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High temperature solder and application thereof

A high-temperature welding and high-temperature technology, applied in welding/cutting media/materials, welding equipment, welding media, etc., can solve the problems of low welding temperature and poor corrosion resistance, improve high temperature resistance and corrosion resistance, and reduce the impact , the effect of reducing residual thermal stress

Active Publication Date: 2015-06-17
SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0005] The purpose of the present invention is to provide a high-temperature solder and its application to solve the problem of low soldering temperature and poor corrosion resistance existing in the existing solder, which limits the use of silicon carbide ceramic welding materials in extreme environments such as high-temperature corrosion. problems, promoting the wide application of silicon carbide ceramic materials

Method used

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  • High temperature solder and application thereof
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  • High temperature solder and application thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0025] 1. The nano-scale Ni, Mo, Cr, and Fe powders are made according to 67Ni-30Mo-1Cr-2Fe (that is, the mass percentages of Ni, Mo, Cr, and Fe are 67%, 30%, 1%, 2%, respectively) ) Stoichiometric ratio mixing, adding polyvinyl butyral (PVB), ball milling the mixture in a planetary ball mill for 24 hours to obtain a paste-like solder with uniform composition distribution, which is ready for use;

[0026] 2. The surface to be welded on the silicon carbide ceramic substrate is first polished with 600# water sandpaper, and then placed in acetone and alcohol for ultrasonic cleaning for 15 to 30 minutes, and dried for later use;

[0027] 3. Coat the solder uniformly on the surface to be soldered of the silicon carbide ceramic substrate after the surface cleaning pretreatment, so as to form a ceramic-solder-ceramic three-layer structure, fix it with a fixture, and control the thickness of the middle solder layer to be 10~1000 Between micrometers

[0028] 4. Put the three-layer structure ...

Embodiment 2

[0031] 1. The nano-scale Ni, Mo, Cr, W, Co, and Fe powders are divided into 57Ni-16Mo-16Cr-4W-2Co-5Fe (that is, the mass percentages of Ni, Mo, Cr, W, Co, and Fe) Mix at stoichiometric ratios of 57%, 16%, 16%, 4%, 2%, 5%), add polyvinyl butyral (PVB), ball mill the mixture in a planetary ball mill for 24 hours to obtain a composition distribution Uniform paste solder, spare;

[0032] 2. The surface to be welded on the silicon carbide ceramic substrate is first polished with 600# water sandpaper, and then placed in acetone and alcohol for ultrasonic cleaning for 15 to 30 minutes, and dried for later use;

[0033] 3. Coat the solder uniformly on the surface to be soldered of the silicon carbide ceramic substrate after the surface cleaning pretreatment, so as to form a ceramic-solder-ceramic three-layer structure, fix it with a fixture, and control the thickness of the middle solder layer to be 10~1000 Between micrometers

[0034] 4. Put the three-layer structure sample fixed by the a...

Embodiment 3

[0037] 1. The nano-scale Ni, Mo, Cr, W, Co, and Fe powders are divided into 40Ni-15Mo-30Cr-5W-5Co-5Fe (that is, the mass percentages of Ni, Mo, Cr, W, Co, and Fe) Mix at stoichiometric ratios of 40%, 15%, 30%, 5%, 5%, 5%), add polyvinyl butyral (PVB), ball mill the mixture in a planetary ball mill for 24 hours to obtain the composition distribution Uniform paste solder, spare;

[0038] 2. The surface to be welded on the silicon carbide ceramic substrate is first polished with 600# water sandpaper, and then placed in acetone and alcohol for ultrasonic cleaning for 15 to 30 minutes, and dried for later use;

[0039] 3. Coat the solder uniformly on the surface to be soldered of the silicon carbide ceramic substrate after the surface cleaning pretreatment, so as to form a ceramic-solder-ceramic three-layer structure, fix it with a fixture, and control the thickness of the middle solder layer to be 10~1000 Between micrometers

[0040] 4. Put the three-layer structure sample fixed by the...

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Abstract

The invention discloses a high temperature solder and an application thereof. The high temperature solder is a nickel based alloy formed by nickel and at least one of molybdenum and chromium. The high temperature solder can be used for high temperature welding of silicon carbide ceramic materials. Experiments prove that the high temperature solder provided by the invention has good wetability, good high temperature thermodynamics, oxidation resistance and corrosion resistance, can reduce the influences of welded points on the integral performances of silicon carbide ceramic parts, can reduce the residual thermal stress in the welded points, improves the high temperature and corrosion resistance of welded silicon carbide ceramic connectors, and is in favor of popularizing the application of the silicon carbide ceramic materials.

Description

Technical field [0001] The invention relates to a high-temperature solder and its application, and belongs to the technical field of ceramic material welding. Background technique [0002] Silicon carbide ceramics have low density, high strength, high modulus, high hardness, high thermal conductivity, low thermal expansion coefficient, good high-temperature mechanics and oxidation resistance, and excellent corrosion and chemical resistance, so they are widely used in metallurgy , Machinery, chemicals, electronics and other fields of national production. [0003] In practical applications, limited by the preparation process and equipment conditions, it is difficult to directly manufacture large-size and complex-shaped ceramic parts; at the same time, it is not only time-consuming and expensive to process some ceramic parts with special structures, but also huge technological problems. challenge. It is easy to solve this problem through ceramic connection. [0004] At present, the m...

Claims

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Application Information

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IPC IPC(8): C22C19/05C22C19/03C22C30/00B23K35/32B23K35/30
Inventor 张辉闫永杰刘岩陈忠明刘学建黄政仁
Owner SHANGHAI INST OF CERAMIC CHEM & TECH CHINESE ACAD OF SCI
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