tio 2 /nio three-dimensional interdigitated microelectrode and preparation method thereof

A micro-electrode and interdigitated technology, which is applied in the field of TiO2/NiO three-dimensional interdigitated micro-electrodes and their preparation, can solve the problems of low energy density of micro supercapacitors, and achieve the effects of convenient mass production, high energy density and easy operation.

Inactive Publication Date: 2017-12-01
TAIYUAN UNIV OF TECH
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Problems solved by technology

[0004] In order to solve the problem of low energy density of micro-supercapacitors, the present invention provides TiO 2 / NiO three-dimensional interdigitated microelectrode and its preparation method

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  • tio <sub>2</sub> /nio three-dimensional interdigitated microelectrode and preparation method thereof

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Embodiment Construction

[0019] TiO 2 / NiO three-dimensional interdigitated microelectrode, including a silicon wafer, an insulating layer is arranged on the silicon wafer, a metal titanium layer is sputtered on the insulating layer, and a titanium three-dimensional interdigitated microelectrode is formed on the metal titanium layer by a method of spin coating, and the titanium three-dimensional Formation of TiO by Oxidation on Interdigitated Microelectrodes 2 Nanotube arrays, TiO 2 NiO is deposited inside the nanotubes, and KOH electrolyte is filled between the three-dimensional interdigitated microelectrodes.

[0020] TiO 2 Its preparation method of NiO three-dimensional interdigitated microelectrode comprises the following steps:

[0021] S1: Select a 4-inch silicon wafer as the substrate, and wash the silicon wafer in xylene, acetone, alcohol, sulfuric acid / hydrogen peroxide, ammonia / hydrogen peroxide, and hydrochloric acid / hydrogen peroxide in order to remove organic oil, inorganic oil, oxide ...

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Abstract

The invention relates to a supercapacitor in the field of microcapacitors, in particular to a TiO2 / NiO three-dimensional inter-digital microelectrode and a preparing method of the microelectrode. According to the preparing method of the electrode, at first, an insulating layer is oxidized on the surface of a silicon substrate, then a metallic titanium layer is sputtered, the micromachining technology is used for preparing a titanium three-dimensional inter-digital microelectrode body, the microelectrode body is placed into an HF solution to be oxidized in an anodic mode to form a well-aligned TiO2 nanotube array, NiO is prepared in TiO2 nanotubes through an electrolytic deposition method, and finally the three-dimensional inter-digital microelectrode body with a NiO active material is filled with a KOH electrolyte. The principle that a TiO2 nanotube material with the high specific surface area and NiO can react in a reversible redox mode in the KOH electrolyte is utilized for designing a three-dimensional inter-digital microelectrode structure of a pseudocapacitance mechanism, and specific capacitance of a capacitor is greatly increased compared with a traditional sandwich structure.

Description

technical field [0001] The invention relates to supercapacitors in the field of microcapacitors, specifically TiO 2 / NiO three-dimensional interdigitated microelectrode and its preparation method. Background technique [0002] Micro Electro Mechanical System (MEMS), referred to as MEMS, is an industrial technology that integrates microelectronics technology and mechanical engineering. It has the advantages of low cost, small size, strong self-control, and high reliability. One of the most important technological innovations to come. The operating range of MEMS technology is usually within the micron range. A micron-level power supply system can achieve long-term, high-efficiency, and multi-cycle power supply modes, and is especially suitable for some special environments where traditional power supplies cannot be applied, such as wireless communications and wireless sensors. , which has far-reaching research significance. [0003] Supercapacitor is a new type of energy st...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01G11/46H01G11/86
CPCY02E60/13
Inventor 郭丽芳柴晶李刚赵清华张君慧张文栋桑胜波
Owner TAIYUAN UNIV OF TECH
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