Unlock instant, AI-driven research and patent intelligence for your innovation.

Encapsulating Dielectric Paste for Base Metal Electronic Paste and Its Application

A technology of dielectric paste and electronic paste, which is applied in the direction of metal oxides, circuits, electrical components, etc., can solve the problems that base metal electronic paste cannot be applied, and achieve the effect of great practical value and important significance

Inactive Publication Date: 2019-01-18
KUNMING GUIXINKAI TECH CO LTD
View PDF7 Cites 0 Cited by
  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

Solve the technical problem that the base metal electronic paste cannot be applied in the existing thick film circuit due to the lack of suitable encapsulation medium

Method used

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
View more

Image

Smart Image Click on the blue labels to locate them in the text.
Viewing Examples
Smart Image
  • Encapsulating Dielectric Paste for Base Metal Electronic Paste and Its Application
  • Encapsulating Dielectric Paste for Base Metal Electronic Paste and Its Application
  • Encapsulating Dielectric Paste for Base Metal Electronic Paste and Its Application

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0040] After mixing 50 grams of vanadium-boron-silicate glass and 5 grams of bismuth oxide evenly, put it into a silicon carbide rod furnace and raise the temperature to 900°C with the furnace, keep it warm for 20 minutes, water quenching, and ball milling into a functional phase powder of 0.1-3.0 μm body.

[0041] Take 65 grams of functional phase powder, 10 grams of iron oxide, and 5 grams of lithium oxide, mix evenly, add 20 grams of organic carrier and roll on a three-roll rolling mill to obtain encapsulating medium slurry. An encapsulation medium slurry mixture comprising 65% of functional phase, 10% of colored phase, 5% of oxide and 20% of organic vehicle was obtained by weight percentage.

[0042] The organic carrier is a mixture comprising gum arabic, polyoxyethylene alcohol and glycerol aqueous solution; wherein, the mass ratio of gum arabic, polyoxyethylene alcohol and glycerin aqueous solution is 1:2:3; the mass concentration of glycerol aqueous solution is 0.8%. ...

Embodiment 2

[0045]Mix 500 grams of zirconium-boron-silicate glass with 200 grams of bismuth oxide and 50 grams of barium oxide evenly, put it into a silicon carbide rod furnace and heat it up to 1000°C with the furnace, keep it warm for 30 minutes, water quench, and ball mill to a temperature of 0.1~ 3.0μm functional phase powder.

[0046] Take 650 grams of functional phase powder, 50 grams of cobalt sulfate, and 50 grams of phosphorus oxide, mix well, add 250 grams of organic carrier and roll on a three-roll mill to obtain an encapsulating medium slurry. An encapsulation medium slurry comprising a mixture of 65% of the functional phase, 5% of the colored phase, 5% of the oxide and 25% of the organic vehicle by weight percentage was obtained.

[0047] The organic carrier is a mixture comprising gum arabic, polyoxyethylene alcohol and glycerol aqueous solution; wherein, the mass ratio of gum arabic, polyoxyethylene alcohol and glycerin aqueous solution is 1:2:3; the mass concentration of g...

Embodiment 3

[0050] Mix 500 grams of aluminum-boron-silicate glass with 200 grams of bismuth oxide and 50 grams of barium chloride evenly, put it into a silicon carbide rod furnace and heat it up to 1000 ° C with the furnace, keep it warm for 30 minutes, water quench, and ball mill to 0.1 ~3.0μm functional phase powder.

[0051] Take 650 grams of functional phase powder, 50 grams of vanadium oxide, and 50 grams of phosphorus oxide, mix them evenly, add 250 grams of organic carrier and roll on a three-roll rolling mill to obtain an encapsulating medium slurry. An encapsulation medium slurry comprising a mixture of 65% of the functional phase, 5% of the colored phase, 5% of the oxide and 25% of the organic vehicle by weight percentage was obtained.

[0052] The organic carrier is a mixture comprising gum arabic, polyoxyethylene alcohol and glycerol aqueous solution; wherein, the mass ratio of gum arabic, polyoxyethylene alcohol and glycerin aqueous solution is 1:2:3; the mass concentration o...

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

PUM

PropertyMeasurementUnit
particle diameteraaaaaaaaaa
viscosityaaaaaaaaaa
viscosityaaaaaaaaaa
Login to View More

Abstract

The invention provides a packaging medium slurry for a base-metal-contained electronic slurry and application thereof. The packaging medium slurry being a mixture comprises a functional phase, a coloring phase, oxide, and an organic vehicle. The functional phase is obtained by carrying out heat treatment on a mixture of glass powder and a compound; and the compound is a barium compound or bismuth compound. The packaging medium slurry can be used as a packaging medium slurry in a thick-film circuit employing a base-metal-contained electronic slurry. The packaging medium slurry can be applied to the thick-film circuit employing a base-metal-contained electronic slurry to protect the base-metal-contained electronic slurry, especially a copper conductor slurry. The packaging medium slurry can be sintered at a protective atmosphere; no adverse reaction is caused during the sintering processing; and a stable, smooth, and flat insulated protection film can be formed. The insulated protection film has advantages of good anti-corrosion, anti-oxidation, and anti-mechanical-damage performances and the electrical performance of the device is not influenced.

Description

technical field [0001] The invention relates to the technical field of encapsulation medium slurry, in particular to an encapsulation medium slurry for base metal electronic paste and application thereof. Background technique [0002] Encapsulating dielectric paste is mainly attached to conductors and resistors to prevent harmful effects of the external environment. It plays the role of stabilizing the electrical properties of conductors and resistors, protecting them from external corrosive substances, preventing mechanical damage, and forming an insulating layer with other conductors. [0003] Electronic paste has been widely used in capacitors, potentiometers, thick film hybrid integrated circuits, sensitive components, surface mount technology and other fields in the electronics industry. In thick film circuits, the conductor paste is mostly gold, silver and other precious metals. Among them, silver conductor paste is the most widely used. The performance of precious m...

Claims

the structure of the environmentally friendly knitted fabric provided by the present invention; figure 2 Flow chart of the yarn wrapping machine for environmentally friendly knitted fabrics and storage devices; image 3 Is the parameter map of the yarn covering machine
Login to View More

Application Information

Patent Timeline
no application Login to View More
Patent Type & Authority Patents(China)
IPC IPC(8): H01B3/00H01B3/08H01B3/10H01B3/30
Inventor 朱晓云许寿荣朱梓瑜
Owner KUNMING GUIXINKAI TECH CO LTD