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Preparation method for high-temperature-resistant ceramic precursor adhesive

A technology of high-temperature-resistant ceramics and precursors, applied in the direction of non-polymer adhesive additives, adhesives, adhesive additives, etc., can solve high-temperature oxidation resistance, unsatisfactory long-term temperature resistance, gaps in distance requirements, and limitations Issues such as the scope of application to achieve the effect of avoiding adverse effects, reducing pollution, and wide application prospects

Active Publication Date: 2014-12-10
NAT UNIV OF DEFENSE TECH
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Although these measures have improved the performance of the original materials to a certain extent, there is still a considerable gap from the requirements. For example, Si, Ti, B and other heteroatoms are introduced into the phenolic resin. 4 The formation of ceramic phases such as C can improve the instantaneous high temperature resistance of the binder, but due to the presence of a large amount of carbon, its high temperature oxidation resistance and long-term temperature resistance are not satisfactory, and this type of resin generally has a curing temperature The high problem limits its scope of application

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0020] Add 69g (3mol) metal sodium and toluene to a three-necked flask equipped with a condensing reflux device and a mechanical stirring device, heat to 100°C under the protection of an inert atmosphere, and then dropwise add methyldichlorosilane (CH 3 SiHCl 2 ) 117g (1mol), after the dropwise addition, keep the temperature at 100°C for 4h, filter and distill off the organic solvent to obtain liquid polymethylsilane with a viscosity of 76mPa·s;

[0021] Add 30g of liquid polymethylsilane and 30g of tetramethyldivinyldisilazane into a 250mL three-neck flask equipped with a condensing reflux device and a mechanical stirring device, raise the temperature of the reaction system to 180°C, stir mechanically, and keep warm for 2 hours , to obtain 58.8g yellow viscous polycarbosilazane precursor, the whole reaction process is under the protection of nitrogen;

[0022] Add 40 g of boron carbide powder with a particle size of 2.5-3.5 μm and 10 g of nano-silicon dioxide with a particle...

Embodiment 2

[0024] Add 80.5g (3.5mol) metal sodium and toluene to a three-necked flask equipped with a condensing reflux device and a mechanical stirring device, heat to 80°C under the protection of an inert atmosphere, and then dropwise add methyldichlorosilane (CH 3 SiHCl 2 ) 174.5g (1.5mol), after the dropwise addition, keep the temperature at 80°C for 8h, filter and distill off the organic solvent to obtain liquid polymethylsilane with a viscosity of 16.9mPa·s;

[0025] Add 40g of liquid polymethylsilane and 60g of tetramethyldivinyldisilazane into a 250mL three-neck flask equipped with a condensing reflux device and a mechanical stirring device, raise the temperature of the reaction system to 180°C, stir mechanically, and keep warm for 4 hours , to obtain 96.1g yellow viscous polycarbosilazane precursor, the whole reaction process is under the protection of nitrogen;

[0026] Add 80 g of zirconium diboride powder with a particle size of 10-40 μm and 20 g of nano-titanium dioxide pow...

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Abstract

The invention discloses a preparation method for a high-temperature-resistant ceramic precursor adhesive. The preparation method comprises the following steps of (1) adding metal sodium and methylbenzene into a three-opening flask with a condensation backflow device and a mechanical stirring device, heating to 80-120 DEG C under the protection of inert atmosphere, dropping methyl dichloresilane, preserving the heat of 80-140 DEG C for 2-4 hours after dropping is finished, and filtering and distilling to remove an organic solvent to obtain liquid polymethylsilane; (2) mixing liquid polymethylsilane and tetramethyldivinyldisilazane according to a mass ratio of 1:(1 to 10), preserving the heat of 100-250 DEG C for 1-10 hours under the protection of inert atmosphere, and obtaining a liquid polymethylsilane precursor; (3) respectively adding a micron-level inorganic filler and a nano-level inorganic filler into the liquid polymethylsilane precursor, and uniformly mixing to obtain the high-temperature-resistant ceramic precursor adhesive. The ceramic precursor adhesive is high in bonding strength and excellent in heat resistance, and has a wide application prospect in adhering of ceramic materials and carbon materials.

Description

technical field [0001] The invention relates to a preparation method of a high temperature resistant ceramic precursor binder. Background technique [0002] Binders are mainly divided into two categories: inorganic and organic. Inorganic binders are composed of inorganic salts, inorganic acids, inorganic alkalis, metal oxides, hydroxides, etc. The most commonly used are silicate and phosphate binders, which have excellent high temperature resistance, generally resistant to 900-1000°C , can be used in the range of -183 ~ 2900 ℃, its advantages are small shrinkage, good aging resistance, but there are disadvantages of acid and alkali resistance, poor water resistance, high brittleness, poor impact resistance, and it is not good for many substrates The materials are corrosive, and these drawbacks limit their use in certain high-tech fields. [0003] There are many kinds of organic binders, which are distinguished according to the main polymer, mainly including: (1) epoxy resi...

Claims

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Application Information

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IPC IPC(8): C09J183/16C09J11/04C08G77/62
Inventor 王小宙王军王浩简科
Owner NAT UNIV OF DEFENSE TECH
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