Low-hygroscopicity anti-ageing epoxy-resin-based package adhesive

Abstract

A disclosed low-hygroscopicity anti-ageing epoxy-resin-based package adhesive comprises the following raw materials in parts by weight: 56-85 parts of hydrogenated bisphenol A epoxy resin, 3-10 parts of nylon 610, 2-8 parts of poly(4-methyl-1-pentene), 1-5 parts of hydroxyl silicone oil, 2-6 parts of vinyl versatate, 1-3 parts of zirconia, 1-4 parts of magnesium oxide, 2-5 parts of 2-hydroxy-4-n-octoxybenzophenone, 3-8 parts of maleic anhydride graft polypropylene, 9-20 parts of a curing agent, and 2-8 parts of a curing accelerator. The invention also discloses a preparation technology for the low-hygroscopicity anti-ageing epoxy-resin-based package adhesive. The prepared epoxy-resin-based package adhesive is relatively low in water absorption rate, shows good anti-ageing property through the relatively low 1000 h yellowness index, also possesses good light transmittance, is applicable as an electronic packaging material and especially applicable as an LED packaging material.

Description

technical field [0001] The invention belongs to the field of packaging materials, and in particular relates to a low-hygroscopic anti-aging epoxy resin-based packaging glue and a preparation process thereof. Background technique [0002] Packaging material is one of the important components of LED components. Its main function is to seal and protect the chip, to prevent the chip from being affected by the temperature and humidity in the surrounding environment, and to prevent the chip from being affected by external mechanical vibration and impact. destroy. The packaging materials used today include transparent materials such as epoxy resin, polycarbonate, glass, and silicone. Among them, epoxy resin has become one of the main packaging materials due to its good connectivity, sealing, electrical insulation, low production cost, and easy processing and molding. However, the epoxy resin material itself has strong hygroscopicity, and it is difficult for packaging to resist ex...

AI Technical Summary

Problems solved by technology

However, the epoxy resin material itself has strong hygroscopicity, and it is difficult for packaging to resist external erosion for a long time and maintain good electrical insulation

In addition, since the chip in the LED component will continuously emit ultraviolet light, the packaging material is also prone to yellowing after long-term exposure to ultraviolet light, resulting in a decrease in the light transmittance of the packaging material, thereby reducing the luminous efficiency and luminous brightness of the LED. Therefore, it is particularly important to improve the hygroscopicity and aging resistance of epoxy resin-based packaging materials.

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