Low-formaldehyde-content high-density fiberboard

A high-density fiberboard and low-formaldehyde technology, applied in the field of fiberboard, can solve the problems of secondary pollution, high cost, and low bonding strength

Inactive Publication Date: 2015-08-19
王良源
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

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Problems solved by technology

[0007] The technical problem to be solved by the present invention is that the current low-formaldehyde

Method used

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  • Low-formaldehyde-content high-density fiberboard
  • Low-formaldehyde-content high-density fiberboard
  • Low-formaldehyde-content high-density fiberboard

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0060] 125 parts by weight of fiber slurry, 10 parts by weight of urea-formaldehyde resin, and 6.5 parts by weight of propyl benzoate are uniformly mixed in a stirring tank, and the mixture is dried at 50-70°C until the water content is 15 wt%, to obtain a mixture. The mixture was pre-pressed at 6-7MPa for 30s to form a blank, and the blank was isostatically pressed at 8MPa and 70°C for 1min to form a slab. The slab is hot-pressed, and the hot-pressing conditions are: temperature 150-160°C; rise to 19-21MPa within 20-30s, hold pressure for 50-100s; decompress to 6-8.5MPa within 10-15s, hold Press for 65-135s; then rise to 10-14MPa within 10-15s, hold the pressure for 50-75s; finally depressurize uniformly to 0MPa within 60-120s. The hot-pressed sheet was cooled to room temperature, tempered, and sanded to obtain a high-density fiberboard A with a thickness of 30 mm.

[0061] It has been determined that the composition of the high-density fiberboard A is 85wt% fiber, 10wt% ure...

Embodiment 2

[0063] 167 parts by weight of fiber slurry, 20 parts by weight of urea-formaldehyde resin, and 11 parts by weight of propyl benzoate are uniformly mixed in a stirring tank, and the mixture is dried at 60-70°C until the water content is 10 wt%, to obtain a mixture. The mixture was pre-pressed at 6-7MPa for 40s to form a blank, and the blank was isostatically pressed at 8MPa and 70°C for 50s to form a slab. The slab is hot-pressed, and the hot-pressing conditions are: temperature 150-160°C; rise to 19-21MPa within 20-30s, hold pressure for 50-100s; decompress to 6-8.5MPa within 10-15s, hold Press for 65-135s; then rise to 10-14MPa within 10-15s, hold the pressure for 50-75s; finally depressurize uniformly to 0MPa within 60-120s. The hot-pressed plate was cooled to normal temperature, tempered and sanded to obtain a high-density fiberboard B with a thickness of 30 mm.

[0064] It has been determined that the composition of the high-density fiberboard B is 76wt% fiber, 15wt% urea...

Embodiment 3

[0066] 140 parts by weight of fiber slurry, 15 parts by weight of modified urea-formaldehyde resin, and 4.5 parts by weight of propyl benzoate were uniformly mixed in a stirring tank, and the mixture was dried at 80° C. until the moisture content was 10 wt % to obtain a mixture. The mixture is pre-pressed at 6-7MPa for 1min to form a blank, and the blank is isostatically pressed at 8-9MPa and 60-70°C for 50s to form a slab. The slab is hot-pressed, and the hot-pressing conditions are: temperature 150-160°C; rise to 19-21MPa within 20-30s, hold pressure for 50-100s; decompress to 6-8.5MPa within 10-15s, hold Press for 65-135s; then rise to 10-14MPa within 10-15s, hold the pressure for 50-75s; finally depressurize uniformly to 0MPa within 60-120s. The hot-pressed sheet was cooled to normal temperature, tempered, and sanded to obtain a high-density fiberboard C with a thickness of 30 mm.

[0067] It has been determined that the composition of the high-density fiberboard C is 85 ...

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Abstract

The invention belongs to the technical field of fiberboards, and relates to a low-formaldehyde-content high-density fiberboard. The fireboard comprises fibers, adhesive and propyl benzoate. The formaldehyde-content of the high-density fiberboard is low, the density is 800-900 kg/m<3>, the internal bonding strength is 1.5-1.65 MPa, and the static bending strength is 35-80 MPa. The low-formaldehyde-content high-density fiberboard can be used in the fields of building, decorating, industrial manufacturing and the like.

Description

technical field [0001] The invention belongs to the technical field of fiberboards, in particular to a high-density fiberboard with low formaldehyde content. Background technique [0002] Formaldehyde is a recognized carcinogen. Scientific research at home and abroad has confirmed that formaldehyde can cause cell apoptosis by regulating DNA expression, cause oxidative damage to biological macromolecules (protein, DNA), and cause cell canceration. [0003] At present, most of the domestically produced fiberboards have residual free formaldehyde. The main sources of free formaldehyde are: i. The urea-formaldehyde resin commonly used in the manufacture of fiberboard uses formaldehyde as the main raw material, and there will still be unreacted free formaldehyde in the urea-formaldehyde resin; ii. Formaldehyde is released; iii. Hemicellulose in wood gradually decomposes to formaldehyde. Free formaldehyde remaining in fiberboard will endanger human health, so it is necessary to ...

Claims

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Application Information

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IPC IPC(8): B27N3/04C08G12/40C09J161/32C09J11/04
CPCB27N3/04C08G12/40C09J11/04C09J161/32
Inventor 王良源
Owner 王良源
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