Preparation method of cathode electrophoresis resin diamond wire saw

A diamond wire saw and cathodic electrophoresis technology, applied in electrolytic coatings, coatings, etc., can solve the problem of difficult control of surface roughness and surface shape accuracy of processed crystals, difficult control of coating thickness and amount of sand, uneven diamond dispersion, etc. problem, to achieve the effect of improving photoelectric conversion efficiency, saving resources, and simple post-processing

Active Publication Date: 2014-09-10
SHANDONG UNIV OF SCI & TECH
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, it has the following disadvantages: high consumption of abrasive mortar and difficulty in processing and recycling, difficulty in controlling the surface roughness and surface shape accuracy of processed crystals, low wire speed of wire saw, and short service life of saw wire, etc.
[0006] The existing resin bond diamond wire saw is mainly prepared by the coating method. In the process of wire saw preparation, in addition to modifying the base resin to meet the performance requirements of the wire saw, it is also necessary to add diluents, curing agents and various additives. Agents (such as leveling agents, defoamers, etc.) to achieve diamond dispersion and meet coating requirements, but the inactive diluents used in this method are generally organic solvents (such as acetone, n-butanol, etc.), during the curing process The solvent in the medium will volatilize and pollute the environment; in addition, the coating thickness and sanding amount are not easy to control and the diamond dispersion is not uniform in the preparation process of the coated diamond wire saw, which is easy to cause waste of diamond abrasives, which is not conducive to industrial production

Method used

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  • Preparation method of cathode electrophoresis resin diamond wire saw
  • Preparation method of cathode electrophoresis resin diamond wire saw
  • Preparation method of cathode electrophoresis resin diamond wire saw

Examples

Experimental program
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Effect test

Embodiment 1

[0048] The present invention, the preparation method of diamond wire saw, comprises the following steps:

[0049] Step 1. Preparation of cathodic electrophoresis resin emulsion with diamond suspended, i.e. electrophoretic fluid:

[0050] 1. Preparation of curing agent: In a three-necked flask equipped with 40g of TDI, add 1g of catalyst dibutyltin dilaurate, 30g of solvent ethylene glycol monobutyl ether and 22g of blocking agent methyl ethyl ketoxime, wherein the catalyst contains 10% Ethylene glycol monobutyl ether solution of dibutyltin dilaurate; then control the temperature at 40°C for 0.5h, 50°C for 2h, and 80°C for 4h;

[0051] 2. Prepare the main resin:

[0052] First, add 70g of epoxy resin and 20.9g of ethylene glycol monobutyl ether into the three-necked flask, raise the temperature to 80°C, keep stirring for 0.5h until the epoxy resin is completely dissolved;

[0053] Next, carry out ring-opening modification reaction with 11.1g diethanolamine, 41.8g polyamide an...

Embodiment 2

[0065] The difference from Example 1 is that in step 1, a certain amount of deionized water is used to dilute to a solid content of 19%;

[0066] The diamond wire saw prepared in this example has a uniform diameter from the appearance. Randomly intercept a section of diamond wire saw with good appearance. Take a detection point every 5cm, and take ten points in total. The measured wire saw The average value of the outer diameter is 0.204mm, and the thickness of the resin layer is 12μm. The resin layer is smooth, without scratches, and without balling; under the ultra-depth microscope, it is found that the diamond embedded in the resin layer is about 1 / 2 to 2 / 3 ; The density distribution of diamond particles is moderate and uniform.

Embodiment 3

[0068] The difference from Example 1 is that in step 1, a certain amount of deionized water is used to dilute to a solid content of 20%;

[0069] The diamond wire saw prepared in this example has a uniform diameter from the appearance; randomly intercept a section of diamond wire saw with good appearance, take a detection point every 5cm, take ten in total, and measure the diameter of the wire saw The average value of the outer diameter is 0.206mm, and the thickness of the resin layer is 13μm. The resin layer is flat, without scratches, and without balling; however, it is found that the diamond embedded in the resin layer is about 2 / 3 under the ultra-depth-of-field microscope; the diamond particle density evenly distributed;

[0070] The diamond wire saws prepared in the above-mentioned embodiment 1, embodiment 2 and embodiment 3 were respectively subjected to the following cutting test, and the stx-24 reciprocating diamond wire saw was used for cutting, and the number of wire...

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Abstract

The invention discloses a preparation method of a diamond wire saw, and belongs to the preparation field of the diamond wire saw. An electrophoresis method is adopted to prepare the diamond wire saw; firstly, cathode electrophoresis resin emulsion is prepared; then, diamond is added in the prepared emulsion; an intermittent mixing manner is adopted to evenly suspend the diamond in the emulsion; a pretreated saw wire passes through the diamond-contained emulsion through an electrophoresis manner; the steps, such as pre-curing and deep curing, are performed for the saw wire; and finally, the diamond wire saw is prepared. The diamond wire saw, prepared by the method, has the advantages of small diamond usage, uniform sand loading, easy control of resin layer thickness and even resin layer, and is superior to a resin binder diamond wire saw in such aspects as abrasive grain holding force and wear resistance.

Description

technical field [0001] The invention belongs to the field of diamond wire saw preparation, and in particular relates to a diamond wire saw prepared by mixing cathodic electrophoresis resin emulsion and treated diamond, and then electrophoresis. Background technique [0002] With the rapid development of industries such as semiconductors and solar cells, hard and brittle materials such as silicon and quartz crystals are widely used. In order to reduce production costs, the diameter of processed crystals is gradually increasing, and the requirements for cutting technology are getting higher and higher. Therefore, ordinary processing methods are difficult to meet the cutting needs of precision substrates. [0003] Wire saw cutting has attracted people's attention because of its high quality, low loss, and unaffected by crystal size. Free abrasive wire saw cutting technology has become the first method that people pay attention to. This method can better solve the problem of cut...

Claims

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Application Information

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IPC IPC(8): C25D15/00C25D5/48
Inventor 徐冬梅高军李慧敏李敏王宏陈成龙张治山
Owner SHANDONG UNIV OF SCI & TECH
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