Resin composition and application thereof

A technology of resin composition and active ingredients, which is applied in the direction of synthetic resin layered products, laminated, layered products, etc., can solve the problems of unable to meet the application requirements of high-speed signal transmission, signal distortion, and slow signal transmission rate, etc. Achieve the effects of excellent electrical properties, low loss factor, and low dielectric constant

Active Publication Date: 2015-07-29
无锡宏仁电子材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

As consumer electronics continue to put forward higher technical requirements, such as high-speed information transmission, multi-functionality and miniaturization of products, etc., it has promoted the continuous development of high-frequency application technology, especially the technology of copper clad substrate materials, traditional FR-4 Dk and Df are relatively high. If Dk is too high, the signal transmission rate will slow down. If Df is too high, the signal will be converted into heat energy and lost in the substrate material, resulting in signal distortion. Even if the circuit design is changed, it cannot Meet the application requirements of high-speed signal transmission and complete signal at high frequency

Method used

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  • Resin composition and application thereof

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Experimental program
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Effect test

Embodiment 1

[0030] A resin composition in this embodiment is composed of 65wt% active ingredients and 35wt% solvent (butanone). The active ingredients include the following raw materials in parts by weight: 20 parts of bisphenol A type cyanate, 10 parts of three Methylol propane diallyl ether, 28 parts of allyl polyphenylene ether (weight average molecular weight: 2000), 12 parts of decabromodiphenylethane, 1 part of dicumyl peroxide and 29 parts of silicon micropowder.

[0031] Use 2116 glass fiber cloth to impregnate the above resin composition, and bake at 160°C for 190s to make a prepreg. The resin content of the prepreg was 50%, and the resin fluidity was 20%.

[0032] Take 6 pieces of prepreg and stack them up, with 1HZ electrolytic copper foil on both sides, then clamp them between two steel plates, place them in a vacuum press, and heat them at 200°C and 35Kg / cm 2 Under conditions. Hot pressing for 2h to make a double-sided copper clad board. The test results are shown in Table...

Embodiment 2

[0034] The present embodiment is a kind of resin composition, is made up of 60wt% active ingredient and 40wt% solvent (butanone), and described active ingredient comprises following raw material by weight: 15 parts of bisphenol A type cyanate, 15 parts of three Methylol propane diallyl ether, 28 parts of allyl polyphenylene ether (weight average molecular weight: 1500), 12 parts of decabromodiphenylethane, 1 part of dicumyl peroxide and 29 parts of silicon micropowder.

[0035] Use 2116 fiberglass cloth to impregnate the above resin composition, and bake at 160°C for 180s to make a prepreg. The resin content of the prepreg was 50%, and the resin fluidity was 20%.

[0036] Take 6 pieces of prepreg and stack them up, with 1HZ electrolytic copper foil on both sides, then clamp them between two steel plates, place them in a vacuum press, and heat them at 200°C and 35Kg / cm 2 Under conditions. Hot pressing for 2h to make a double-sided copper clad board. The test results are show...

Embodiment 3

[0038] A kind of resin composition of the present embodiment is made up of the active ingredient of 55wt% and the solvent (cyclohexanone) of 45wt%, and described active ingredient comprises the raw material of following weight portion: 15 parts of bisphenol A type cyanate, 10 parts Pentaerythritol triallyl ether, 33 parts of terminal allyl polyphenylene ether (weight average molecular weight: 2500), 12 parts of decabromodiphenylethane, 1 part of dicumyl peroxide and 29 parts of silicon micropowder.

[0039] Use 2116 fiberglass cloth to impregnate the above resin solution, and bake at 160°C for 160s to make a prepreg. The resin content of the prepreg was 50%, and the resin fluidity was 20%.

[0040] Take 6 pieces of prepreg and stack them up, with 1HZ electrolytic copper foil on both sides, then clamp them between two steel plates, place them in a vacuum press, and heat them at 200°C and 35Kg / cm 2 Under conditions. Hot pressing for 2h to make a double-sided copper clad board....

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Abstract

The invention relates to a resin composition and an application thereof. The resin composition is composed of 55-70wt% of effective constituents and 30-45wt% of solvents. The resin composition can be used to prepare high-performance copper-clad plates; the prepared copper-clad plates can be used in above 1 GHz high frequency environment, have excellent electrical property and low dielectric constant (Dk<3.7) and low loss factor (Df<0.005), and have high temperature resistance, soldering tin resistance, heat resistance and high glass-transition temperature.

Description

technical field [0001] The invention relates to the technical field of polymer materials, in particular to a resin composition and its application. Background technique [0002] With the rapid development of information technology, electronic consumer products with high-speed information processing functions have played an important role in people's daily life, which has also accelerated the transfer of wireless communication and broadband application industrial technology from the traditional military field to civilian consumer electronics The speed of field transfer. As consumer electronics continue to put forward higher technical requirements, such as high-speed information transmission, multi-functionality and miniaturization of products, etc., it has promoted the continuous development of high-frequency application technology, especially the technology of copper clad substrate materials, traditional FR-4 Dk and Df are relatively high. If Dk is too high, the signal tran...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C08L71/12C08L79/04C08K13/02C08K5/06C08K5/03C08K5/14C08K3/36C08K3/22B32B15/08B32B15/20B32B27/04B32B27/18B32B37/06B32B37/10
Inventor 周俊文李宏途肖浩罗文
Owner 无锡宏仁电子材料科技有限公司
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