A kind of heat-conducting adhesive and its preparation method and application

A technology of thermally conductive adhesives and thermally conductive fillers, applied in the direction of adhesive types, natural rubber adhesives, polymer adhesive additives, etc., which can solve the problems that cannot be applied to the heat dissipation of electronic appliances, the application range is limited, and the price is expensive and other issues, to achieve excellent processing performance and thermal conductivity, reduce costs, and achieve the effect of tight bonding

Active Publication Date: 2017-04-12
国科广化(南雄)新材料研究院有限公司 +1
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, the above two adhesives cannot conduct heat, so they cannot be used in the field of heat dissipation of electronic appliances, and the application range is limited.
[0006] Although acrylic and silicone thermally conductive adhesives have good adhesion, aging resistance, acid and alkali resistance, etc., they are expensive, and are more suitable for microelectronics and some high-end product devices with a small amount.

Method used

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  • A kind of heat-conducting adhesive and its preparation method and application
  • A kind of heat-conducting adhesive and its preparation method and application
  • A kind of heat-conducting adhesive and its preparation method and application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0041] The thermally conductive adhesive contains the following components by weight:

[0042]

[0043]

[0044] (1) Dry graphite and carbon black at 150°C for 2 hours to remove water and volatile solvent impurities to obtain graphite / carbon black compound thermally conductive filler; then graphite / carbon black compound thermally conductive filler and oxidation Aluminum and ceramic powder are then compounded to obtain a mixed thermally conductive filler containing graphite and carbon black;

[0045] (2) Roll the natural rubber on the open mill, the distance between the rollers is 3 mm, and the roll time is 10 minutes; add the mixed thermally conductive filler prepared in part of the step (1) into polyisobutylene, stir evenly, and then apply it to the open mill Above the gap between the two rollers of the machine, and keep an appropriate amount of accumulated glue;

[0046](3) Coat the antioxidant 168, tackifier rosin glyceride, and anti-aging agent RD on the roller shaf...

Embodiment 2

[0048] The thermally conductive adhesive contains the following components by weight:

[0049]

[0050] (1) Dry the graphite / carbon black compound at 200°C for 1 hour to remove water and volatile solvent impurities to obtain graphite / carbon black compound thermally conductive filler; then graphite / carbon black compound thermally conductive filler and oxidation Aluminum and ceramic powder are then compounded to obtain a mixed thermally conductive filler containing graphite and carbon black;

[0051] (2) Roll the natural rubber on the open mill, the distance between the rollers is 7 mm, and the roll time is 20 minutes; add the mixed thermally conductive filler prepared in part of the step (1) into the polyisobutylene, stir evenly, and then apply it to the open mill Above the gap between the two rollers of the machine, and keep an appropriate amount of accumulated glue;

[0052] (3) Apply antioxidant 264, tackifier C5 tackifying resin, and antiaging agent DFC-34 above the rol...

Embodiment 3

[0054] The thermally conductive adhesive contains the following components by weight:

[0055]

[0056] (1) After compounding graphite / carbon black, dry it at 170°C for 1.5 hours to remove water and volatile solvent impurities to obtain graphite / carbon black compound thermally conductive filler; then graphite / carbon black compound thermally conductive filler and Zinc oxide and ceramic powder are then compounded to obtain a mixed thermally conductive filler containing graphite and carbon black;

[0057] (2) Roll the EPDM rubber on the open mill, the distance between the rollers is 3mm, and the rolling time is 15min; add the mixed thermally conductive filler prepared in part of the step (1) into the polyisobutylene, stir evenly, and then coat Go to the top of the gap between the two rollers of the mill, and keep an appropriate amount of accumulated glue;

[0058] (3) Coat the antioxidant 1010, C5 tackifying resin, rosin glyceride, and anti-aging agent RD on the roller; then ...

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Abstract

The invention relates to a macromolecular heat conducting composite material, in particular to a heat conducting adhesive and a preparation method and application thereof. The heat conducting adhesive is made of, by weight, 60-100 parts of softener, 20-60 parts of rubber flexibilizer, 50-150 parts of heat conducting filler, 2-10 parts of tackifier, 0.2-5 parts of antioxidant and 0.2-5 parts of antiager. The preparation method includes the steps: rolling the rubber flexibilizer, sequentially adding the softener, the heat conducting adhesive, the tackifier, the antioxidant and the antiager, and mixing for 1-2h at the temperature of 80-150 DEG C to obtain the heat conducting adhesive. The heat conducting adhesive has the advantages of freeness of curing, convenience in processing, excellent adhesion performance, high heat conductivity and the like. Close adhesion of devices can be realized only by application of a proper pressure at the normal temperature, and the heat conducting adhesive is cheap and environment friendly.

Description

technical field [0001] The invention relates to a polymer heat-conducting composite material, in particular to a heat-conducting adhesive and its preparation method and application. Background technique [0002] With the increasing popularity of electronics and electrical appliances, people have higher and higher requirements for their performance and lifespan. The biggest impact on the performance and life of electronic appliances is the heat dissipation of electronic and electrical components. At present, people's research direction is mainly to use thermal conductive adhesive technology to solve it. Thermally conductive adhesives, which are used as bonding and packaging materials for electronic appliances, play an inestimable role in heat dissipation. It can make the heat sink and the surface of the heat source in close contact, dissipate the heat quickly, and greatly improve the relationship between the component and the heat sink. heat transfer efficiency. Currently p...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C09J123/20C09J107/00C09J123/16C09J123/22C09J11/04C09J11/06C09J11/08C09J9/00
Inventor 胡继文李登峰林树东涂园园廖乾勇
Owner 国科广化(南雄)新材料研究院有限公司
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