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High-viscosity low-melting-point metal conductive paste and preparation method thereof

A low-melting point metal and conductive paste technology, applied in the direction of metal/alloy conductors, cable/conductor manufacturing, circuits, etc., can solve the problems of limited conductivity, large air gap, metal overflow failure, etc., to achieve adjustable conductivity, Improvement of electrical conductivity, the effect of high electrical conductivity

Active Publication Date: 2018-05-18
BEIJING EMIKON TECH DEV
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Second, the contact surface will form an oxide film with poor conductivity in the air and adhere to the surface, increasing the resistance
The cost of changing the contact surface material is high, and the performance improvement is small; the cleaning of the oxide film on the contact surface increases the maintenance cost, and the feasibility is not high; the effect of filling the contact interface with the existing conductive paste is limited. Metals with very limited electrical conductivity
In addition, if the base material is metal, when the melting point of the metal is too high, the metal will not melt, and the seamless connection with the electronic components will not be achieved, and there will still be a large air gap, resulting in an insignificant decrease in contact resistance; When it is low, there will be a phenomenon that the metal overflows due to melting and fails

Method used

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  • High-viscosity low-melting-point metal conductive paste and preparation method thereof

Examples

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Effect test

Embodiment 1

[0027] Example 1 shows a typical application of a high-viscosity low-melting-point metal conductive paste of the present invention.

[0028] figure 1 It is a structural schematic diagram of a high-conductivity low-melting-point metal conductive paste applied to electronic components in Example 1. Among them: 1 is conductive paste, 2 is electronic components, and 3 is fastening screws.

[0029] In the high-viscosity low-melting-point metal conductive paste of this embodiment, the low-melting-point metal is gallium-indium-tin-zinc alloy (alloy mass fraction: Ga 61%, In 25%, Sn 13%, Zn 1%), and the melting point is 8°C. The metal powder is copper powder, the mass fraction accounts for 50% of the mass of the conductive paste, and the particle size is 1 μm.

[0030] When using, first apply the high-viscosity low-melting-point metal conductive paste evenly between the electronic components; then fix it tightly with screws. The conductivity and viscosity of the high-viscosity and ...

Embodiment 2

[0033] figure 1 It is a structural schematic diagram of a high-conductivity low-melting-point metal conductive paste applied to electronic components in Example 1. Among them: 1 is conductive paste, 2 is electronic components, and 3 is fastening screws.

[0034] In the high-viscosity low-melting-point metal conductive paste of this embodiment, the low-melting-point metal is gallium-indium-tin-zinc alloy (alloy mass fraction: Ga 61%, In 25%, Sn 13%, Zn 1%), and the melting point is 8°C. The metal powder is copper powder, the mass fraction accounts for 0.01% of the mass of the conductive paste, and the particle size is 1mm. When using, first apply the high-viscosity low-melting-point metal conductive paste evenly between the electronic components; then fix it tightly with screws. The conductivity and viscosity of the high-viscosity and low-melting-point metal conductive paste of the present invention can be adjusted according to different application occasions, that is, it has...

Embodiment 3

[0037] figure 1 It is a structural schematic diagram of a high-conductivity low-melting-point metal conductive paste applied to electronic components in Example 1. Among them: 1 is conductive paste, 2 is electronic components, and 3 is fastening screws.

[0038] In the high-viscosity low-melting-point metal conductive paste of this embodiment, the low-melting-point metal is gallium-indium-tin-zinc alloy (alloy mass fraction: Ga 61%, In 25%, Sn 13%, Zn 1%), and the melting point is 8°C. The metal powder is copper powder, the mass fraction accounts for 20% of the mass of the conductive paste, and the particle size is 4 μm.

[0039] When using, first apply the high-viscosity low-melting-point metal conductive paste evenly between the electronic components; then fix it tightly with screws. The conductivity and viscosity of the high-viscosity and low-melting-point metal conductive paste of the present invention can be adjusted according to different application occasions, that is...

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Abstract

The invention relates to a high-viscosity low-melting-point metal conductive paste and its preparation method and application, which is characterized in that it is obtained by uniformly mixing low-melting-point metal and metal powder in a certain ratio and method. The metal powder can increase the viscosity and electrical conductivity of the low melting point metal. The high-viscosity and low-melting-point metal conductive paste of the invention can significantly reduce the contact resistance between electronic components, thereby reducing the contact surface temperature of the electronic components and prolonging the working life of the electronic components as much as possible. The high-viscosity and low-melting-point metal conductive paste of the invention has high conductivity, remarkable conductive effect and long service life, and can be widely used in the technical fields of electric power and energy.

Description

technical field [0001] The invention provides a high-viscosity low-melting-point metal conductive paste and its preparation method and application. The high-viscosity low-melting-point metal conductive paste can significantly reduce the contact resistance between electronic components, and because of its high thermal conductivity, It can reduce the contact surface temperature of electronic components and extend the working life of electronic components as much as possible. Background technique [0002] Generally, there are two main reasons for contact resistance: first, due to the unevenness of the contact surface, the actual contact surface of the metal is reduced, and when the current flows through the conductor, the effective conductive interface of the contact surface is reduced. Second, the contact surface will form a layer of poorly conductive oxide film attached to the surface in the air, increasing the resistance. Excessive contact resistance is an important reason ...

Claims

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Application Information

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Patent Type & Authority Patents(China)
IPC IPC(8): H01B1/02H01B13/00
Inventor 郭瑞
Owner BEIJING EMIKON TECH DEV
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