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Photosensitive polyimide composition, main agent of composition, preparation method for main agent of composition and polyimide welding-proof film prepared from composition

A technology of soluble polyimide and polyimide, applied in the field of polyimide solder mask, can solve the problems of high dielectric constant, poor flame resistance, solder resistance and mechanical properties, low hard baking temperature, etc. , to achieve good solder resistance, good pencil hardness and good flame resistance

Inactive Publication Date: 2015-11-25
TAIFLEX SCI
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0004] China Taiwan Patent Announcement No. I320514 case provides a negative-type photoresist composition, but the thin film made of the negative-type photoresist composition requires a higher hard-baking temperature (about 230° C.) , there is still the disadvantage of being difficult to develop (developing conditions: develop with ethanol solution containing TMAH for 90 seconds, then rinse with ethanol for 30 seconds)
The thin film made of this negative photoresist composition needs higher exposure energy (1000 mJ / cm2); besides, after developing, the thin film made by this negative photoresist composition With high dielectric constant and dielectric loss, it is difficult to apply to flexible circuit boards with high-density circuits
[0005] China Taiwan Patent Announcement No. I374158 case provides a photosensitive polyimide, but although it indicates that it is a photosensitive polyimide, it does not mention the relevant development conditions and electrical properties, heat resistance, flexibility and resistance. Chemical and other properties, and according to its content, it should be a film body, which needs to be pressed on the circuit board with a laminating machine when used, and there will be problems with poor lamination and storage stability.
[0006] Therefore, the prior art has not yet provided a photosensitive composition that can produce a thin film with low hard-baking temperature, low exposure energy and suitable for weak alkaline developer, so it is difficult to avoid circuit oxidation, shorten process time and protect the environment The developed film of the prior art has high dielectric constant, high dielectric loss and poor flame resistance, solder resistance and mechanical properties, so the photosensitive composition of the prior art and the film it is made of have not yet Can meet the needs of flexible circuit boards with high-density circuits

Method used

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Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0038] The preparation of the main agent of embodiment 1 photosensitive polyimide composition

[0039] First, in a 1000 ml glass reactor, 67.89 grams of long carbon chain aliphatic diamine monomer and 116.28 grams of another diamine monomer were dissolved in an aprotic solvent at 70°C to obtain A first solution; 120 grams of dianhydride monomers were dissolved in the first solution at 70° C. and stirred for 2 hours to obtain a second solution; 31.59 grams of monoacid anhydride monomers were stirred at 70° C. It was dissolved in the second solution under the condition of 2 hours to obtain a polyamic acid. In this embodiment, the long carbon chain aliphatic diamine monomer is an aliphatic diamine monomer with 36 carbons in the main carbon chain, and the other diamine monomer is methylene bis-anthranilic acid. The aprotic solvent is N-methylpyrrolidone, the dianhydride monomer is 4,4'-oxydiphthalic anhydride, the monoacid anhydride monomer is 1,2,4-benzenetricarboxylic anhydride...

Embodiment 2

[0043] The preparation of the curing agent of embodiment 2 photosensitive polyimide composition

[0044] 31.5 grams of modifying agent and 42 grams of photoinitiator were dissolved in 137 grams of N-methylpyrrolidone with a Rentaro mixer and stirred for 5 minutes to obtain a hardener. In this embodiment, the modifying agent is 1,3-phenylenebisoxazoline, and the photoinitiator is phenylbis(2,4,6-trimethylbenzyl)phosphine oxide.

Embodiment 3

[0045] Application of embodiment 3 photosensitive polyimide composition

[0046] Mix the main agent of the photosensitive polyimide composition of Example 1 and the hardener of the photosensitive polyimide composition of Example 2 in a weight ratio of 7:3 to prepare a photosensitive polyimide Ink, the photosensitive polyimide ink has a solid content of about 51% and a viscosity of about 15,000 centipoise.

[0047] In the mode of screen printing, the photosensitive polyimide ink is printed at 0.5 ounces / square foot (oz / ft 2 ) on the copper foil, let the hot air oven bake the photosensitive polyimide ink at a pre-baking temperature of 70°C for 10 minutes, and then form a photosensitive polyimide film on the copper foil, and the photosensitive polyimide ink The thickness of the polyimide film was 20 micrometers.

[0048] Lay a backsheet on the side of the photosensitive polyimide film away from the copper foil, use an unfiltered mercury arc lamp to have a temperature of 500 mil...

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Abstract

The invention discloses a photosensitive polyimide composition, a main agent of the composition, a preparation method for the main agent of the composition and a polyimide welding-proof film prepared from the composition. The photosensitive polyimide composition contains the main agent and a hardening agent containing a photoinitiator. According to the preparation method for the main agent, a long-carbon-chain aliphatic diamine monomer and a grafting monomer which has a main carbon chain with a double bond and an epoxy group at the two tail ends thereof are used. Screen printing can be performed after the main agent is mixed with the hardening agent to prepare a photosensitive polyimide film on a copper foil, and the photosensitive polyimide film can be exposed with low exposure energy and developed with a weak alkaline developer; and the polyimide welding-proof film prepared after development has a low dielectric constant, low dielectric loss, good flame resistance, good soldering resistance and good pencil hardness. Therefore, the photosensitive polyimide composition can be applied to flexible circuit boards of high-density circuits.

Description

technical field [0001] The invention relates to a photosensitive polyimide composition, especially a photosensitive polyimide composition suitable for flexible circuit boards. The present invention also relates to the main ingredient of the photosensitive polyimide composition and its preparation method. The present invention also relates to a polyimide solder mask made of the photosensitive polyimide composition. Background technique [0002] Films made of light-sensitive solder resist compositions with epoxy resin as the main agent used in general flexible circuit boards are difficult to apply to high-density circuits due to their shortcomings such as solder resistance, mechanical strength, and insufficient flame resistance. flexible circuit board. [0003] China Taiwan Patent Announcement No. I320514 provides a negative-type photosensitive composition, but the photosensitive film made of the negative-type photosensitive composition requires a higher hard-baking temperat...

Claims

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Application Information

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IPC IPC(8): C08G73/10G03F7/004
Inventor 林世昌张修明洪子景
Owner TAIFLEX SCI