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A kind of preparation method of ultra-thin nanoporous copper foil

A nanoporous copper foil, ultra-thin technology, applied in the direction of nanotechnology, can solve the problems of poor mechanical properties of porous copper, complex process, poor quality of porous copper, etc., to meet the requirements of large-scale production, simple preparation process, good mechanical properties Effect

Active Publication Date: 2016-06-01
SHANGHAI JIAO TONG UNIV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

However, the process of this method is complicated, and the melting process requires high equipment and is easy to cause copper oxidation. The later corrosion process causes waste of resources, increases the cost of preparation, and is difficult to corrode all eutectic elements. pure porous copper
The hydrogen bubble dynamic template electrodeposition method has a simple preparation process and low cost, but the porous copper obtained has poor mechanical properties, and it is difficult to control the particle size and pore size of the porous copper.
Although the organic slurry coating method is quite simple in operation and low in cost, the quality of the obtained porous copper is poor, and the particle size and pore size and uniformity are difficult to control

Method used

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  • A kind of preparation method of ultra-thin nanoporous copper foil
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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0028] A preparation method of ultra-thin nanoporous copper foil, comprising the steps of:

[0029] (1) Preparation of Cu-containing precursor body fluid: First, add 0.8 g of copper acetate monohydrate to a certain amount of deionized water; secondly, add an aqueous solution containing 1.6 g of sodium hydroxide to the above Cu 2+ In the ionic solution, a light blue emulsion was obtained; again, 5 mL of ethylene glycol was added to the above solution; finally, a certain amount of deionized water was added to make the total volume 40 mL. Stir continuously during the whole process, and finally stir for about 1 h.

[0030] (2) Put the above-mentioned precursor liquid into the autoclave and seal it, then put the autoclave into a furnace set at 140°C in advance, take out the autoclave after reacting for 12 hours, and let it cool naturally.

[0031] (3) Open the reaction kettle, and the flakes attached to the wall of the reaction kettle are ultra-thin nanoporous copper foils. After ...

Embodiment 2

[0035] A preparation method of ultra-thin nanoporous copper foil, comprising the steps of:

[0036] (1) Preparation of Cu-containing precursor body liquid: first, 0.5g of copper sulfate pentahydrate was added to a certain amount of deionized water; secondly, an aqueous solution containing 8g of sodium hydroxide was added to the above Cu 2+In the ionic solution, a light blue emulsion was obtained; again, 2 mL of ethylene glycol was added to the above solution; finally, 5 mL of ethanol and a certain amount of deionized water were added to make the total volume 40 mL. Stir continuously during the whole process, and finally stir for 30 min.

[0037] (2) Put the above-mentioned precursor liquid into a high-pressure reactor and seal it, then put the reactor into a furnace set at 250°C in advance, take out the reactor after 14 hours of reaction, and let it cool naturally.

[0038] (3) Open the reaction kettle, and the flakes attached to the wall of the reaction kettle are ultra-thin...

Embodiment 3

[0041] A kind of ultra-thin nanoporous copper foil obtains by following steps:

[0042] (1) Preparation of Cu-containing precursor body fluid: First, 1.6g of copper acetate monohydrate was added to a certain amount of deionized water; secondly, an aqueous solution containing 0.16g of sodium hydroxide was added to the above Cu 2+ In the ionic solution, a light blue emulsion was obtained; again, 15 mL of ethylene glycol was added to the above solution; finally, a certain amount of deionized water was added to make the total volume 40 mL. The whole process needs to be stirred continuously, and finally stirred for 1h.

[0043] (2) Put the above-mentioned precursor liquid into a high-pressure reactor and seal it, then put the reactor into a furnace set at 200°C in advance, take out the reactor after reacting for 16 hours, and let it cool naturally.

[0044] (3) Open the reaction kettle, and the flakes attached to the wall of the reaction kettle are ultra-thin nanoporous copper foi...

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Abstract

The invention discloses an ultrathin nano-porous copper foil preparation method. With the adoption of the hydrothermal method, a precursor liquor containing Cu<2+> reacts for hours in a sealed high pressure reactor at a certain temperature to obtain ultrathin nano-porous copper foil on the inner wall of the sealed high pressure reactor. According to the invention, the preparation method is simple in process, safe, reliable, non-poisonous, non-pollution and lower in cost; the obtained nano-porous copper foil is unstayed, and has thickness of 1.0-3.0 microns and size of dozens of square centimeters as well as better mechanical properties; ultrathin nano-porous copper foils with different grain diameters and apertures by adjusting the concentration, reaction temperature and time of all components of the precursor liquor so as to meet demands of multiple purposes.

Description

technical field [0001] The invention belongs to the technical field of preparation of nanomaterials, and in particular relates to a preparation method of ultra-thin nanoporous copper foil. Background technique [0002] Nanoporous metal is a special metal material with nanometer-sized pores, so it not only has the singular characteristics of nanomaterials, but also retains the excellent physical and chemical properties of metal materials. In recent years, the research of various porous metals has attracted extensive attention of researchers, showing that they have great application prospects in the fields of catalysts, electrode materials, sensors, surface-enhanced Raman scattering substrates, and hydrogen storage. As a low-cost and environmentally friendly metal material, porous copper has aroused great interest of researchers for its excellent physical and chemical properties. [0003] The Chinese patent application with publication number CN102943187A discloses a method f...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B22F9/24B22F5/00B82Y40/00
Inventor 张亚非李明苏言杰耿会娟
Owner SHANGHAI JIAO TONG UNIV
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