Adhesive for wafer cutting

An adhesive and wafer technology, applied in the direction of adhesives, non-polymer adhesive additives, non-polymer organic compound adhesives, etc. Degumming, good toughness, the effect of improving the quality rate

Inactive Publication Date: 2017-02-08
陆锋
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the existing adhesives have problems such as high chip loss rate, many bright edges, and high defective rate.

Method used

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Examples

Experimental program
Comparison scheme
Effect test

example 1

[0026] An adhesive for wafer dicing, comprising component A and component B, the weight ratio of component A to component B is 25:17, and the composition of component A is calculated in parts by weight: 90 parts of epoxy resin, 45 parts of polyvinyl alcohol resin, 16 parts of sodium bisulfite, 12 parts of precipitated barium sulfate, 2 parts of acrylic acid, 4 parts of ethanol, 3 parts of octyl epoxy stearate; composition of the component B The ingredients are calculated in parts by weight: 45 parts of nitrile rubber, 11.25 parts of butyl acrylate, 2 parts of plasticizer, and 0.5 parts of coupling agent.

[0027] Among them, the plasticizer is a mixture of TP7595 and stearic acid in a weight ratio of 1.5:4, and the coupling agent is a mixture of polyethylene, magnesium oxide and silicon chloroform in a weight ratio of 1:2:1 .

example 2

[0029] An adhesive for wafer dicing, comprising component A and component B, the weight ratio of component A to component B is 31:22, and the composition of component A is calculated in parts by weight: 100 parts of epoxy resin, 50 parts of polyvinyl alcohol resin, 19 parts of sodium bisulfite, 20 parts of precipitated barium sulfate, 4 parts of acrylic acid, 8 parts of ethanol, 6 parts of octyl epoxy stearate; composition of the component B The ingredients are calculated in parts by weight: 50 parts of nitrile rubber, 12.5 parts of butyl acrylate, 3 parts of plasticizer, and 1 part of coupling agent.

[0030] Among them, the plasticizer is a mixture of TP7595 and stearic acid in a weight ratio of 1.5:4, and the coupling agent is a mixture of polyethylene, magnesium oxide and silicon chloroform in a weight ratio of 1:2:1 .

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PUM

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Abstract

The invention relates to an adhesive for cutting wafer. The adhesive comprises a component A and a component B at a weight part ratio of (25-40) to (17-31), wherein the component A comprises the following components in parts by weight: 80-100 parts of epoxy resin, 40-50 parts of polyvinyl alcohol, 15-30 parts of sodium hydrogen sulfite, 10-25 parts of precipitated barium sulphate, 1-5 parts of crylic acid, 2-10 parts of ethanol and 1.5-7.5 parts of 2-ethylhexyl epoxystearate; and the component B comprises the following components in parts by weight: 40-50 parts of nitrile rubber, 10-12.5 parts of butyl acrylate, 1-5 parts of a plasticizer and 0.1-2 parts of a coupling reagent. The adhesive has the characteristics of being easy to degum, relatively high in hardness and good in tenacity, and is applicable to cutting thin wafers; and meanwhile, a chip shell and a bright side are reduced, so that the good-grade rate is improved.

Description

Technical field [0001] The invention relates to an adhesive for wafer cutting. Background technique [0002] During the dicing of semiconductor wafers, due to various reasons, the intact ingots may fall off or some of the wafers may be broken or bright edges. However, through the use of adhesive coating and then cutting, and then through the degumming and cleaning treatment, better quality wafers can be obtained. However, existing adhesives have problems such as high chipping rate, many bright edges, and high defective product rate. Summary of the invention [0003] The technical problem to be solved by the present invention is to provide an adhesive for chip cutting in view of the above drawbacks, which has the characteristics of easy degumming, high hardness and good toughness, which is suitable for cutting thinner wafers, while reducing chip drop, bright edges and improving the rate of good products. . [0004] To solve the above technical problems, the technical solution of t...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J4/02C09J4/06C09J11/04C09J11/06
Inventor 徐丹
Owner 陆锋
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