Hall element and preparation method thereof
A Hall element, AlGaAs technology, applied in the field of Hall element based on two-dimensional electron gas and its preparation, can solve the problem of low lattice quality of isolation layer and barrier layer
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[0018] First, a GaAs single crystal substrate is selected, and a 10nm AlAs sacrificial layer is grown on the substrate by metal organic chemical vapor deposition (MOCVD) or molecular beam epitaxy (MBE), and then a 30nm N Type planar doped Al x Ga 1-x As barrier layer, 3nm intrinsic Al x Ga 1-x As space isolation layer and 12nm intrinsic In x Ga 1-x As channel layer.
[0019] After the growth is completed, the epitaxial wafer is taken and adhered to a flexible film. Then soak in the hydrofluoric acid solution to etch the sacrificial layer AlAs to realize the separation of the epitaxial functional layer from the substrate. After simple processing, the substrate can continue to be used for epitaxial growth.
[0020] The peeled epitaxial wafer is adhered to a rigid support substrate to facilitate subsequent process operations. Using the traditional Hall element process, the electrodes are photoetched picture shape, vapor deposition of gold (Au)-germanium (Ge)-nickel (Ni)...
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