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Preparation method of wet and dry dual-purpose diamond saw blade

A diamond saw blade, dry and wet dual-use technology, applied in the direction of metal sawing equipment, sawing machine tool manufacturing, metal processing equipment, etc., can solve problems such as harsh environments, and achieve not easy to fall off, stable cutting performance, and good safety performance Effect

Active Publication Date: 2017-04-19
JIANGSU FENGTAI TOOLS
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

With the continuous development of technology, the requirements for cutting efficiency and cutting speed are getting higher and higher, and the cutting environment is also very harsh. For example, it is often necessary to cut without cooling water. However, most of the current market All diamond saw blades need to rely on cooling water for cutting operations

Method used

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  • Preparation method of wet and dry dual-purpose diamond saw blade

Examples

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preparation example Construction

[0025] The preparation method of the wet and dry dual-purpose diamond saw blade of the present invention is as follows: a circular substrate is provided, and the circular substrate includes a side circumferential surface positioned at the edge of the substrate; Machining along the direction of the center of the circle forms a plurality of flutes arranged at intervals; the flutes include first flutes and second flutes arranged at intervals, and the cross section of the first flutes is larger than that of the second flutes Groove; diamond cutter head is set between the flutes of the circular substrate, and the diamond cutter head includes a first diamond cutter head and a second diamond cutter head arranged at intervals; the surface of the first diamond cutter head is a plane , the surface of the second diamond segment is provided with a plurality of mutually parallel protruding strips, and grooves are formed between the protruding strips.

[0026] Specifically, the preparation ...

Embodiment 1

[0029] Take 2.7kg of copper powder, 4.16kg of iron powder, 0.5kg of nickel powder, 1.5kg of cobalt powder, 0.7kg of tin powder, and 0.15kg of cerium powder. kg (compressive strength is 25Kg, particle size is 35 / 40), and after 3 hours of continuous mixing, the powder is poured into the mold for cold pressing and sintering by hot pressing (the sintering temperature is 800°C and the pressure is 320kg / cm 2 ), grind the cutter head with the grinding wheel and the abrasive belt, put the cutter head and the substrate together on the corresponding substrate position according to the drawing requirements, adjust the light spot of the machine to the appropriate position between the cutter head and the substrate, start the machine welding, and make the cutter head and the substrate Weld together at the moment of laser penetration, and then at 600N / mm 2 Intensity Standards Welding strength testing is carried out for each diamond segment, and the wet and dry diamond saw blade after welding...

Embodiment 2

[0031] Take 3.1kg of copper powder, 4.15kg of iron powder, 0.8kg of nickel powder, 1.1kg of cobalt powder, 0.4kg of tin powder, and 0.15kg of cerium powder. kg (compressive strength is 25Kg, particle size is 35 / 40), and after 3 hours of continuous mixing, the powder is poured into the mold for cold pressing and sintering by hot pressing (the sintering temperature is 800°C and the pressure is 320kg / cm 2), grind the cutter head with the grinding wheel and the abrasive belt, put the cutter head and the substrate together on the corresponding substrate position according to the drawing requirements, adjust the light spot of the machine to the appropriate position between the cutter head and the substrate, start the machine welding, and make the cutter head and the substrate Weld together at the moment of laser penetration, and then at 600N / mm 2 Intensity Standards Welding strength testing is carried out for each diamond segment, and the wet and dry diamond saw blade after welding ...

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Abstract

The invention relates to a manufacture method for a dry and wet dual-purpose diamond saw blade, and belongs to the technical field of diamond processing tools. The method includes the following steps of providing a circular base body, wherein the circular base body comprises a side circumferential surface located on the edge of the base body; machining a plurality of chip removal grooves which are formed at intervals inwards in the radial direction in the side circumferential surface of the base body, wherein the chip removal grooves include the first chip removal grooves and the second chip removal grooves, and the first chip removal grooves and the second chip removal grooves are formed at intervals; arranging diamond tool bits between the chip removal grooves of the base body, wherein the diamond tool bits include the first diamond tool bits and the second diamond tool bits, the first diamond tool bits and the second diamond tool bits are arranged at intervals, the surfaces of the first diamond tool bits are planes, a plurality of protruding strips are arranged on the surfaces of the second diamond tool bits, and grooves are formed between the protruding strips. The diamond saw blade can well conduct chip removal and heat dissipation in the cutting process, the good cutting performance can be kept under the condition of no cooling water grinding, and the purpose of conducting processing under extreme conditions is achieved for users.

Description

technical field [0001] The invention relates to the technical field of diamond processing tools, and more specifically, the invention relates to a preparation method of a wet and dry diamond saw blade. Background technique [0002] In today's market, diamond saw blades have been widely used in the cutting and processing of marble, granite, concrete, asphalt, ceramics, glass, jewelry and jade, semiconductors and other materials, continuously improving product efficiency and reducing material loss, especially in the processing of precious stone, jade and glass products When it comes to semiconductor materials, reducing material loss and improving economic benefits are the common pursuit of the market. The diamond saw blade is composed of two aspects: the diamond blade and the central substrate of the circular saw blade. The thickness of the central substrate of the circular saw blade determines the thickness of the diamond blade. The larger the size, the worse the economic be...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): B23D65/00
Inventor 邱瑜铭董先龙方利灵
Owner JIANGSU FENGTAI TOOLS
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