Organic light emitting diode device encapsulation drying agent and encapsulation application method thereof

A light-emitting diode and device packaging technology, which is applied in the fields of organic light-emitting devices, organic light-emitting device structures, organic light-emitting device manufacturing/processing, etc., can solve the problems of high manufacturing cost, complicated process, low moisture absorption rate of calcium oxide, etc., and achieve cheap raw materials , increase specific surface area, good drying effect

Active Publication Date: 2015-03-11
北京大学包头创新研究院
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  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0005] The technical problem actually solved by the present invention is that, in the prior art, the process of pasting the flake desiccant on the inner layer of the cover plate of the organic light-emitting diode device is complicated and the manufacturing cost is high; When barium is in the inner layer of the cover plate, the moisture absorption rate of simple calcium oxide is low, and barium oxide is toxic and affects the use

Method used

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  • Organic light emitting diode device encapsulation drying agent and encapsulation application method thereof

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preparation example Construction

[0025] In a preferred embodiment of the present invention, the present invention provides a method for preparing a desiccant for encapsulating OLED devices. An oxide film is coated on the OLED encapsulating cover plate by a simple spin coating method, and then baked at a low temperature. Dry to obtain a desiccant layer. The desiccant film is prepared as a desiccant coating solution by using calcium oxide microcrystals, calcium chloride and a film-forming agent, and then is coated on the inner layer of the package cover by spin coating. The thickness of the desiccant film is 2-10 μm. In the present invention, the film thickness refers to the thickness of a coating film formed after coating the coating liquid on the device and drying it.

[0026] Compared with traditional drying sheets, this method is simple to operate, easy to prepare, cheap and easy to obtain raw materials, convenient to store, and good in stability. Compared with other thin film desiccants, the coating liqui...

Embodiment 1

[0033] Take 5g of calcium chloride and 20g of emulsion-type epoxy film-forming agent, mix well, dissolve in acetone to form a saturated solution of calcium chloride, mix well, add calcium oxide microcrystals with a particle size of 0.1-0.5μm , and make the molar ratio of chloride and calcium oxide in the coating solution to be 1:7, and repeatedly apply the coating solution to the inner layer of the OLED cover plate through a glue leveler, and obtain a 5 μm thick desiccant layer after drying. Put the desiccant cover into the drying oven and dry at 100°C for 15 minutes.

Embodiment 2

[0035] Take 7g of magnesium chloride and 20g of acrylic resin film-forming agent, mix well, dissolve in ethanol to form a saturated solution of magnesium chloride, mix well, add calcium oxide microcrystals with a particle size of 0.1-0.5μm, and make the coating solution The molar ratio of chloride to calcium oxide is 1:5, and the coating liquid is repeatedly coated on the inner layer of the OLED cover through a glue leveler, and after drying, a 3 μm thick desiccant layer is obtained, and the cover coated with the desiccant is placed Put into a drying oven and dry at 100°C for 20 minutes.

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Abstract

The invention relates to the field of organic light emitting diode device encapsulation and provides an organic light emitting diode device encapsulation drying agent and an encapsulation application method thereof. The drying agent is characterized by comprising, by weight, 4-7 parts of chloride, nano calcium oxide microcrystal, and 15-70 parts of film forming agent. The molar ratio of the chloride to the nano calcium oxide microcrystal is 1:1-10. When the drying agent is used for encapsulating an OLED device, the drying agent is dissolved by ketone or alcohol to form coating liquid, the coating liquid is used to coat the inner surface of the cover plate of the OLED device in a spun manner, and film thickness is 2-10 micrometers. Compared with traditional drying pieces, the drying agent and the coating liquid thereof are simple to operate, convenient to prepare, cheap in raw material, easy in raw material acquiring, convenient to store and good in stability. Compared with other thin film drying agent, the drying agent and the coating liquid thereof has the advantages that the nano calcium oxide particles are doped in the coating liquid, specific surface area is increased, moisture absorption capability is increased, and good drying effect is achieved.

Description

technical field [0001] The invention relates to the field of organic light-emitting diode device packaging, in particular to an organic light-emitting diode device packaging desiccant, a coating solution thereof, and a method for packaging OLED devices. Background technique [0002] Organic electroluminescent diodes have the characteristics of high brightness, wide viewing angle, active luminescence, high contrast, fast response time, low operating voltage, ultra-thin, flexible and bendable, and can be prepared in large areas. Following plasma display (PDP), liquid crystal display ( LCD) is then considered to be the most promising next-generation display technology. At present, the life of OLED has exceeded 10000h, and the storage life has exceeded 50000h. However, compared with LCD and PDP, the short life is still one of the important factors restricting the large-scale promotion and commercialization of OLED. The factors that affect the life of OLED are mainly because the...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01L51/52H01L51/56
CPCH10K50/846H10K50/84H10K2102/302H10K71/00
Inventor 倪烨韧严群王连连田磊唐李晟
Owner 北京大学包头创新研究院
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