Low-resistivity silicon carbide ceramic and preparation method thereof
A technology of silicon carbide ceramics and low resistivity, applied in the field of SiC ceramics, can solve problems such as short service life, performance change, uncontrollable volume, etc.
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[0021] The invention provides a method for preparing low-resistivity silicon carbide (SiC) ceramics. It includes the following steps:
[0022] 1) SiC powder, AlN powder, B 4 C powder and phenolic resin as raw materials;
[0023] 2) making the raw materials into a slurry with a solid content of 40-45wt%, and performing ball milling and mixing;
[0024] 3) Spray granulation of the slurry mixed by the ball mill, and dry press molding and isostatic pressing molding of the obtained powder;
[0025] 4) After the sample is debonded in vacuum, it is sintered under normal pressure inert atmosphere conditions, the sintering temperature is 1900-2300°C, and the holding time is 1-2h.
[0026] The prepared SiC ceramics have a density of 3.11-3.15 g cm -3 , The bending strength is: 280Mpa-350Mpa, the resistivity is 2330Ω·m~18140Ω·cm.
[0027] SiC powder, AlN powder, B 4 C powder and phenolic resin are raw materials, among which SiC powder is high-purity SiC powder (oxygen content ≤ 1.8...
Embodiment 1
[0039] SiC, AlN (1wt%), sintering aid B 4 C (0.5wt%) and phenolic resin (10wt%) totaled 100g, the powder was made into a slurry with a solid content of 45wt%, and 200g of SiC balls were used as the ball milling medium, mixed for 24h, and then spray granulated to obtain the powder It is formed under 16MPa pressure on a flat vulcanizer, and then isostatically pressed under 200MPa pressure. After debonding, it was sintered under normal pressure Ar gas atmosphere, the sintering temperature was 2200°C, and the holding time was 1h. The obtained SiC ceramics had a density of 3.14gcm -3 , the bending strength is 310MPa, and the resistivity is 2330Ω·cm.
Embodiment 2
[0041] SiC, AlN (5wt%), sintering aid B 4 C (0.6wt%), phenolic resin (10wt%) a total of 100g powder is made into a slurry with a solid content of 45wt%, with 200g of SiC balls as the ball milling medium, mixed for 24h, and then spray granulated, the obtained powder was in Forming under 16Mpa pressure on a flat vulcanizing machine, and then isostatic pressing under 200MPa pressure. After debonding, it was sintered under normal pressure Ar gas atmosphere, the sintering temperature was 2200°C, and the holding time was 1h. The obtained SiC ceramics had a density of 3.11gcm -3 , the bending strength is 350MPa, and the resistivity is 18140Ω·cm.
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