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Oyster shell/fluorapatite composite conductive silver paste and preparation method thereof

A technology of fluoroapatite and conductive silver paste, which is applied in the manufacture of cables/conductors, conductive materials dispersed in non-conductive inorganic materials, circuits, etc., which can solve poor soldering resistance, poor sintering performance, and low adhesion And other problems, to achieve the effect of good temperature and humidity resistance, strong adhesion, and reduce production costs

Active Publication Date: 2014-11-12
李伟志
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

The characteristics that conductive silver paste needs to have are: good conductivity (antistatic property), strong adhesion, good printing adaptability and excellent solvent resistance. However, the existing conductive silver paste on the market has many shortcomings, not only containing lead , cadmium, etc. and are toxic, pollute the environment, and when used on conductive substrates, the adhesion is low, the soldering resistance is not good, and the sintering performance is poor

Method used

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Examples

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Embodiment Construction

[0012] The composite conductive silver paste of oyster shell / fluoroapatite is characterized in that it is made of the following raw materials in parts by weight: silver powder 44, kaolin 4, oyster shell 1, fluoroapatite 3, methylene Sodium dinaphthalene sulfonate 1.5, hydrogenated castor oil 0.8, aluminum potassium sulfate 1.6, germanium dioxide 2.7, linolenic acid 4, additives 37.

[0013] The auxiliary agent is made of the following raw materials in parts by weight: aluminum oxide 2, boron oxide 4, polyvinyl alcohol 7, rosin 15, 3-aminopropyltrimethoxysilane 1.5, polydimethylsiloxane 0.3 , acetone 12, cyclohexanone 8, the preparation method is to put aluminum oxide and boron oxide in a calciner and calcinate at 520-610°C for 1-2 hours, take it out and cool to room temperature, add polyvinyl alcohol and grind for 20- 40 minutes; mix cyclohexanone and rosin, react at 100-120°C for 2-3 hours, cool to 40-50°C, add acetone, 3-aminopropyltrimethoxysilane, polydimethylsiloxane , k...

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PUM

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Abstract

The invention discloses oyster shell / fluorapatite composite conductive silver paste and a preparation method of the oyster shell / fluorapatite composite conductive silver paste. The oyster shell / fluorapatite composite conductive silver paste is characterized by comprising, by weight, 40-50 parts of silver powder, 2-4 parts of kaolin, 1-3 parts of oyster shells, 3-5 parts of fluorapatite, 1.2-2.4 parts of NNO, 0.8-1.4 parts of hydrogenated castor oil, 0.7-1.6 parts of aluminium potassium sulfate, 1.2-2.7 parts of germanium dioxide, 4-7 parts of linoleic acid and 30-40 parts of additives. The oyster shells, the fluorapatite and the like are modified and then are added to a raw material, the cost is lowered, the requirement of devices for the electric performance can be met on the condition of low silver content, the adhesive force between the conductive silver paste and a printed material is high, temperature resistance and humidity resistance are good, the fine line printing performance is excellent, and the production cost of the paste is lowered remarkably.

Description

technical field [0001] The invention relates to the field of conductive silver paste, in particular to an oyster shell / fluoroapatite composite conductive silver paste and a preparation method thereof. Background technique [0002] Conductive silver paste refers to the silver paste printed on the conductive substrate to make it have the ability to conduct current and eliminate the accumulated static charge. It is generally printed on non-conductive substrates such as plastic, glass, ceramics or cardboard. It is made of conductive Filler, binder, solvent and additive composition. The characteristics that conductive silver paste needs to have are: good conductivity (antistatic property), strong adhesion, good printing adaptability and excellent solvent resistance. However, the existing conductive silver paste on the market has many shortcomings, not only containing lead , cadmium, etc., are toxic, pollute the environment, and when used on conductive substrates, have low adhesi...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/16H01B1/22H01B13/00
Inventor 蒋智谋周施峰周梅永胡加峰谢水兵张超崔海威吴华董子侠
Owner 李伟志
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