Teflon-based asphalt base carbon fiber doped lightweight heat dissipation material for LED light source and preparation method thereof

Abstract

The invention relates to a teflon-basedd asphalt base carbon fiber doped lightweight heat dissipation material for an LED light source and a preparation method thereof. The material consists of the following raw materials by weight: 0.1-0.2 part of diethylphosphinate acid aluminum, 2-4 parts of tetrapod-like zinc oxide whisker, 1-2 parts of pitch-based carbon fiber, 3-5 parts of nano barium sulfate, 1-2 parts of gamma-aminopropyl triethoxysilane, 3-5 parts of sodium silicate, 1-3 parts of polyethylene glycol, 30-40 parts of water, 0.4-0.5 part of zinc hydroxystannate, 15-18 parts of aluminum nitride micropowder of 400-600 mesh, 40-50 parts of teflon micropowder of 200-300 mesh, and 2-3 parts of an additive. The heat dissipation material provided by the invention has the advantages of efficient, uniform, and stable thermal conductivity, resistance to environmental corrosion, light and thermal ageing during usage, clean dirt-proof surface, light weight, firmness, and easiness to processing cutting, and is a novel energy-saving heat dissipation material for LED light fixture.

Description

technical field [0001] The invention relates to an LED heat dissipation material, in particular to a polytetrafluoroethylene-based doped pitch-based carbon fiber light heat dissipation material for an LED light source, a preparation method and a production method thereof. Background technique [0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materi...

AI Technical Summary

Problems solved by technology

[0002] LED is the abbreviation of light-emitting diode. It is a semiconductor electronic component that converts electrical energy into light energy. It has the advantages of small size, long life, low power consumption, fast response, high luminous efficiency, energy saving and environmental protection. It is recognized in the industry As the most competitive product to replace traditional light sources, it has also been widely used in real life. There are still many problems in current LED products, among which heat dissipation has always been the top priority. Common heat dissipation materials are mostly high thermal conductivity metals. , high thermal conductivity inorganic materials, and these materials are compounded and sintered. These materials have disadvantages such as difficult cutting and forming, high cost, and easy to be corroded by the environment. Excellent heat dissipation effect, and can improve the environmental adaptability of the material to achieve efficient and stable performance