Adhesive for cutting wafer

A technology for adhesives and wafers, applied in the direction of adhesives, non-polymer adhesive additives, non-polymer organic compound adhesives, etc., can solve the problems of high defective rate, bright edges, high chip drop rate, etc., and achieve good Toughness, easy degumming, and the effect of improving the quality rate

Inactive Publication Date: 2015-04-08
陆锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing adhesives have problems such as high chip loss rate, many bright edges, and high defective rate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0026] An adhesive for wafer dicing, comprising component A and component B, the weight and number ratio of said component A to component B is 25:17, and the composition of said component A is calculated as: 90 parts of epoxy resin, 45 parts of polyvinyl alcohol resin, 16 parts of sodium bisulfite, 12 parts of precipitated barium sulfate, 2 parts of acrylic acid, 4 parts of ethanol, 3 parts of epoxy octyl stearate; the composition of the component B The ingredients are calculated in parts by weight: 45 parts of nitrile rubber, 11.25 parts of butyl acrylate, 2 parts of plasticizer, and 0.5 part of coupling agent.

[0027] Among them, the plasticizer is TP7595 mixed with stearic acid in a ratio of 1.5:4 in parts by weight, and the coupling agent is made by mixing polyethylene, magnesium oxide and silicon chloroform in a ratio of 1:2:1 in parts by weight .

example 2

[0029] An adhesive for wafer dicing, comprising component A and component B, the weight and number ratio of said component A to component B is 31:22, and the composition of said component A is calculated as: 100 parts of epoxy resin, 50 parts of polyvinyl alcohol resin, 19 parts of sodium bisulfite, 20 parts of precipitated barium sulfate, 4 parts of acrylic acid, 8 parts of ethanol, 6 parts of epoxy octyl stearate; the composition of the component B The ingredients are calculated in parts by weight: 50 parts of nitrile rubber, 12.5 parts of butyl acrylate, 3 parts of plasticizer, and 1 part of coupling agent.

[0030] Among them, the plasticizer is TP7595 mixed with stearic acid in a ratio of 1.5:4 in parts by weight, and the coupling agent is made by mixing polyethylene, magnesium oxide and silicon chloroform in a ratio of 1:2:1 in parts by weight .

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PUM

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Abstract

The invention relates to an adhesive for cutting wafer. The adhesive comprises a component A and a component B at a weight part ratio of (25-40) to (17-31), wherein the component A comprises the following components in parts by weight: 80-100 parts of epoxy resin, 40-50 parts of polyvinyl alcohol, 15-30 parts of sodium hydrogen sulfite, 10-25 parts of precipitated barium sulphate, 1-5 parts of crylic acid, 2-10 parts of ethanol and 1.5-7.5 parts of 2-ethylhexyl epoxystearate; and the component B comprises the following components in parts by weight: 40-50 parts of nitrile rubber, 10-12.5 parts of butyl acrylate, 1-5 parts of a plasticizer and 0.1-2 parts of a coupling reagent. The adhesive has the characteristics of being easy to degum, relatively high in hardness and good in tenacity, and is applicable to cutting thin wafers; and meanwhile, a chip shell and a bright side are reduced, so that the good-grade rate is improved.

Description

technical field [0001] The invention relates to an adhesive for wafer cutting. Background technique [0002] During the cutting process of semiconductor wafers, due to various reasons, complete ingots may fall off or part of the wafers may be broken, bright edges, etc. However, better quality wafers can be obtained by coating with adhesive followed by dicing followed by debonding and cleaning. However, the existing adhesives have problems such as high chip loss rate, many bright edges, and high defective rate. Contents of the invention [0003] The technical problem to be solved by the present invention is to provide an adhesive for wafer cutting in view of the above drawbacks, which is easy to degumming, has the characteristics of high hardness and good toughness, and is suitable for cutting thinner wafers, while reducing chip loss and improving the quality rate of bright edges. . [0004] In order to solve the problems of the technologies described above, the technica...

Claims

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Application Information

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IPC IPC(8): C09J4/02C09J4/06C09J11/04C09J11/06
Inventor 聂金根
Owner 陆锋
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