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Medium temperature curing high-performance conductive silver adhesive, preparation method thereof and application

A conductive silver glue, curing type technology, applied in the direction of conductive adhesives, adhesives, epoxy resin glue, etc., can solve the problems of increased cost, high curing temperature, environmental protection, etc., to improve electrical conductivity and thermal conductivity, good Mechanical properties, effect of reducing filling rate

Active Publication Date: 2015-03-25
GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Because the contact area between silver powder particles is small, there are many nodes between particles, and the conductivity is not good; moreover, if silver powder particles are used as conductive materials, the addition amount is high, and the corresponding cost increases
[0006] (3) Chinese patent CN 103275590 A uses submicron / micron silver composite system as the conductive system to prepare conductive silver glue. The prepared silver glue is cured at a high temperature of 180°C, and the curing temperature is high, which will damage electronic components.
However, in this method, no reactive diluent is used, but a non-reactive diluent-solvent, which is not only not environmentally friendly, but also tends to cause pores on the surface of the glue due to the volatilization of the solvent during the curing process, affecting the appearance and performance. mechanical properties

Method used

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  • Medium temperature curing high-performance conductive silver adhesive, preparation method thereof and application
  • Medium temperature curing high-performance conductive silver adhesive, preparation method thereof and application
  • Medium temperature curing high-performance conductive silver adhesive, preparation method thereof and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0036]First, micron silver powder with a particle size of 1-8 μm and linear nano-silver with a length of 20-1000 μm and a diameter of 20-100 nm (refer to patent 201210437235.8 for the preparation method of the above-mentioned linear nano-silver, that is: use soluble silver salt, polyol , inorganic salt and linear silver guide agent to prepare linear nano-silver, add thiol substance that is easy to precipitate from ethylene glycol in the later stage of the nano-silver reaction system, because the thiol group has a strong chemical chelation force with the silver surface, it can be used on silver Alkyl chains are grafted on the surface, so that the silver powder is easier to precipitate) into the low-halogen bisphenol F epoxy resin 7001lv, fully stirred until uniform, to obtain a silver powder dispersion, and then dispersed to the above silver powder at a low temperature of 10°C Add epoxy resin latent curing agent dicyandiamide derivatives, epoxy resin accelerator tertiary amine s...

Embodiment 2

[0038] First, micron silver powder with a particle size of 1-8 μm and linear nano-silver with a length of 20-1000 μm and a diameter of 20-100 nm (refer to patent 201210437235.8 for the preparation method of the above-mentioned linear nano-silver, that is: use soluble silver salt, polyol , inorganic salt and linear silver guide agent to prepare linear nano-silver, add thiol substance that is easy to precipitate from ethylene glycol in the later stage of the nano-silver reaction system, because the thiol group has a strong chemical chelation force with the silver surface, it can be used on silver Alkyl chains are grafted on the surface, so that the silver powder is easier to precipitate) added to the bisphenol A epoxy resin, fully stirred until uniform, to obtain a silver powder dispersion, and then added to the above silver powder dispersion at a low temperature of 10°C Epoxy resin latent curing agent organic acid hydrazide derivatives, epoxy resin accelerator modified imidazole...

Embodiment 3

[0040] First, micron silver powder with a particle size of 1-8 μm and linear nano-silver with a length of 20-1000 μm and a diameter of 20-100 nm (refer to patent 201210437235.8 for the preparation method of the above-mentioned linear nano-silver, that is: use soluble silver salt, polyol , inorganic salt and linear silver guide agent to prepare linear nano-silver, add thiol substance that is easy to precipitate from ethylene glycol in the later stage of the nano-silver reaction system, because the thiol group has a strong chemical chelation force with the silver surface, it can be used on silver Alkyl chains are grafted on the surface, so that the silver powder is easier to precipitate) into the bisphenol S epoxy resin, fully stirred until uniform to obtain a silver powder dispersion, and then added to the above silver powder dispersion at a low temperature of 10°C Epoxy resin latent curing agent boron trifluoride-amine complex, epoxy resin accelerator triphenylphosphine derivat...

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Abstract

The invention belongs to the technical field of nano-materials, and discloses a medium temperature curing high-performance conductive silver adhesive, a preparation method thereof and an application. The method includes the steps: adding 0-360 parts of micron silver powder and 0-360 parts of linear nano-silver into 100 parts of epoxy resin, and sufficiently and uniformly stirring the silver powder, the linear nano-silver and the epoxy resin to obtain silver powder dispersion liquid; sequentially adding 10-50 parts of epoxy resin latent curing agents, 1-5 parts of epoxy resin accelerants, 5-20 parts of epoxy resin active diluents and 0.5-2 parts of epoxy resin storage stabilizers into the silver powder dispersion liquid at the low temperature of 5-20 DEG C, and pumping bubbles by a vacuum pump under the action of stirring after uniform stirring to obtain the medium temperature curing high-performance conductive silver adhesive.

Description

technical field [0001] The invention belongs to the technical field of nanomaterials, and relates to a medium temperature curing high-performance conductive silver glue and its preparation method and application, in particular to a medium temperature curing and room temperature stable conductive silver glue used on light emitting diodes and its preparation method and application. Background technique [0002] With the development of modern technology, electronic components are becoming smaller and lighter. The traditional Sn / Pb solder used in microelectronic packaging can no longer meet the requirements of the process, because of its low line resolution, it can only be used for pitches larger than The range of 0.65mm; Pb is a serious environmental pollution, Europe and the United States and other countries have banned the use; solder welding temperature is too high, easy to damage the device. Therefore, as a new type of material, conductive adhesive is widely used in electr...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C09J9/02C09J163/00C09J11/06C09J11/04
Inventor 胡继文李江华邹海良林树东涂园园王永超
Owner GUANGZHOU CHEM CO LTD CHINESE ACADEMY OF SCI
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