Ultraviolet-curing composition for LED packaging

A technology of LED packaging and ultraviolet light, which is applied in the direction of adhesive additives, polymer adhesive additives, modified epoxy resin adhesives, etc., can solve the problems of poor bonding performance and achieve good formability and bonding Good performance and high transparency

Inactive Publication Date: 2014-09-10
江苏华程光电科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] The technical problem to be solved by the present invention is: in order to overcome the problem that the cured layer of polyurethane-acrylic acid-epoxy resin photosensitive prepolymer is relatively soft after curing and the bonding performance is poor in the prior art, a kind of ultraviolet light curing for LED packag

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Example Embodiment

[0026] Example 1

[0027] An ultraviolet light curing composition for LED encapsulation, each component and the weight percentage content of each component are:

[0028] Polyurethane-acrylic-epoxy photosensitive prepolymer 45%

[0029] Epoxy Acrylate 45%

[0030] IRGACURE1841%

[0031] Polyether modified silicone 0.5%

[0032] The balance is hydroxyethyl (meth)acrylate.

[0033] A preparation method of an ultraviolet light curing composition for LED encapsulation, comprising the steps of:

[0034] Step 1) take polyurethane-acrylic acid-epoxy resin photosensitive prepolymer, epoxy resin acrylate, photoinitiator, leveling agent and reactive diluent in proportion,

[0035] Step 2) Stir the polyurethane-acrylic acid-epoxy resin photosensitive prepolymer, epoxy resin acrylate, leveling agent and reactive diluent in step 1) evenly, and the speed of the mixer is 1000-1800 rpm to obtain Reactive resin, and the reactive resin and photoinitiator are packaged separately for standby...

Example Embodiment

[0037] Example 2

[0038] An ultraviolet light curing composition for LED encapsulation, each component and the weight percentage content of each component are:

[0039] Polyurethane-acrylic-epoxy photosensitive prepolymer 20%

[0040] Epoxy Acrylate 45%

[0041] IRGACURE5005%

[0042] Polyester modified silicone 1%

[0043] The balance is hydroxypropyl (meth)acrylate and ethoxylated hydroxyethyl (meth)acrylate.

[0044] A preparation method of an ultraviolet light curing composition for LED encapsulation, comprising the steps of:

[0045] Step 1) take polyurethane-acrylic acid-epoxy resin photosensitive prepolymer, epoxy resin acrylate, photoinitiator, leveling agent and reactive diluent in proportion,

[0046] Step 2) Stir the polyurethane-acrylic acid-epoxy resin photosensitive prepolymer, epoxy resin acrylate, leveling agent and reactive diluent in step 1) evenly, and the speed of the mixer is 1000-1800 rpm to obtain Reactive resin, and the reactive resin and photoin...

Example Embodiment

[0048] Example 3

[0049] An ultraviolet light curing composition for LED encapsulation, each component and the weight percentage content of each component are:

[0050] Polyurethane-acrylic-epoxy photosensitive prepolymer 30%

[0051] Epoxy Acrylate 30%

[0052] DAROCUR11733%

[0053] Polyacrylate and Acrylic Urethane Resins 1%

[0054] The balance is lauryl (meth)acrylate and propyl (meth)acrylate.

[0055] A preparation method of an ultraviolet light curing composition for LED encapsulation, comprising the steps of:

[0056] Step 1) take polyurethane-acrylic acid-epoxy resin photosensitive prepolymer, epoxy resin acrylate, photoinitiator, leveling agent and reactive diluent in proportion,

[0057] Step 2) Stir the polyurethane-acrylic acid-epoxy resin photosensitive prepolymer, epoxy resin acrylate, leveling agent and reactive diluent in step 1) evenly, and the speed of the mixer is 1000-1800 rpm to obtain Reactive resin, and the reactive resin and photoinitiator are ...

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PUM

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Abstract

The invention relates to the technical field of LED packaging, and particularly relates to an ultraviolet-curing composition for LED packaging. The ultraviolet-curing composition comprises the following components: a polyurethane-acrylate-epoxy resin photosensitive prepolymer, epoxy resin acrylate, a light initiator, a flatting agent and an active diluent. According to the ultraviolet-curing composition for LED packaging disclosed by the invention, a certain amount of epoxy resin acrylate is added in the composition, so that the adhesive property of the composition after being cured is effectively improved; the adhesive has the advantages of excellent high and low-temperature resistance, high aging resistance and transparency, good formability, good bonding property, mild curing conditions, and the like.

Description

technical field [0001] The invention relates to the technical field of LED sealing, in particular to an ultraviolet light curing composition for LED packaging. Background technique [0002] Ultraviolet curing (UV curing) technology is characterized by environmental protection and fastness. Compared with thermal curing technology, the advantages of UV curing technology are fast and low energy consumption. Solvent-based adhesives usually require an inert solvent, which is a volatile organic compound, and the curing reaction speed is slow at room temperature. Although the curing time can be shortened when heated, it consumes a lot of energy. UV curing adhesive is to use light irradiation to make the adhesive quickly cure through free radical reaction to achieve the purpose of bonding, sealing, fixing, etc. Different from ordinary adhesives, UV-curable adhesives generally require at least one side of the substrate to be transparent, and generally allow irradiated light to pass ...

Claims

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Application Information

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IPC IPC(8): C09J163/10C09J175/14C09J11/06C09J11/08H01L33/56
Inventor 严加彬
Owner 江苏华程光电科技有限公司
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