A preparation method of a triple-junction GAAS solar cell with a roughened surface structure
A surface roughening and solar cell technology, which is applied in the direction of circuits, photovoltaic power generation, electrical components, etc., can solve the problems of batch production stability and unfavorable pass rate, and achieve the effects of easy operation, improved open circuit voltage, and reasonable process
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[0027] 1. Prepare epitaxial wafers.
[0028] A GaAs substrate 101 with a crystal orientation of is selected, with a thickness of 375 μm and a diameter of 100 mm±0.1 mm. On the GaAs substrate 101, a 0.5 μm N-type GaAs buffer layer 102, a 350 nm GaInP etch stop layer 103, a 0.5 μm N-type GaAs contact layer 104, and a 2 μm N-type GaAs contact layer 104 are sequentially grown using MOVPE (metal organic vapor phase epitaxy) technology. AlGaInP roughening layer 105, 0.5μm GaInP top cell (Top cell) 106, 500Å tunnel junction 107, 3.4μm GaAs middle cell (Middle cell) 108, 500Å tunnel junction 2 109, 3μm InGaAs bottom The battery (Bottom cell) 110, at the end of the bottom cell, contains a 400nm P-type GaAs contact layer 111, see figure 1 shown.
[0029] The above sub-cells are respectively a GaInP top cell (Top cell) 106 , a GaAs middle cell (Middle cell) 108 and an InGaAs bottom cell (Bottom cell) 110 . Each sub-cell has a back reflection layer (BSF) 201, a base area (base) 202, a...
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