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Aluminum nitride reinforced graphite-based composite material and preparation process thereof

A composite material and a preparation process technology, applied in the field of ceramic reinforced graphite matrix composite material and preparation, can solve the problems of large thermal expansion coefficient, low strength, low thermal expansion coefficient along the graphite sheet thermal conductivity, etc. The effect of high thermal conductivity

Active Publication Date: 2016-01-13
咸阳瞪羚谷新材料科技有限公司
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  • Summary
  • Abstract
  • Description
  • Claims
  • Application Information

AI Technical Summary

Problems solved by technology

[0006] Aiming at the disadvantages of low strength and large thermal expansion coefficient of existing highly oriented graphite single-phase bulk materials, the purpose of the present invention is to provide a ceramic-reinforced graphite-based composite material and a rapid preparation method. The obtained material has an anisotropic structure, and Integrating light weight, high strength, high thermal conductivity along the graphite sheet, and low thermal expansion coefficient perpendicular to the graphite sheet, etc.

Method used

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  • Aluminum nitride reinforced graphite-based composite material and preparation process thereof
  • Aluminum nitride reinforced graphite-based composite material and preparation process thereof
  • Aluminum nitride reinforced graphite-based composite material and preparation process thereof

Examples

Experimental program
Comparison scheme
Effect test

Embodiment 1

[0027] Weigh flake graphite powder and aluminum nitride powder with a mass ratio of 85:10, add 3% yttrium oxide and 2% alumina as sintering aids in the total mass ratio, and use absolute ethanol as the ball milling medium Mixing was carried out on a drum-type ball mill with a rotational speed of 100r / min. The mass ratio of alumina balls to powder (ball-to-material ratio) was 4:1. After ball milling for 12 hours, it was dried and sieved to obtain a uniformly mixed composite powder. Take part of the composite powder and put it into a graphite mold. The upper and lower indenters and the inner wall of the mold are pre-laid with a layer of graphite paper, which is pre-pressed and formed into a sample, and then the graphite mold is placed in the figure 1 spark plasma sintering furnace. The furnace cavity is evacuated to form a vacuum chamber with an internal pressure of less than 6Pa. Apply an axial pressure of 50 MPa to the graphite mold through the loading system. At the beginn...

Embodiment 2

[0030] The process of this example is the same as that of Example 1, except that some process parameters are changed: the mass ratio of flake graphite powder to aluminum nitride powder is 75:20; the final sintering temperature is 1650°C.

[0031] Carry out the performance test identical with example 1 to present embodiment sintered sample, the result is as follows: density reaches 2.31g / cm 3 , the relative density reaches 93.9%, and the apparent porosity is 2.73%. Form a three-dimensional network ceramic skeleton and figure 2 Similar; microstructure and image 3 Similar; the strength perpendicular to the direction of the graphite sheet reaches 89.82MPa. At a temperature of 300K, its thermal conductivity along the lamellar direction is 158.25W / (m·K), and it is 12.56W / (m·K) perpendicular to the lamellar direction.

Embodiment 3

[0033] The process of this example is the same as that of Example 1, except that some process parameters are changed: the mass ratio of flake graphite powder to aluminum nitride powder is 65:30, and the final sintering temperature is 1550°C.

[0034] Carry out the performance test identical with example 1 to present embodiment sintered sample, the result is as follows: density reaches 2.41g / cm 3 , the relative density reaches 94.8%, and the apparent porosity is 1.60%. Form a three-dimensional network ceramic skeleton and figure 2 Similar; microstructure and image 3 similar. The strength of the composite material perpendicular to the direction of the graphite sheet reaches 96.59MPa. At a temperature of 300K, its thermal conductivity along the lamellar direction is 157.98W / (m·K), and it is 20.99W / (m·K) perpendicular to the lamellar direction.

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Abstract

The present invention discloses an aluminum nitride reinforced graphite-based composite material and a preparation process thereof. The aluminum nitride reinforced graphite-based composite material is characterized in that flake graphite is adopted as a substrate, and aluminum nitride is adopted as a reinforcing phase and is uniformly distributed between the graphite laminas so as to form a three-dimensional network nitrogen aluminum skeleton and directionally-arranged graphite lamina combined anisotropic structure. According to the process, flake graphite particles, aluminum nitride powder and an appropriate amount of a sintering aid are used, material mixing is performed through a ball mill, drying screening is performed, pre-pressing molding is performed, discharge plasma sintering is performed at a temperature of 1500-1700 DEG C, axial pressure is applied during the sintering process to make the graphite laminas be directionally arranged, and the three-dimensional network ceramic skeleton is formed after sintering the aluminum nitride powder, such that the strength of the graphite substrate can be significantly increased, and the thermal expansion of the graphite can be restrained so as to form the compact and uniform anisotropic composite material with characteristics of high thermal conductivity along the lamina direction and low thermal expansion along the vertical lamina direction, wherein the excellent comprehensive performance of the composite material has wide application prospects in the field of heat transfer, heat dissipating and the like of electronic devices.

Description

technical field [0001] The invention relates to the technology of heat management materials (heat conduction and heat dissipation materials), in particular to a ceramic reinforced graphite-based composite material with anisotropic structure and a preparation method thereof. Background technique [0002] With the rapid development of modern science and technology, the design and production of high-power electronic instruments, equipment, and components tend to be miniaturized, lightweight, compact, and efficient. In particular, the development of ultra-large-scale integrated circuits has made the power density of electronic devices higher and higher, resulting in a large amount of heat generated during the working process. If the heat is not removed in time, it will seriously affect the stability and safety of electronic devices or components. Reliability, and significantly reduce its working efficiency and service life. Therefore, the selection and performance optimization ...

Claims

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Application Information

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Patent Type & Authority Applications(China)
IPC IPC(8): C04B35/52C04B35/64
Inventor 史忠旗张夏张晓钰夏鸿雁王继平王波王红洁杨建锋
Owner 咸阳瞪羚谷新材料科技有限公司
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