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Polyimide layer-containing flexible substrate, polyimide layer-containing substrate for flexible solar cell, flexible solar cell, and method for producing same

A polyimide layer, solar cell technology, applied in the direction of final product manufacturing, chemical instruments and methods, sustainable manufacturing/processing, etc., can solve the problems of insufficient heat resistance, adverse effects of photoelectric efficiency, and lack of flexibility of substrates , to achieve the effect of preventing penetration and diffusion and good photoelectric efficiency

Inactive Publication Date: 2015-01-14
NIPPON STEEL CHEM &MATERIAL CO LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

At this time, when a metal alloy such as aluminum is used as the substrate, there is a problem that the metal component permeates and diffuses into the photoelectric conversion layer through the insulating layer to adversely affect the photoelectric efficiency, and the technology of Patent Document 2 cannot solve this problem.
In addition, the technology of Patent Document 3 has flexibility in the flexible connector part, but lacks flexibility in the entire substrate
In addition, there is a disadvantage of insufficient heat resistance during sintering of the photoelectric conversion layer.

Method used

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  • Polyimide layer-containing flexible substrate, polyimide layer-containing substrate for flexible solar cell, flexible solar cell, and method for producing same
  • Polyimide layer-containing flexible substrate, polyimide layer-containing substrate for flexible solar cell, flexible solar cell, and method for producing same
  • Polyimide layer-containing flexible substrate, polyimide layer-containing substrate for flexible solar cell, flexible solar cell, and method for producing same

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no. 1 approach

[0045] use figure 1 Embodiments of the present invention will be described.

[0046] The first embodiment of the present invention is a flexible substrate 10 containing a polyimide layer having a metal substrate and a polyimide layer 3, the metal substrate is made of ordinary steel or stainless steel ( Hereinafter, it is composed of a metal foil 1 abbreviated as SUS, and the polyimide layer 3 is formed on a metal substrate with a layer thickness of 1.5 to 100 μm and a glass transition temperature of 300 to 450° C.

[0047] For polyimide monomers, barrier properties, especially to gaseous components such as moisture and oxygen, cannot be ensured. Therefore, if no additional barrier film is provided, the intrusion of other components from the outside such as gas components will lead to poor performance. Reduced, so as the substrate of the device, its suitability is insufficient. In addition, the strength of the polyimide monomer is not necessarily sufficient, and due to the ad...

no. 2 approach

[0054] In CIGS solar cells, if metal elements, especially Fe atoms, diffuse into the power generation layer, the conversion efficiency will decrease, and if metal is used instead of glass as the base material, it will prevent F e The diffusion of atoms becomes particularly important. In order to solve this problem, there may be a flexible substrate containing a polyimide layer as the second embodiment of the present invention, which has a metal substrate and a polyimide layer 3, and the metal substrate is not a metal foil made of ordinary steel or SUS. 1 is directly laminated with heat-resistant polyimide, but on the surface of metal foil 1 of ordinary steel or SUS, there is a metal layer composed of one of copper, nickel, zinc or aluminum or an alloy layer thereof (hereinafter referred to as It is a metal layer or alloy layer 2), the polyimide layer 3 is formed on the metal layer or alloy layer 2, the layer thickness is 1.5-100 μm, and the glass transition temperature is 300-...

no. 3 approach

[0062] Metal foils with metal layers containing aluminum (hereinafter, sometimes abbreviated as "Al") produced by conventional techniques tend to be less flexible than metal foils with metal layers containing Cu, Ni, or Zn. This is because, in general, when aluminum or aluminum-based plating is performed on an ordinary steel layer or a SUS layer to form a metal layer or an alloy layer 2, the metal foil 1 composed of an ordinary steel layer or SUS and the metal containing Al layer or the interface of the alloy layer 2, a Fe-Al alloy layer 4 (for example, FeAl 3 , Fe 2 al 8 Si, FeAl 5 Si and other intermetallic compounds), the Fe-Al alloy layer 4 is very hard and brittle, and if the coated steel or SUS undergoes extreme elastic-plastic deformation during processing, the Fe-Al alloy layer 4 cannot follow the Deformation of the metal foil layer 1 eventually causes peeling of the metal foil 1 and the metal layer or alloy layer 2 containing Al and cracking of the metal layer or a...

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Abstract

Provided is a flexible substrate which can be used for multiple purposes, which has heat resistance in that it is capable of withstanding a high temperature such as during sintering of the photoelectric conversion layer of a compound-based thin-film solar cell and with which it is possible to prevent metal penetration and diffusion in the photoelectric conversion layer. In the present invention, a polyimide layer-containing flexible substrate is obtained by forming a polyimide layer having a layer thickness of 1.5-100 µm and a glass transition point temperature of 300-450ºC on a metal substrate that is a metal foil of ordinary steel or stainless steel having a thermal expansion coefficient in the plane direction of 15 ppm / K or less, or on a metal substrate having, on the surface of a metal foil of ordinary steel or stainless steel, a metal layer formed from one selected from the group consisting of copper, nickel, zinc, and aluminum, or an alloy layer of those.

Description

technical field [0001] The present invention relates to a polyimide layer-containing flexible substrate suitable as a solar cell substrate and a printed wiring board, a polyimide layer-containing substrate for a flexible solar cell, a flexible solar cell using the same, and methods for producing the same. Background technique [0002] As solar cells, various solar cells such as monocrystalline silicon solar cells using silicon, polycrystalline silicon solar cells, or compound semiconductor solar cells, dye-sensitized solar cells, and organic thin-film solar cells have been developed. Of course, these solar cells are required to have high photoelectric conversion efficiency, and light weight, high durability, and flexibility that can be freely bent are constantly required along with the development of various applications. [0003] As the demand for such high flexibility increases, attention has been drawn to compound-based thin-film solar cells using flexible substrates. So...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B32B15/08B05D1/00B05D3/02H01L31/04H01L31/18
CPCC08G73/105H01L31/03926Y02E10/542H01L31/03923C08G73/1071H01L31/03928C08G73/1042C09D179/08H01L31/03921C08G73/1067H01L31/0392B32B15/088Y02E10/541B05D1/00B05D3/02B32B15/08H01L31/04H01L31/18B32B15/012B32B15/013B32B15/015C22C38/001C22C38/002C22C38/004C22C38/02C22C38/04C22C38/06C22C38/12C22C38/14Y02P70/50H01L31/1884
Inventor 服部公一平石克文太田拓平寺嶋晋一须田秀昭黑崎将夫田中将元长崎俢司水山淳
Owner NIPPON STEEL CHEM &MATERIAL CO LTD
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