A kind of graphene organic silver conductive ink and preparation method thereof

A conductive ink and organic silver technology, applied in inks, household appliances, applications, etc., can solve the problems of unstable organic silver, increase production cost, poor dispersion, etc., improve bending resistance, reduce ink cost, and improve electrical conductivity. control effect
CN104263082BInactive Publication Date: 2017-05-24NANJING UNIV OF AERONAUTICS & ASTRONAUTICS

Patent Information

Authority / Receiving Office
CN Β· China
Patent Type
Patents(China)
Current Assignee / Owner
NANJING UNIV OF AERONAUTICS & ASTRONAUTICS
Publication Date
2017-05-24
Estimated Expiration
Not applicable Β· inactive patent
Patent Text Reader

Abstract

The invention discloses a graphene organic silver conductive printing ink and a preparation method thereof. The conductive printing ink comprises a conductive function unit precursor, an organic silver complexing agent, an adhesive, a solvent and auxiliaries. The preparation method comprises the following steps: (A) stirring and ultrasonically dispersing the organic silver, the solvent and the organic silver complexing agent under a lucifugal condition to obtain an organic silver complexing solution; and (B) putting the graphene, the resin adhesive, the auxiliaries and the organic silver complexing solution in the lucifugal condition and stirring and ultrasonically dispersing in an environment lower than 10 DEG C, wherein the obtained uniform mixture is the graphene organic silver conductive printing ink. The graphene organic silver conductive printing ink prepared by the method disclosed by the invention is low in solid content, good in stability, good in printing performance and wide in application.
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Description

technical field

[0001] The invention relates to the field of conductive ink, in particular to a graphene organic silver conductive ink and a preparation method thereof. Background technique

[0002] With the rapid development of science and technology and the large-scale use of integrated circuits, microelectronic devices are becoming more and more miniaturized, and electronic circuits such as printed circuits, smart labels, flexible display devices, and sensors are also developing towards miniaturization, refinement, and diversity. There are more and more types of corresponding printing methods and substrates. Printing methods include screen printing methods, gravure printing methods, etching methods, spin coating methods, electroplating methods, chemical vapor deposition methods, inkjet printing methods, direct pen writing methods, etc.; as printed substrates, they can be divided into rigid substrates Materials, such as glass, metal, semiconductor, silicon wafer, ceramics...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
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