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Semi-aromatic polyamide resin composition

A polyamide resin and semi-aromatic technology, which is applied in the field of semi-aromatic polyamide resin compositions, can solve the problem of reduced smoothness of reflectors, reduced reflow resistance, and low fluidity of semi-aromatic polyamide resin compositions. problems, to achieve the effect of excellent mechanical properties and excellent reflectivity

Active Publication Date: 2017-04-26
UNITIKA LTD
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] However, since the semi-aromatic polyamide resin compositions of Patent Documents 1 and 2 have low fluidity during injection molding, there are problems such as insufficient filling of the thin wall portion during injection molding, poor mold transferability, The problem that the smoothness of the surface of the molded reflector is reduced and the reflectivity is reduced; the reflow resistance is reduced and cracks (cracks) are generated, or the problem of peeling from the transparent sealing resin

Method used

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  • Semi-aromatic polyamide resin composition
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  • Semi-aromatic polyamide resin composition

Examples

Experimental program
Comparison scheme
Effect test

Embodiment

[0081] Hereinafter, although an Example demonstrates this invention concretely, this invention is not limited to these Examples.

[0082] 1. Measurement method

[0083] (1) Relative viscosity of semi-aromatic polyamide

[0084] Using 96% by mass sulfuric acid as a solvent, it was measured at a concentration of 1 g / dL at 25°C.

[0085] (2) Melting point of semi-aromatic polyamide

[0086] Using a differential scanning calorimeter DSC-7 made by Perkin Elmer, the temperature was raised to 350°C at a heating rate of 20°C / min, then kept at 350°C for 5 minutes, cooled to 25°C at a cooling rate of 20°C / min, and then heated at 25°C. The melting point was defined as the peak top of the endothermic peak when the temperature was measured again at a temperature increase rate of 20°C / min after the temperature was maintained at 50°C for 5 minutes.

[0087] (3) Composition of semi-aromatic polyamide

[0088] With regard to semi-aromatic polyamides, conduct 1 The composition of each comp...

manufacture example 1

[0146] 4.70 kg of powdered terephthalic acid (TPA) as an aromatic dicarboxylic acid component, 0.32 kg of stearic acid (STA) with a molecular weight of 284 as a monocarboxylic acid, and 9.3 kg of sodium hypophosphite monohydrate as a polymerization catalyst g was put into a ribbon-mixing reaction device, and heated to 170°C while stirring at a rotation speed of 30 rpm under a nitrogen seal. Thereafter, while keeping the temperature at 170°C and the rotational speed at 30 rpm, 4.98 kg of 1,10-decanediamine (DDA) heated to 100°C as an aliphatic diamine component was injected for 2.5 hours using a liquid injection device. Continuous (continuous liquid injection mode) added to obtain reactants.

[0147] Afterwards, using the same reaction device, the obtained reactant was heated for 8 hours under nitrogen flow at 250°C at a rotation speed of 30rpm to polymerize. After being pulled out in a linear shape, it was cooled and solidified by a water tank, and cut with a granulator. Thus...

manufacture example 2～17

[0149] Semi-aromatic polyamide particles (P-2 to P-17) were obtained in the same manner as in Production Example 1, except that the types and compounding amounts of each component were changed to the resin compositions shown in Table 1.

[0150] Table 1 shows the compositions, melting points, and relative viscosities of the semiaromatic polyamides obtained in Production Examples 1 to 17.

[0151]

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Abstract

A semi-aromatic polyamide resin composition, characterized in that it contains 100 parts by mass of semi-aromatic polyamide (A), 10-150 parts by mass of white pigment (B), and the semi-aromatic polyamide (A) is composed of aromatic Consisting of a dicarboxylic acid component, an aliphatic diamine component, and a monocarboxylic acid component, the monocarboxylic acid component contains a monocarboxylic acid having a molecular weight of 140 or more, and its content is 1 to 8% by mass of the semi-aromatic polyamide (A) .

Description

technical field [0001] The present invention relates to a semi-aromatic polyamide resin composition excellent in heat resistance, whiteness, mechanical properties, fluidity, reflow resistance, and reflectivity. Background technique [0002] Since light-emitting diodes (LEDs) are light sources with low power consumption and long lifespan, the demand for them as lighting and display elements is rapidly expanding, and their size and power are gradually increasing. Since LEDs can efficiently use light, the reflector that also serves as a housing is an important component. The resin material constituting the reflector requires not only excellent whiteness and reflectivity, but also heat resistance (reflow resistance) that can withstand the reflow process usually performed when mounted on an electronic substrate. [0003] Semi-aromatic polyamides containing titanium oxide and calcium carbonate are known as resin materials suitable for reflectors. For example, Patent Document 1 d...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): C08L77/06C08G69/26C08K7/02H01L33/60
CPCC08G69/26C08K3/22C08K3/26C08K3/30C08K5/159C08K5/18C08K5/3417C08K5/372C08K5/524C08K7/14C08K9/06C08K13/06H01L33/60C08K2003/2224C08K2003/2241C08K2003/265C08K2003/3045C08L2201/08C08L77/06H01L2224/48091H01L2224/48247H01L2224/45144C08K3/013H01L2924/00014H01L2924/00
Inventor 椛岛洋平三井淳一甘利太阳记虎佑次
Owner UNITIKA LTD