A kind of method for preparing zno nano fence
A fence and nano technology, applied in the field of preparing ZnO nano-semiconductor materials, can solve problems such as complex technology
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Embodiment 1
[0020] A certain pattern is photolithographically etched on the GaN substrate. The photolithography steps: firstly coat the photoresist (Su82000) film on the cleaned GaN substrate by spin coating method, then bake at 120°C for 20min, UV exposure (3mw, 30s) is used under the cover of the hole mask, the exposed part is washed away in the developer, and the substrate after photolithography is obtained by baking at 120°C for more than 20min. Then apply 5mM HAuCl 4 Mix the solution with 0.2v / v% EG, heat the substrate to 90°C, and wash off the photoresist with acetone after the solvent is completely volatilized; put the treated substrate into a vacuum tube furnace, and use a high-temperature chemical vapor deposition method (CVD), a boat filled with chemical reactants (zinc oxide powder and graphite powder) is placed in the middle of the high-temperature tube vacuum furnace, and the substrate is placed within 5 cm downstream of the air flow, and then the vacuum tube furnace is evacu...
Embodiment 2
[0022] A certain pattern is photolithographically etched on the GaN substrate. The photolithography steps: firstly coat the photoresist (Su82000) film on the cleaned GaN substrate by spin coating method, then bake at 120°C for 20min, UV exposure (3mw, 30s) is used under the cover of the hole mask, the exposed part is washed away in the developer, and the substrate after photolithography is obtained by baking at 120°C for more than 20min. Then apply 5mM HAuCl 4 Mix the solution with 0.2v / v% ethanol, heat the substrate to 100°C, and wash off the photoresist with acetone after the solvent is completely volatilized; put the treated substrate into a vacuum tube furnace, and use a high-temperature chemical vapor deposition method (CVD), place a boat filled with chemical reactants (zinc oxide powder and graphite powder) in the middle of the high-temperature tube-type vacuum furnace, place the substrate within 8cm of the downstream position of the airflow, and then use a mechanical pu...
Embodiment 3
[0024] A certain pattern is photolithographically etched on the GaN substrate. The photolithography steps: firstly coat the photoresist (Su82000) film on the cleaned GaN substrate by spin coating method, then bake at 120°C for 20min, UV exposure (3mw, 30s) is used under the cover of the hole mask, the exposed part is washed away in the developer, and the substrate after photolithography is obtained by baking at 120°C for more than 20min. Then apply 5mM HAuCl 4 Mix the solution with 0.2v / v% acetaldehyde, heat the substrate to 100°C, and wash off the photoresist with acetone after the solvent is completely volatilized; put the treated substrate into a vacuum tube furnace, and use high-temperature chemical vapor deposition Method (CVD), place a boat filled with chemical reactants (zinc oxide powder and graphite powder) in the middle of the high-temperature tube-type vacuum furnace, place the substrate within 8cm of the downstream position of the airflow, and then use a mechanical...
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