924/00C08L79/04
Inventor S·斯维尔J·霍斯特曼
Owner DOW CORNING CORP
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