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Self-curing polyacrylate-epoxy resin adhesive as well as preparation method and application of self-curing polyacrylate-epoxy resin adhesive

A technology of polyacrylate and epoxy resin adhesives, which is applied in the direction of epoxy resin adhesives, adhesives, ester copolymer adhesives, etc., can solve the problems of high brittleness of epoxy resin adhesives and unsuitable pressure-sensitive adhesives, etc., and achieve Good bonding strength, simple preparation, good initial tack effect

Inactive Publication Date: 2014-08-13
TIANJIN UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, epoxy resin adhesives are usually brittle and are not suitable for the preparation of pressure-sensitive adhesives.

Method used

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  • Self-curing polyacrylate-epoxy resin adhesive as well as preparation method and application of self-curing polyacrylate-epoxy resin adhesive
  • Self-curing polyacrylate-epoxy resin adhesive as well as preparation method and application of self-curing polyacrylate-epoxy resin adhesive
  • Self-curing polyacrylate-epoxy resin adhesive as well as preparation method and application of self-curing polyacrylate-epoxy resin adhesive

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1～3

[0031] Examples 1-3 Preparation of polyacrylate polymer (A) with a glass transition temperature of -65°C to 10°C:

[0032] (1) According to the formula in Table 1, take isooctyl acrylate, butyl acrylate, methyl methacrylate, and vinyl acetate;

[0033] (2) Add the initiator and crosslinking agent to the liquid obtained in step (1), and mix well to obtain a mixed liquid;

[0034] (3) Drop the mixed liquid obtained in step (2) into the organic solvent ethyl acetate under a nitrogen atmosphere, and react at 70°C for 6 hours to obtain glass transition temperatures of -65°C, -30°C and 10°C, respectively. Polyacrylate polymer (A).

[0035] Table 1 (mass ratio)

[0036]

[0037] Experiments have shown that benzoyl tert-butyl peroxide, methyl ethyl ketone peroxide, azobisisobutyronitrile, azobisisoheptanonitrile or dimethyl azobisisobutyrate are substituted for the diphenyl peroxide in Example 1 Using acyl as an initiator can also prepare polyacrylate polymers (A) with a glass t...

Embodiment 4～6

[0042] The preparation of embodiment 4~6 acid anhydride curing agent:

[0043] By copolymerizing maleic anhydride with styrene and other monomers, copolymers with different anhydride equivalents can be prepared, and the raw material ratio for preparing the anhydride curing agent is shown in Table 2.

[0044] (1) Dissolve maleic anhydride in xylene and pass N 2 And stir and heat up to 70°C;

[0045] (2) After blending styrene, butyl acrylate and dibenzoyl peroxide as the initiator, continuously drop into the liquid obtained in step (1), the dropwise addition is completed in 2 hours, keep warm for 6 hours, and pump the obtained white precipitate Filter and dry to obtain the acid anhydride curing agent;

[0046] The molar ratio of maleic anhydride and styrene is 1:1;

[0047] The quality of described butyl acrylate accounts for maleic anhydride, styrene and butyl acrylate total mass and is respectively 0,10%, 35%; The consumption of initiator is respectively maleic anhydride, ...

Embodiment 7～13

[0053] Embodiment 7-13 Preparation of a self-curing polyacrylate-epoxy resin adhesive

[0054] A kind of preparation method of self-curing polyacrylate-epoxy resin adhesive:

[0055] (1) Mix polymer A, epoxy resin B and acid anhydride curing agent C; Table 3 is the ratio of raw materials, the amount indicated in the table is the mass ratio, and the brackets correspond to epoxy resin and anhydride Curing agent equivalent ratio.

[0056] (2) Dissolving the mixture obtained in step (1) in a solvent to prepare an adhesive.

[0057] Test the peel strength of pressure sensitive tape to stainless steel plate. In addition, the self-curing polyacrylate-epoxy pressure-sensitive adhesive (adhesive) of the present invention was used to overlap stainless steel plates, and cured at 120°C for 4 hours to test the shear strength of the adhesive. The obtained data are listed in Table 3.

[0058] From the test results in Table 3, it can be seen that the self-curing polyacrylate-epoxy resin p...

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Abstract

The invention discloses a self-curing polyacrylate-epoxy resin adhesive as well as a preparation method and application of the self-curing polyacrylate-epoxy resin adhesive. The preparation method comprises the steps of (1) weighing a polyacrylic polymer (A) with the glass transition temperature of 65 DEG C below zero to 10 DEG C, epoxy resin (B) and an acid anhydride curing agent (C), wherein the molar ratio of (B) to (C) is 0.95-1.2, and the mass ratio of (A) to (B+C) is 0.5-2.0; (2) dissolving (A), (B) and (C) into a solvent to prepare a solution with the mass concentration of 40-60%. The self-curing polyacrylate-epoxy resin adhesive disclosed by the invention has favorable initial adhesion at normal temperature and can be cured after being applied to a high-temperature environment so as to have favorable bonding strength. The method disclosed by the invention is simple in preparation. The adhesive is independently packaged so as to be convenient to use.

Description

technical field [0001] The invention relates to a self-curing polyacrylate-epoxy resin adhesive, a preparation method and an application. Background technique [0002] Adhesives, as a functional polymer material, are currently widely used in various aspects from daily life to high-tech fields. According to the actual application environment and application conditions, people continue to put forward new requirements for the performance of adhesives. Pressure-sensitive adhesives are one of the most used varieties of adhesives, and are generally formulated with polymers with a lower glass transition temperature as the main material, so pressure-sensitive adhesives show good initial tack. However, in some practical applications, on the one hand, the adhesive is required to have good initial tack, and on the other hand, after the bonding process is completed, the bonding structure must have good durability and high temperature resistance. In this way, ordinary pressure-sensitive...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J133/08C09J163/00C08F222/08C08F212/08C08F220/18
Inventor 袁才登段亚冲
Owner TIANJIN UNIV
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