Heat-dissipation plastic containing carbon nanosphere particles and used for LED lamps and preparation method thereof

Abstract

Heat-dissipation plastic containing carbon nanosphere particles and used for LED lamps is prepared from the following raw materials, by weight, 16-18 parts of carbon nanosphere particles, 15-20 parts of carbon fiber, 0.6-0.8 part of a silane coupling agent kh-550, a proper amount of water, 0.8-1.1 parts of acrylic acid, 1-1.5 parts of methyl methacrylate, 0.5-0.6 part of N,N-methylene bisacrylamide, 2-2.5 parts of styrene, 66-70 parts of polycarbonate, 0.5-0.8 part of silica gel and a proper amount of ethanol. By the use of carbon nanosphere particles and carbon fiber, the heat-dissipation plastic has good radiation and heat dissipation properties. In addition, the heat-dissipation plastic has an enhancement effect and cracking can be prevented. By carbon fiber surface modification and coating of carbon nanosphere particles and through cooperation of different heat conduction materials with different particle sizes, heat dissipation performance of the plastic is more enhanced. By the method, binding property between a filler and a matrix can be enhanced, and phenomena such as cracking, agglomeration and the like can be prevented.

Description

technical field [0001] The invention relates to the field of heat-dissipating plastics, in particular to a heat-dissipating plastic for LED lamps containing nano carbon sphere particles and a preparation method thereof. Background technique [0002] Light-emitting diode (LED) is the fourth-generation light source after incandescent lamps, fluorescent lamps, and high-intensity gas lamps. It has the characteristics of low operating voltage, low power consumption, and long life, so it has good development and application prospects. During the working process of LED, 10% to 20% of the electrical energy is converted into light energy, and the rest is converted into heat energy. Therefore, heat dissipation is one of the key issues restricting the wide application of LEDs. Reducing the junction temperature of the chip is beneficial to the life of the LED. Extension and improvement of luminous efficiency. [0003] Due to the low thermal conductivity of pure plastics, it is far infe...

AI Technical Summary

Problems solved by technology

[0003] Due to the low thermal conductivity of pure plastics, it is far inferior to metals and ceramics. However, due to the high cost of metals and the fragility of ceramics, heat dissipation plastics with thermal conductivity, toughness, impact resistance, light weight and easy processing have been produced.

However, at present, heat dissipation plastics are still poor in heat dissipation, and there are still problems such as easy aggregation of heat dissipation fillers and poor interface bonding performance with the plastic matrix, which makes the mechanical properties of heat dissipation plastics poor, and can only be used in relatively low-end and low-power applications. Therefore, it is necessary to improve the performance of heat dissipation plastics to adapt to the development of LED lamp technology