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High-strength sheet aluminum oxide porous ceramic used for LED lamp heat dissipation and preparation method thereof

A flake alumina and LED lamp technology, applied in the field of porous heat-dissipating ceramics, can solve the problems such as the inability to distribute the alumina evenly, the ceramic structure is not uniform, and the compatibility is poor, so as to reduce the cracking failure problem, enhance the bonding force and conduct heat conduction. Sex-enhancing effect

Inactive Publication Date: 2015-10-28
合肥凯士新材料贸易有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

However, this method cannot disperse the alumina uniformly, it is easy to agglomerate, and the ceramic structure is not uniform, and if the ceramic sheet is applied to the LED heat sink, it is necessary to improve the toughness, thermal conductivity, crack resistance, and heat resistance of the ceramic.
The compatibility between the ceramic sheet and metal is relatively poor and needs to be improved

Method used

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Examples

Experimental program
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Embodiment Construction

[0015] A sheet-shaped alumina porous ceramic for heat dissipation of high-intensity LED lamps, made of the following raw materials in parts by weight (kg): α-Al 2 o 3 (Particle size is 2-8μm) 35, deionized water 104, sodium polyacrylate 0.3, methyl cellulose 2.2, glycerin 1.7, tetraacicular zinc oxide whisker 1.5, submicron silica gel particles 0.7, zirconium hydrogen phosphate 0.9 , Nano-pearl powder 0.5, nano-aluminum hydroxide 4.5, nano-copper 1.4, PVA binder 1.

[0016] The production method of the described high-intensity LED lamp heat dissipation flake aluminum oxide porous ceramic is characterized in that:

[0017] (1) Add α-Al 2 o 3 , deionized water, and sodium polyacrylate were mixed to obtain a suspension, and the suspension was ball-milled for 5.5 hours, adding four-needle-shaped zinc oxide whiskers, zirconium hydrogen phosphate, and submicron silica gel particles, and mixed evenly, then adding PVA binder, and mixing Evenly, then add nano-aluminum hydroxide and...

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PUM

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Abstract

High-strength sheet aluminum oxide porous ceramic used for LED lamp heat dissipation comprises, by weight, 34-36 parts of alpha-Al2O3 (the particle size is 2 micrometers-8 micrometers), 100-105 parts of deionized water, 0.2-0.3 part of sodium polyacrylate, 2-2.3 parts of methylcellulose, 1.6-1.8 parts of glycerin, 1.3-1.6 parts of tetrapod-like zinc oxide whiskers, 0.6-0.8 part of submicron silica particles, 0.8-1 part of zirconium hydrogen phosphate, 0.4-0.6 part of nanometer pearl powder, 4-5 parts of nano-aluminium hydroxide, 1.2-1.5 parts of nano-copper and 0.9-1.1 parts of PVA adhesion agents. Through using the tetrapod-like zinc oxide whiskers, the properties of strength, abrasion resistance and wave absorption and antistatic and antibacterial properties of the sheet aluminum oxide porous ceramics are improved; through using the submicron silica particles, the zirconium hydrogen phosphate and the nanometer pearl powder, the pore connectivity of the ceramic is improved, heat conduction is improved, and the binding force with metal is increased.

Description

technical field [0001] The invention relates to the field of porous heat dissipation ceramics, in particular to a sheet-shaped alumina porous ceramic for heat dissipation of high-intensity LED lamps and a preparation method thereof. Background technique [0002] Light-emitting diode (LED) is a type of light-emitting device that can directly convert electrical energy into visible light and radiant energy. It has strong market potential, and high-power LEDs are considered by the industry to be the main direction of the lighting source market1. At the current level, high-power LEDs can only convert 10% to 20% of the input power into light energy, and the remaining 80% to 90% are converted into heat energy. In order to ensure its normal operation, it is necessary to ensure that the operating temperature of the LED is within the allowable range through an effective heat dissipation design. Therefore, the heat dissipation problem of high-power LED chips has become an obstacle to ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/117C04B35/81C04B38/00
Inventor 董照海
Owner 合肥凯士新材料贸易有限公司
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