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Photosensitive silver paste and touch screen and electronic apparatus employing photosensitive silver paste

A technology of touch screen and silver paste, which is applied in the direction of conductive materials dispersed in non-conductive inorganic materials, etc., can solve the problems of small adhesion and easy falling off, and achieve the effects of improving adhesion, reducing defects and saving costs

Inactive Publication Date: 2015-10-07
KANGZHUN ELECTRONICS TECH KUNSHAN +5
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0003] In the prior art, the conductive lines made of photosensitive silver paste can achieve a thinner effect. However, the existing photosensitive silver paste has low adhesion to substrates such as ITO and PET (polyethylene terephthalate). , easy to fall off the problem

Method used

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  • Photosensitive silver paste and touch screen and electronic apparatus employing photosensitive silver paste

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Experimental program
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Effect test

preparation example Construction

[0027] see figure 1 , the preparation method of described photosensitive silver paste, it comprises the steps:

[0028] Provide adhesion promoter, organic resin, reactive diluent, photoinitiator, solvent, and additives, and mix and stir for 4-8 hours according to the proportion to obtain a mixed solution.

[0029] The above mixed solution is placed in an environment of 100-200° C., heated and stirred for 4-8 hours until all components are fully dissolved to obtain an organic vehicle.

[0030] Add the silver powder to the above organic carrier according to a certain proportion, mix and stir for 6-10 hours to obtain a slurry.

[0031] The above slurry was ground using a three-roll mill. Adjust the roll distance to 10-150 μm, grind for 15-30 times until the fineness of the slurry is less than 5 μm, then the photosensitive silver paste is prepared, and the viscosity range of the photosensitive silver paste is 10000-50000mPa·s.

Embodiment 1

[0034] In this embodiment, the photosensitive silver paste is prepared from an organic vehicle and silver powder, wherein the mass fraction of the organic vehicle is 30%, and the mass fraction of the silver powder is 70%.

[0035] The organic carrier consists of titanate coupling agent, aromatic epoxy resin, epoxy modified acrylic resin, α-methacrylic acid, 1-hydroxycyclohexyl phenyl ketone, diethylene glycol monoethyl ether acetate, Prepared from TEGO Airex 931 (Tego additive), dioctyl phthalate, TEGO Flow 425 (Tego additive) and fumed silica. In this organic vehicle, the mass fraction of titanate coupling agent is 7%, the mass fraction of aromatic epoxy resin is 30%, the mass fraction of epoxy-modified acrylic resin is 14.5%, the mass fraction of α-methacrylic acid The fraction is 15%, the mass fraction of 1-hydroxycyclohexyl phenyl ketone is 8%, the mass fraction of diethylene glycol monoethyl ether acetate is 20%, and the mass fraction of TEGO Airex 931 (Digo additive) is ...

Embodiment 2

[0037] In this embodiment, the photosensitive silver paste is prepared from an organic vehicle and silver powder, wherein the mass fraction of the organic vehicle is 30%, and the mass fraction of the silver powder is 70%.

[0038]The organic vehicle is composed of acrylate phosphate, aromatic epoxy resin, epoxy modified acrylic resin, α-methacrylic acid, 1-hydroxycyclohexyl phenyl ketone, diethylene glycol monoethyl ether acetate, TEGO Airex 931 (Tego additive), dioctyl phthalate, TEGO Flow 425 (Tego additive) and fumed silica. In the organic vehicle, the mass fraction of phosphate acrylate is 7%, the mass fraction of aromatic epoxy resin is 30%, the mass fraction of epoxy-modified acrylic resin is 14.5%, and the mass fraction of α-methacrylic acid is 15%. %, the mass fraction of 1-hydroxycyclohexyl phenyl ketone is 8%, the mass fraction of diethylene glycol monoethyl ether acetate is 20%, the mass fraction of TEGO Airex 931 (Digo additive) is 2%, and the o The mass fraction ...

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Abstract

Provided is photosensitive silver paste, comprising an organic carrier, and aluminum powder dispersed in the organic carrier. The organic carrier comprises organic resin, an active diluent, a photoinitiator and a solvent, and also comprising an adhesion promoter which comprises one or more than one selected from the group of a phosphorus containing compound, a chromium complex coupling agent, a titanate coupling agent, and an aluminate coupling agent. The photosensitive silver paste is provided with the adhesion promoter, thereby effectively improving the adhesive force of silver paste on a substrate surface, accordingly reducing a reject ratio in the preparation of a conducting circuit by common photosensitive silver paste, increasing a yield rate, and reducing cost. In addition, the invention provides the touch screen prepared by the photosensitive silver paste, and the electronic apparatus employing the touch screen.

Description

technical field [0001] The invention relates to a photosensitive silver paste, a touch screen using the photosensitive silver paste, and an electronic device using the touch screen. Background technique [0002] In recent years, touch screens have been widely used in various electronic products, and silver paste is the most important consumable material in the production process of touch screens. When making a touch screen, the silver paste is usually printed on the blank area of ​​the touch screen by printing, and then cured to form a conductive line, so as to connect the ITO (Indium tin oxide, indium tin oxide) electrode to the outer surface. circuit. In order to reduce the amount of silver paste used, to reduce the production cost of the touch screen, and to meet the design requirements of the narrow frame of electronic products, it is necessary to make the conductive lines as thin as possible, and to make the interval between the conductive lines within the distance bet...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): H01B1/22
Inventor 张顾耀许迪孙胜延杨艳杨锦曾娟
Owner KANGZHUN ELECTRONICS TECH KUNSHAN
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