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Diamond compound body and diamond surface metallization method

A composite and diamond technology, which is applied in the field of diamond composite and diamond surface metallization, can solve the problems of difficult control of plating surface uniformity, low efficiency, and low bonding strength

Active Publication Date: 2015-06-17
宁波晶钻科技股份有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Compared with electroplating and electroless plating, since the coating metal and diamond are still in mechanical interlocking, the bonding strength between the two is not high; while PVD, CVD and magnetron sputtering have high equipment costs and low efficiency on the one hand, and on the other On the one hand, it is not suitable for surface modification of diamond powder, and the uniformity of the coating surface is difficult to control

Method used

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  • Diamond compound body and diamond surface metallization method
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  • Diamond compound body and diamond surface metallization method

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preparation example Construction

[0062] In the preparation method of the diamond composite of the present invention, the heating reaction is usually carried out at 800-1400°C (preferably 1150-1350°C), and the reaction time is usually 1-240 minutes (preferably 60-120°C). minute). The heating reaction is carried out in vacuum or in an atmosphere with a pressure of 1Pa-120kPa.

[0063] In a preferred example, the preparation method of the present invention comprises the steps of:

[0064] (1) provide a kind of mixed slurry comprising diamond particle, boron raw material, copper raw material and organic solvent;

[0065] (2) Under vacuum or in an inert or reducing atmosphere of hydrogen, argon or a combination thereof, the mixed slurry in step (1) is heated and reacted to obtain a diamond composite; and the boron alloy is boron copper alloy.

[0066] Calculated on the basis of the total weight of the mixed slurry in step (1), the mass fraction of diamond particles is 5-95wt%, preferably 20-85wt%, and more pref...

Embodiment 1

[0086] Example 1 Diamond-boron carbide-boron nano-coating composite (as the diamond composite intermediate of the present invention)

[0087] Mix diamond particles with an average particle size of about 100 μm with high-purity boron powder and a small amount of polyethylene glycol (molecular weight: 2000) to make a mixture. Calculated by the total weight of the mixture, boron powder accounts for 10wt%, polyethylene glycol accounts for 5wt %. Put the mixture in a blender and stir to mix evenly to prepare a slurry. Put it into a vacuum carbon tube furnace and evacuate to a vacuum of about 10 -2 Pa, then pass in hydrogen, the gas pressure is 1Pa-120kPa, the temperature rise rate is 10°C / min to 1250°C, keep the temperature for 60min, and then cool down to room temperature with the furnace.

[0088] Take out the high-temperature-treated mixture, pass through sieves of 30 mesh, 60 mesh, 80 mesh, 100 mesh, 150 mesh, and 300 mesh respectively, and then ultrasonically wash to remove ...

Embodiment 2

[0089] Example 2 Diamond-boron carbide-boron-copper alloy nano-coating complex

[0090] The diamond-boron carbide-boron nano-coating composite prepared in Example 1, copper powder, and alcohol were prepared into a slurry, and then calculated based on the total weight of the slurry, the copper powder accounted for 10wt%, and the alcohol accounted for 5wt%. Place the slurry in a blender and blend until smooth. Put it into a vacuum carbon tube furnace and evacuate to a vacuum of about 10 -2 Pa, then pass in hydrogen, the gas pressure is 1Pa-120kPa, the temperature rise rate is 10°C / min to 1000°C, keep the temperature for 60min, and then cool down to room temperature with the furnace.

[0091] Take out the high-temperature-treated mixture, pass through sieves of 30 mesh, 60 mesh, 80 mesh, 100 mesh, 150 mesh, and 300 mesh respectively, and then ultrasonically wash to remove impurities, remove excess copper powder, and obtain diamond-boron carbide-boron-copper alloy Nanocoating co...

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Abstract

The invention relates to a diamond compound body and a diamond surface metallization method. In particular, the invention provides a diamond compound body; the diamond compound body comprises a diamond particle and a compound coating layer bonded on the surface of the diamond particle, wherein the compound coating layer consists of a boron carbide nanometer layer and a boron alloy nanometer layer; the boron carbide nanometer layer is bonded on the surface of the diamond particle; and the boron alloy nanometer layer is combined with the boron carbide nanometer layer. The compound body material has excellent performance and wide application.

Description

technical field [0001] The invention belongs to the field of diamond composite materials. Specifically, the present invention relates to a diamond composite and a diamond surface metallization method. Background technique [0002] At present, the substrates of diamond tools are generally cemented carbide or stainless steel. The main problem of welding diamond sheets or diamond particles on these substrates is the low bonding strength between diamond and metal. [0003] In order to improve the life of diamond tools, it is a reasonable method to improve the wettability and bonding strength between the diamond surface and the metal by modifying the diamond surface. At present, the relatively uniform coating in China is to deposit a metal layer or carbide layer on the diamond surface by magnetron sputtering, chemical plating, electroplating, PVD, CVD and other methods to improve the bonding force between diamond and metal. Compared with electroplating and electroless plating, ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): B22F1/02B22F9/26B82Y40/00B82Y30/00
Inventor 白华江南戴丹朱聪旭张军安马洪兵杨科
Owner 宁波晶钻科技股份有限公司