Matt-white immersion-gold-resistant, anti-cracking and light-sensing solder mask material and preparation method thereof

A photosensitive solder resist and anti-cracking technology, which is applied in the anti-cracking matte white photosensitive solder resist material and its preparation, and the field of immersion gold resistance. It can solve the problems of darkening the color, insufficient temperature resistance of the resin, and sticking back when the temperature rises. The effect of heat resistance

Active Publication Date: 2015-12-09
江门市阪桥电子材料有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

In addition, some currently use polyester resin and amino resin system as the main resin, which has been improved in terms of flexibility. However, due to the insufficient temperature resistance of the resin du

Method used

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  • Matt-white immersion-gold-resistant, anti-cracking and light-sensing solder mask material and preparation method thereof

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Experimental program
Comparison scheme
Effect test

Embodiment 1

[0024] The preparation method of the main agent: every 750g of the main agent is mainly composed of acrylic acid end-blocking modified pure acrylic resin 240g, acrylic resin 160g, ITX2g, TPO10g, 8198g, dispersant 10g, DBE20g, meteorological silica 8g, barium sulfate 40g , 240g of titanium dioxide, 12g of defoamer, mixed with a high-speed disperser at a speed of 500 RMP for 40 minutes, and then used a three-roller mill with a fineness of less than 15 μm, and then filtered to remove mechanical impurities. Finally, the viscosity was adjusted to 280dpa.s, and the main ingredient was finished. ; The acrylic acid end-blocking modified pure acrylic resin is SNK-3000-A2B6.

Embodiment 2

[0026] The preparation method of the main agent: every 750g of the main agent is mainly composed of 300g of acrylic acid end-capped modified pure acrylic resin, 100g of acrylic resin, 2g of ITX, 10g of TPO, 8g of 819, 10g of dispersant, 20g of DBE, and 8g of meteorological silica , 30g of barium sulfate, 220g of titanium dioxide, and 12g of defoamer were mixed, and stirred for 40 minutes using a high-speed disperser at a speed of 500 RMP, and then used a three-roll mill with a fineness of less than 15 μm, added 30 g of matting powder, and then stirred for 40 minutes using a high-speed disperser at a speed of 500 rpm , and then filter to remove mechanical impurities, and finally adjust the viscosity to 280dpa.s, and the main ingredient is completed; the acrylic acid end-blocking modified pure acrylic resin is SNK-3000-A2B6.

Embodiment 3

[0028] The preparation method of curing agent: every 250g of curing agent is mainly composed of 40g of thermal curing resin, 8g of polyurethane acrylate, 7g of melamine, 60g of DPHA, 35g of triglycidyl isocyanurate, 90g of titanium dioxide, and 10g of DBE. Stir for 40 minutes, then use a three-roll mill to make the fineness less than 15 μm, then filter to remove mechanical impurities, and finally adjust the viscosity to 180dpa.s, and the curing agent is completed. The thermosetting resin is PNE-177.

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Abstract

The invention discloses a matt-white immersion-gold-resistant, anti-cracking and light-sensing solder mask material and a preparation method thereof. The matt-white immersion-gold-resistant, anti-cracking and light-sensing solder mask material mainly comprises a main agent and a curing agent, wherein the main agent comprises acrylic resin with a special function, acrylic resin, a photoinitiator, a dispersing agent, dibasic ester, fumed silica, barium sulfate, titanium dioxide and an antifoaming agent; the curing agent comprises thermocuring resin, a curing additive, melamine, a photocuring monomer, triglycidyl isocyanurate, titanium dioxide and dibasic ester. The prepared matt-white light-sensing solder mask material has high immersion gold resistance and yellowing resistance, and is more stable and reliable during normal technology use of a PCB (printed circuit board).

Description

technical field [0001] The invention relates to the technical field of precision circuit boards, in particular to an anti-immersion gold, anti-cracking matte white photosensitive solder resist material and a preparation method thereof. Background technique [0002] With the rapid development of the international IT industry, LCD-related industries continue to introduce new ones, and the size of LCD products is developing in the direction of diversification and portability. portability. [0003] The backlight is a light source located behind the liquid crystal display (LCD), and its luminous effect will directly affect the visual effect of the liquid crystal display module (LCM). The traditional LED light strip is composed of a flexible flexible circuit board substrate, hot-pressed with a layer of white covering film on the front and back, or directly coated with white solder resist material. In addition to the functions of insulation, solder resistance, and circuit protect...

Claims

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Application Information

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IPC IPC(8): G03F7/027G03F7/004
Inventor 周中涛
Owner 江门市阪桥电子材料有限公司
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