Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same

一种有机电子装置、粘合膜的技术，应用在薄膜/薄片状的粘合剂、没有载体的薄膜/薄片、粘合剂类型等方向，能够解决有机发光元件损害等问题，达到粘性时间缩短、机械强度简单的效果

Active Publication Date: 2014-07-30
LG CHEM LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Since the liquid adhesive resin composition is precured by irradiating visible light to the entire surface of the substrate including the element and then cured by heating, it may cause damage to the organic light emitting element

Method used

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  • Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same
  • Photocurable adhesive film for organic electronic device seal, organic electronic device, and method for sealing same

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0086] Example 1: Preparation of Curable Pressure Sensitive Adhesive Films and OEDs

[0087] By making a pressure sensitive adhesive containing 15 parts by weight of butyl acrylate, 40 parts by weight of methyl ethyl acrylate, 20 parts by weight of isobornyl acrylate, 15 parts by weight of methyl acrylate and 10 parts by weight of hydroxyethyl acrylate The mixture is polymerized to prepare an acrylic polymer with a glass transition temperature of about -20°C and a weight average molecular weight of 500,000.

[0088] With respect to 100 parts by weight of the above-mentioned acrylic polymer, 0.2 parts by weight of isocyanate crosslinking agent (xylyl diisocyanate, T-39M), 5 parts by weight of trimethylolpropane type epoxy resin (SR- TMP, SAKAMOTO) and 0.25 parts by weight of triaryl sulfonium salt type cationic photopolymerization initiator (CPI-110A, SAN-APRO Ltd.) add in this acrylic polymer, and add ethyl acetate as solvent, prepare solid content as 20% coating solution.

...

experiment example 1

[0099] Experimental Example 1: Measurement of Viscosity

[0100] The viscosities of the curable pressure-sensitive adhesive layers of the adhesive films according to Example 1 and Comparative Examples 1 to 4 before and after light irradiation were measured by ARES, and the results are listed in Table 1.

[0101] [Table 1]

[0102]

experiment example 2

[0103] Experimental Example 2: Evaluation of WVTR

[0104] After thermally curing the curable pressure-sensitive adhesive films prepared in Example 1 and Comparative Examples 1 to 4, PERMATRAN-W Model3 / 61 manufactured by MOCON was used for 1cm 2 Area measurement WVTR. The results are listed in Table 2.

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Abstract

The embodiment examples of the present invention relate to a composition for a photocurable adhesive agent comprising an acrylic polymer, an epoxy resin, and a cation polymeric photoinitiator, an organic electronic device comprising a sealing material containing the composition by using the adhesive film, which is a molded product made from a film comprising the composition, and a method for manufacturing the organic electronic device by using the adhesive film. More specifically, the method for manufacturing the organic electronic device comprises the steps of: coupling the adhesive film to an upper plate and photocuring by irradiating light on a front surface of an adhesive layer; and coupling the adhesive layer that is photocured to a lower substrate, which is provided with organic light emitting diodes thereon, thereby securing mechanical strength by sealing the front surfaces, simplify the manufacturing process by means of photocuring even without directly irradiating light on the light emitting diodes, and enhancing the life of the diodes.

Description

technical field [0001] The present invention relates to organic electronic devices, and more particularly, to a photocurable pressure-sensitive adhesive composition for encapsulating an organic electronic device (OED), an adhesive film formed from the composition, and a method for preparing an OED. method. Background technique [0002] An OED refers to a device including an organic material layer that generates charge exchange using holes and electrons, and may include photovoltaic devices, rectifiers, transmitters, and organic light emitting diodes (OLEDs). [0003] OLED, as a representative OED, has less power consumption and higher response speed than conventional light sources, and is preferable as a thin display device or light source. In addition, OLEDs are excellent in space utilization, and thus are expected to be applied to various fields including various portable devices, monitors, notebook computers, and televisions. [0004] In order to expand the compatibilit...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/50C09J133/04C09J163/00C09J7/02C09J7/10
CPCC09J7/00C09J133/00H10K50/846H10K50/8426H10K50/844C08L63/00C09J133/066C09J133/12C09J133/14C09J163/00C09J175/04C08G18/6229C08G18/7642C08G18/003C08G2170/40C09J2433/00C08G59/68C08L33/06C09J2463/00C09J7/10C09J2203/326C09J2433/006C09J2463/006C09J2301/416C08F220/14C08F220/1811C08F220/20
Inventor 赵允京柳贤智沈廷燮张锡基
Owner LG CHEM LTD
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