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Laminated paper base plate used in drilling of PCB (Printed Circuit Board) and manufacturing method of laminated paper base plate

A technology for PCB boards and backing boards, which is applied in the field of laminated paper backing boards for PCB drilling and its preparation, can solve problems such as unrealizable costs, and achieve the effects of improving quality, low production costs, and good weather resistance

Active Publication Date: 2014-07-30
SHENZHEN NEWCCESS IND
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] In view of the above-mentioned deficiencies in the prior art, the object of the present invention is to provide a laminated paper backing board for PCB drilling and its preparation method, aiming at solving the problem that the current backing board for PCB drilling cannot meet the needs of various circuit board drilling. performance requirements while reducing costs

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0044] A1 step: preparation of modified urea-formaldehyde resin

[0045] 1. Heat polyvinyl alcohol and water at a ratio of 1:8~10 at about 80-90°C until it completely dissolves into a transparent polyvinyl alcohol solution and cool it for later use;

[0046] 2. Heat Glue Depot, starch and water at a ratio of 1:30~50:300~500 to 80-90°C, keep warm and dissolve to make the translucent starch Glue Depot solution cool for later use;

[0047] 3. Mix and stir 100 parts of urea-formaldehyde resin, 20-50 parts of polyvinyl alcohol solution, 2-6 parts of aluminum powder, 20-40 parts of starch glue depot solution and 0.5-1 part of silane coupling agent and set aside .

[0048] Step B1: Production of semi-finished products

[0049] Facial paper: use wood pulp paper to impregnate phenolic resin, bake and cut to obtain the semi-finished facial paper with normal indicators and pack it for use;

[0050] Lining paper: Use kraft paper to impregnate the modified urea-formaldehyde resin made b...

Embodiment 2

[0055] A2 step. Preparation of modified urea-formaldehyde resin

[0056] 1. Heat Glue Depot, starch and water at a ratio of 1:30~50:300~500 to 80-90°C, keep warm and dissolve, and turn translucent starch Glue Depot solution to cool for later use;

[0057] 2. Mix 100 parts of urea-formaldehyde resin, 20-50 parts of polyethylene glycol solution, 2-6 parts of wood flour, 20-40 parts of starch glue Depot solution and 0.5-1 part of silane coupling agent and wait until use.

[0058] Step B2. Production of semi-finished products

[0059] Facial paper: use wood pulp paper to impregnate phenolic resin, bake and cut to obtain the semi-finished facial paper with normal indicators and pack it for use;

[0060] Lining paper: Use kraft paper to impregnate the modified urea-formaldehyde resin made by the above-mentioned A2, bake and cut to obtain the semi-finished lining paper with normal indicators and pack it for use;

[0061] Step C2. Compression molding of the new backing plate

[00...

Embodiment 3

[0065] A3 step: preparation of modified urea-formaldehyde resin

[0066] 1. Heat polyvinyl alcohol and water at a ratio of 1:8~10 at about 80-90°C until it completely dissolves into a transparent polyvinyl alcohol solution and cool it for later use;

[0067] 2. Heat Glue Depot, starch and water at a ratio of 1:30~50:300~500 to 80-90°C, keep warm and dissolve to make the translucent starch Glue Depot solution cool for later use;

[0068] 3. Mix 100 parts of urea-formaldehyde resin, 20-50 parts of polyethylene glycol solution, 2-6 parts of talcum powder, 20-40 parts of starch glue Depot solution and 0.5-1 part of silane coupling agent and wait until use.

[0069] Step B3: Production of semi-finished products

[0070] Facial paper: use wood pulp paper to impregnate phenolic resin, bake and cut to obtain the semi-finished facial paper with normal indicators and pack it for use;

[0071] Lining paper: Use kraft paper to impregnate the modified urea-formaldehyde resin made of the...

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Abstract

The invention discloses a laminated paper base plate for use in drilling of a PCB (Printed Circuit Board) and a manufacturing method of the laminated paper base plate. The base plate comprises an inner layer consisting of inner paper, and surface paper arranged on the upper and lower surfaces of the inner layer, wherein the inner paper is obtained by steeping kraft paper with modified urea formaldehyde resin, baking and cutting; the formula of the modified urea formaldehyde resin comprises the following components in parts by weight: 100 parts of urea formaldehyde resin, 20-50 parts of a toughening modifier, 2-6 parts of filler, 0.5-1 part of a dispersing agent and 20-40 parts of a viscosity adjusting agent; the surface paper is obtained by steeping balance paper or wood pulp paper with the urea formaldehyde resin, baking and cutting. The base plate is manufactured by adopting a specific process, so that wear to a drill pin during drilling is reduced; burrs are reduced, the hole wall quality of drilled holes is improved, and the problem of warping of the urea formaldehyde resin is solved. The base plate has the advantages of high flatness, no deformation, high weather resistance and proper strength, is relatively low in production cost, and has a wide application prospect and the high market competitiveness.

Description

technical field [0001] The invention relates to the field of printed circuit board manufacturing, in particular to a laminated paper backing plate for PCB drilling and a preparation method thereof. Background technique [0002] Printed circuit boards (referred to as PCBs) are divided into rigid printed circuit boards, flexible printed circuit boards and rigid-flexible boards. Backing boards for drilling printed circuit boards are currently generally used in fiberboards, sticker wood fiber boards, melamine wood backing boards, phenolic paper backing boards, etc. Among them, fiberboard and sticker wood fiberboard are mainly used for drilling of medium and high-grade circuit boards, and phenolic boards are used for drilling of high-grade circuit boards and flexible circuit boards. With the rapid development of electronic technology, modern electronic products have become smaller and smaller, and their functions have become more and more complex. The printed circuit board (PCB)...

Claims

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Application Information

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IPC IPC(8): B32B15/12D21H17/49D21H17/67D21H21/08B23B47/00
Inventor 程小波杨柳杨迪
Owner SHENZHEN NEWCCESS IND
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