Method for packaging Ni-P substrate
A packaging method and substrate technology, which is applied in the manufacture of electrical components, electrical solid devices, semiconductor/solid devices, etc., can solve the problems of large substrate resin damage, limitation, and long processing time, and achieve low cost, suppress delamination, and reduce The effect of growth rate
- Summary
- Abstract
- Description
- Claims
- Application Information
AI Technical Summary
Problems solved by technology
Method used
Image
Examples
Embodiment 1
[0048] Precisely prepare nano-nickel powder (particle size range 80-100nm) mass percentage is 5%, no-cleaning flux mass percentage is 95% mixed flux; -2 Pa) Stirring for 1h at a stirring speed of 200r / min to obtain a mixed flux containing nano-Ni powder that is uniformly mixed; before packaging, uniformly print a layer of mixed flux with a thickness of 15 μm on a Ni-P plate with a thickness of 10 μm, Then print a Sn-3.5Ag (wt.%) solder paste with a thickness of 400 μm on the Ni-P substrate; place the Ni-P substrate in a magnetic induction gradient of 3×10 4 G / m, the magnetic field source is located inside the substrate, and in a magnetic field with a magnetic induction intensity of 1000G at the welding interface, the welding atmosphere is 99.99% high-purity nitrogen, the airflow rate is 1500ml / min, and the heating rate during reflow soldering is 5°C / s. Activate at 160°C for 10s, reach a peak temperature of 250°C, reflow at the peak temperature for 120s, and cool to room temper...
Embodiment 2
[0051] Accurately prepare nickel powder (particle size range 60-100nm) mass percentage is 15%, no-cleaning flux mass percentage is 85% mixed flux; -2 Pa), stirred at a stirring speed of 150r / min for 1h to obtain a mixed flux containing nano-Ni powder; before packaging, evenly print a layer of mixed flux with a thickness of 10 μm on a Ni-P plate with a thickness of 10 μm , and then print Sn-3.5Ag (wt.%) solder paste with a thickness of 500 μm on the Ni-P substrate; place the Ni-P substrate in a magnetic induction gradient of 5×10 4 G / m, the magnetic field source is located inside the substrate, and in a magnetic field with a magnetic induction intensity of 2000G at the welding interface, the welding atmosphere is 99.99% high-purity nitrogen, the airflow rate is 2000ml / min, and the heating rate during reflow soldering is 10°C / s. Activate at 180°C for 10s, reach a peak temperature of 250°C, reflow at the peak temperature for 120s, and cool to room temperature at a cooling rate of...
Embodiment 3
[0054] Accurately prepare nickel powder (particle size range 50-80nm) mass percentage is 10%, no-clean flux mass percentage is 90% mixed flux; in a mixer (vacuum degree 1.5 × 10 -2 Pa), stirred at a stirring speed of 300r / min for 0.5h to obtain a mixed flux containing nano-Ni powder mixed uniformly; before packaging, uniformly print a layer of mixed flux with a thickness of 10 μm on a Ni-P plate with a thickness of 10 μm flux, and then print a thickness of 500 μm Sn-3.5Ag (wt.%) solder paste on the Ni-P substrate; the Ni-P substrate is placed in a magnetic induction gradient of 4 × 10 4 G / m, the magnetic field source is located inside the substrate, and in a magnetic field with a magnetic induction intensity of 1500G at the welding interface, the welding atmosphere is 99.99% high-purity nitrogen, the airflow rate is 3000ml / min, and the heating rate during reflow soldering is 8°C / s. Activate at 160°C for 15s, reach a peak temperature of 250°C, reflow at the peak temperature for...
PUM
Property | Measurement | Unit |
---|---|---|
particle size | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
thickness | aaaaa | aaaaa |
Abstract
Description
Claims
Application Information
- R&D Engineer
- R&D Manager
- IP Professional
- Industry Leading Data Capabilities
- Powerful AI technology
- Patent DNA Extraction
Browse by: Latest US Patents, China's latest patents, Technical Efficacy Thesaurus, Application Domain, Technology Topic, Popular Technical Reports.
© 2024 PatSnap. All rights reserved.Legal|Privacy policy|Modern Slavery Act Transparency Statement|Sitemap|About US| Contact US: help@patsnap.com